KR910012803A - 유체 가압에 의해 기포가 없는 필름/액체 솔더 마스크-도포된 인쇄 회로판 - Google Patents

유체 가압에 의해 기포가 없는 필름/액체 솔더 마스크-도포된 인쇄 회로판

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Publication number
KR910012803A
KR910012803A KR1019890019278A KR890019278A KR910012803A KR 910012803 A KR910012803 A KR 910012803A KR 1019890019278 A KR1019890019278 A KR 1019890019278A KR 890019278 A KR890019278 A KR 890019278A KR 910012803 A KR910012803 A KR 910012803A
Authority
KR
South Korea
Prior art keywords
layer
liquid
support
fluid
photopolymerizable
Prior art date
Application number
KR1019890019278A
Other languages
English (en)
Inventor
카알스타우트 게리
Original Assignee
제임즈 제이 플린
이 아이 듀우판 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제임즈 제이 플린, 이 아이 듀우판 디 네모아 앤드 캄파니 filed Critical 제임즈 제이 플린
Publication of KR910012803A publication Critical patent/KR910012803A/ko

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/074—Features related to the fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

내용 없음

Description

유체 가압에 의해 기포가 없는 필름/액체 솔더 마스크-도포된 인쇄 회로판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (19)

  1. (a)적어도 하나의 액체층을 지지체 표면에 적용하고, (b)액체층의 지지체와 건조필름층의 중간에 위치하는, 지지체 상에 건조 필름 광중합성 층을 적용하여 적층판을 형성하도록 하고, (c)적어도 주위압력 보다 0.3이상 높은 균일한 상승 대기압을 가압된 유체에 의해 적층판에 균일하게 적용하여 액체층 또는 그의 개면에 폐입된 모든 기포 또는 기공을 제거하고, (d)균일한 상승 압력을 방출하는 단계로 구성된, 건조 필름 광중합성층과 지지체표면 사이에 액체 중간층을 사용하여 본질적으로 기포가 없는 적층판을 얻는 방법.
  2. 제1항에 있어서, 상승된 압력이 주위보다 적어도 3 이상의 높은 대기압인 방법.
  3. 제1항에 있어서, 지지체와 건조 필름층을 둘러싸는 압력실이 사용되는 방법.
  4. 제1항에 있어서, 유체가 가스인 방법.
  5. 제4항에 있어서, 유체가 공기인 방법.
  6. 제1항에 있어서,유체가 건조필름을 접촉하는 방법.
  7. 제1항에 있어서, 지지체가 상승된 부조를 갖는 방법.
  8. 제1항에 있어서, 필름이 화학선에 영상적으로 노출되는 방법.
  9. 제1항에 있어서, 액체가 필수적으로 적어도 하나의 비사스상 불포화 화합물로 되어 있는 방법.
  10. 제1항에 있어서, 액체가 감광성인 방법.
  11. 제1항에 있어서, 액체가 광중합성인 방법.
  12. 제1항에 있어서, 하부 피복이 필름층의 일부로 존재하고 필름층과 액체 사이에 존재하는 방법.
  13. 제1항에 있어서, 유체가 가압화 액체인 방법.
  14. 제13항에 있어서, 가압화 유체가 물인 방법.
  15. 제1항에 있어서, 건조필름 광중합성층이, 광중합성층에 벗겨지게 접착된 지지층을 갖는 방법.
  16. 제15항에 있어서, 광중합성층이 성분층의 적어도 하나가 광중합성인 두개 이상의 성분층들로 구성된 방법.
  17. 제1항에 있어서, 가압된 유체가 주위온도에서 적용되는 방법.
  18. 제1항에 있어서, 가압된 유체가 약 1분-약 10분 동안 적용되는 방법.
  19. 제1항에 있어서, 가압된 유체가 약 1분이하 동안 적용되는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890019278A 1988-12-23 1989-12-22 유체 가압에 의해 기포가 없는 필름/액체 솔더 마스크-도포된 인쇄 회로판 KR910012803A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US289120 1981-08-03
US28912088A 1988-12-23 1988-12-23

Publications (1)

Publication Number Publication Date
KR910012803A true KR910012803A (ko) 1991-08-08

Family

ID=23110144

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890019278A KR910012803A (ko) 1988-12-23 1989-12-22 유체 가압에 의해 기포가 없는 필름/액체 솔더 마스크-도포된 인쇄 회로판

Country Status (5)

Country Link
EP (1) EP0374809A3 (ko)
JP (1) JPH02226153A (ko)
KR (1) KR910012803A (ko)
CN (1) CN1043799A (ko)
CA (1) CA2006211A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102167773B1 (ko) 2019-06-17 2020-10-19 류동일 용기 표면연마장치

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4914297A (en) * 1996-11-08 1998-05-29 W.L. Gore & Associates, Inc. Method of applying dry film photoresist
CN100379324C (zh) * 2005-01-10 2008-04-02 安捷利（番禺）电子实业有限公司 挠性印制电路的湿法贴膜方法
CN102256446A (zh) * 2011-07-29 2011-11-23 江西鑫力华数码科技有限公司 柔性线路板的压膜方法
JP6809873B2 (ja) * 2015-12-28 2021-01-06 旭化成株式会社 積層体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB898871A (en) * 1959-07-20 1962-06-14 Koch Processes Ltd Improvements in or relating to printing
US3629036A (en) * 1969-02-14 1971-12-21 Shipley Co The method coating of photoresist on circuit boards
GB1508129A (en) * 1975-10-20 1978-04-19 Microwave & Electronic Syst Application of photosensitive material to an article
JPS59206200A (ja) * 1983-05-06 1984-11-21 Mitsubishi Monsanto Chem Co 積層体製造用金型及び積層体の製造方法
JPH0677988B2 (ja) * 1986-01-23 1994-10-05 大日本印刷株式会社 ポリエステル化粧板の製造方法および製造装置
JPS62176572A (ja) * 1986-01-31 1987-08-03 Toshiba Corp 塗膜形成装置
US4698294A (en) * 1986-09-12 1987-10-06 E. I. Du Pont De Nemours And Company Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102167773B1 (ko) 2019-06-17 2020-10-19 류동일 용기 표면연마장치

Also Published As

Publication number Publication date
EP0374809A3 (en) 1991-11-13
JPH02226153A (ja) 1990-09-07
CA2006211A1 (en) 1990-06-23
EP0374809A2 (en) 1990-06-27
CN1043799A (zh) 1990-07-11

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