AU4914297A - Method of applying dry film photoresist - Google Patents

Method of applying dry film photoresist

Info

Publication number
AU4914297A
AU4914297A AU49142/97A AU4914297A AU4914297A AU 4914297 A AU4914297 A AU 4914297A AU 49142/97 A AU49142/97 A AU 49142/97A AU 4914297 A AU4914297 A AU 4914297A AU 4914297 A AU4914297 A AU 4914297A
Authority
AU
Australia
Prior art keywords
dry film
film photoresist
applying dry
applying
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU49142/97A
Inventor
Randy E. Haslow
Donald G. Hutchins
Michael R. Leaf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates Inc
Original Assignee
WL Gore and Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WL Gore and Associates Inc filed Critical WL Gore and Associates Inc
Publication of AU4914297A publication Critical patent/AU4914297A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
AU49142/97A 1996-11-08 1997-10-22 Method of applying dry film photoresist Abandoned AU4914297A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74597996A 1996-11-08 1996-11-08
US08745979 1996-11-08
PCT/US1997/019103 WO1998020395A1 (en) 1996-11-08 1997-10-22 Method of applying dry film photoresist

Publications (1)

Publication Number Publication Date
AU4914297A true AU4914297A (en) 1998-05-29

Family

ID=24999032

Family Applications (1)

Application Number Title Priority Date Filing Date
AU49142/97A Abandoned AU4914297A (en) 1996-11-08 1997-10-22 Method of applying dry film photoresist

Country Status (2)

Country Link
AU (1) AU4914297A (en)
WO (1) WO1998020395A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299721B1 (en) 1998-12-14 2001-10-09 Gould Electronics Incl Coatings for improved resin dust resistance
CN114045492B (en) * 2021-12-28 2024-02-27 金宏气体股份有限公司 Interface treatment process for electronic grade carbonyl sulfide storage container and application

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218098B2 (en) * 1973-05-04 1977-05-19
GB1488350A (en) * 1973-12-27 1977-10-12 Fuji Photo Film Co Ltd Photosensitive planographic printing plates
JPS6148831A (en) * 1984-08-10 1986-03-10 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Photosetting structural body
EP0259853A3 (en) * 1986-09-12 1989-11-08 E.I. Du Pont De Nemours And Company Lamination of photopolymerizable film onto a substrate employing an intermediate photosensitive layer
EP0374809A3 (en) * 1988-12-23 1991-11-13 E.I. Du Pont De Nemours And Company Bubble free film/liquid solder mask-coated printed circuit boards by fluid pressurizing
US5429673A (en) * 1993-10-01 1995-07-04 Silicon Resources, Inc. Binary vapor adhesion promoters and methods of using the same

Also Published As

Publication number Publication date
WO1998020395A1 (en) 1998-05-14

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