KR880001185A - 인쇄회로 기판에 명칭을 제공하는 방법. - Google Patents

인쇄회로 기판에 명칭을 제공하는 방법. Download PDF

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Publication number
KR880001185A
KR880001185A KR1019870006468A KR870006468A KR880001185A KR 880001185 A KR880001185 A KR 880001185A KR 1019870006468 A KR1019870006468 A KR 1019870006468A KR 870006468 A KR870006468 A KR 870006468A KR 880001185 A KR880001185 A KR 880001185A
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KR
South Korea
Prior art keywords
substrate
cover sheet
layer
exposed
adhesive layer
Prior art date
Application number
KR1019870006468A
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English (en)
Other versions
KR900003846B1 (ko
Inventor
월터 테일러 쥬니어 하아비
Original Assignee
프랭크 아아르 오어토라니
이 아이 듀우판 디 네모아 앤드 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 프랭크 아아르 오어토라니, 이 아이 듀우판 디 네모아 앤드 컴파니 filed Critical 프랭크 아아르 오어토라니
Publication of KR880001185A publication Critical patent/KR880001185A/ko
Application granted granted Critical
Publication of KR900003846B1 publication Critical patent/KR900003846B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

내용 없음

Description

인쇄회로 기판에 명칭을 제공하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 하기(a) - (d)의 단계로 구성되는 방법에 있어서, 기판은 전기전도영역과 전기 절연 영역을 가진 솟은 릴리이프를 가진 인쇄 회로기판이며, 상기(c)의 접착단계로 기판의 앞뒤면이 일치되며, 기판표면위에 있는 전도 영역의 적어도 한 부분은 부재(i)이나 (ii)중 하나로 덮여지지 않는 것을 특징으로하며, d)단계 이후에 하기 e) -h)로 구성되는 것을 특징으로 하는 인쇄 회로판에 명칭을 만드는 방법 : a) 위층에서 아래층의 순서로 1) 화학광선에 대해 투명한 중합필름으로 이루어진 벗겨낼 수 있는 커버시이트, 2) 착색제를 함유하며 에틸렌형 불포화나 벤조 페논형 기들을 갖는 광경화성 물질로 이루어진 광접착층, 3) 비감광성 유기 연속층 및 (연속층(3)으로부터 그 위의 노출된 광접착층(2)을 갖는 커버시이트(11)를 제거하는 데 요구되는 박리력은 비노출 광접착층(2)에서 커버시이트(1)를 제거하는데 요구되는 박리력의 4배 이상) 4) 시이트 지지체로 이루어진 박리 감광성 부재를 투명도를 갖는 상을 통해 노출시키고, b)노출된 감광성 부재를 박리시켜 i) 그 표면에 착색된 노출상 영역을 함유한 커버시이트, 와 ii) 그 표면에 보충적으로 착색된 비노출상 영역을 함유한 시이트 지지체의 두 부재를 형성하고, c)연속층이나 커버시이트에 대한 광접착층에 대한 접착층의 접착력 보다 광접착층에 대한 접착력이 더 큰 정도로, 기판의 표면에 상기 부재(i)이나 (ii)중 하나를 접착시키고, d) 부재 (i)의 커버시이트나 시이트 지지체 및 부재(ii)의 연속층을 분라하고, e) 기판의 표면에 접착되는 부재(i)이나 (ii)를 경화시키고, f) 기판의 표면에 용융 납땜을 적용하고, g) 융제 첨가된 기판에 용융 납땜을 적용함으로써 전기 전도 영역은 납땜의 접착영역을 갖고, h) 기판으로부터 과량의 융제 잔류물을 제거한다.
  2. 제1항에 있어서, 영구 코오팅이 전기 전도영역과 절연 영역을 함유하는 기판의 적어도 한 부분위에 있는 방법.
  3. 제2항에 있어서, 영구 코오팅이 납땜 마스크인 방법.
  4. 제1항에 있어서, 접착단계(c)와 경화단계(d)를 동시에 실시하는 방법.
  5. 제3항에 있어서, 접착단계(c)와 경화단계(d)를 동시에 실시하는 방법.
  6. 제1항 있어서, 단계(a)에서 박리부재를 네가티브 투명도를 통해 노출시키고 : 단계(c)에서 부재(i)를 기판의 표면에 접착시키며 : 단계(d)에서 부재(i)의 커버시이트를 분리하는 방법.
  7. 제1항에 있어서, 단계(a)에서 박리부재를 포지티브 투명도를 통해 노출시키고 : 단계(c)에서 부재(ii)를 기판의 표면에 접착시키며 : 단계(d)에서 시이트지지체와 연속상을 분리하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870006468A 1986-06-26 1987-06-25 인쇄회로기판에 명칭을 제공하는 방법 KR900003846B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/878,608 US4668603A (en) 1986-06-26 1986-06-26 Method of making raised relief circuit board with soldered connections having nomenclature applied thereto
US878608 1992-05-05

Publications (2)

Publication Number Publication Date
KR880001185A true KR880001185A (ko) 1988-03-31
KR900003846B1 KR900003846B1 (ko) 1990-06-02

Family

ID=25372387

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870006468A KR900003846B1 (ko) 1986-06-26 1987-06-25 인쇄회로기판에 명칭을 제공하는 방법

Country Status (7)

Country Link
US (1) US4668603A (ko)
EP (1) EP0251191A3 (ko)
JP (1) JPS637694A (ko)
KR (1) KR900003846B1 (ko)
CN (1) CN1010274B (ko)
BR (1) BR8703165A (ko)
CA (1) CA1247751A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0346522A3 (en) * 1988-06-16 1991-04-03 Nippon CMK Corp. Printed wiring board
US5049476A (en) * 1988-07-18 1991-09-17 Hoechst Celanese Corporation Photopolymerizable, positive working, peel developable, single sheet color proofing system
US5236806A (en) * 1988-07-18 1993-08-17 Hoechst Celanese Corporation Photopolymerizable, positive working, peel developable, single sheet color proofing system
DE4125723A1 (de) * 1991-08-02 1993-02-04 Hoechst Ag Verfahren zur herstellung eines mehrfarbenbilds und lichtempfindliches material zur durchfuehrung dieses verfahrens
US5633117A (en) * 1995-04-27 1997-05-27 Imation Corp. Providing imagewise variation in glossiness to a receptor
EP1267350A3 (en) 1996-08-23 2009-04-01 FUJIFILM Corporation Index card for disk cartridge storage
US8288266B2 (en) * 2006-08-08 2012-10-16 Endicott Interconnect Technologies, Inc. Circuitized substrate assembly
US20080121413A1 (en) * 2006-11-27 2008-05-29 Cardona Sergio E Method for manufacturing printed circuit boards

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649268A (en) * 1969-02-05 1972-03-14 Du Pont Process for forming images by photohardening and applying a colorant
IL45626A (en) * 1973-10-09 1976-10-31 Hughes Aircraft Co Hybrid microcircuit fabrication aid
US4282308A (en) * 1975-06-03 1981-08-04 E. I. Du Pont De Nemours And Company Negative-working multilayer photosensitive element
DE3139670A1 (de) * 1981-10-06 1983-04-21 Robert Bosch Gmbh, 7000 Stuttgart Elektronische duennschichtschaltung und deren herstellungsverfahren
US4572886A (en) * 1983-11-03 1986-02-25 Texas Instruments Incorporated Optical method for integrated circuit bar identification
US4489154A (en) * 1983-12-22 1984-12-18 E. I. Du Pont De Nemours And Company Process for preparing a surprint proof
DE3412992A1 (de) * 1984-04-06 1985-10-24 Hoechst Ag, 6230 Frankfurt Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht

Also Published As

Publication number Publication date
EP0251191A2 (en) 1988-01-07
CN87104516A (zh) 1988-01-27
CA1247751A (en) 1988-12-28
CN1010274B (zh) 1990-10-31
JPS637694A (ja) 1988-01-13
US4668603A (en) 1987-05-26
BR8703165A (pt) 1988-03-08
KR900003846B1 (ko) 1990-06-02
EP0251191A3 (en) 1989-09-06

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