BR8702714A - Composicao fotossensivel e processo para laminar uma pelicula fotossensivel a um substrato - Google Patents

Composicao fotossensivel e processo para laminar uma pelicula fotossensivel a um substrato

Info

Publication number
BR8702714A
BR8702714A BR8702714A BR8702714A BR8702714A BR 8702714 A BR8702714 A BR 8702714A BR 8702714 A BR8702714 A BR 8702714A BR 8702714 A BR8702714 A BR 8702714A BR 8702714 A BR8702714 A BR 8702714A
Authority
BR
Brazil
Prior art keywords
photosensitive
laminate
substrate
photosensitive composition
film
Prior art date
Application number
BR8702714A
Other languages
English (en)
Inventor
Gregory Charles Weed
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BR8702714A publication Critical patent/BR8702714A/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BR8702714A 1986-05-28 1987-05-27 Composicao fotossensivel e processo para laminar uma pelicula fotossensivel a um substrato BR8702714A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/867,431 US4680249A (en) 1986-05-28 1986-05-28 Photopolymerizable composition containing carboxy benzotriazole

Publications (1)

Publication Number Publication Date
BR8702714A true BR8702714A (pt) 1988-03-01

Family

ID=25349761

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8702714A BR8702714A (pt) 1986-05-28 1987-05-27 Composicao fotossensivel e processo para laminar uma pelicula fotossensivel a um substrato

Country Status (8)

Country Link
US (2) US4680249A (pt)
EP (1) EP0247549B1 (pt)
JP (1) JPS6324243A (pt)
KR (1) KR910001589B1 (pt)
CN (1) CN87103854A (pt)
BR (1) BR8702714A (pt)
CA (1) CA1295166C (pt)
DE (1) DE3774763D1 (pt)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234984A (ja) * 1988-04-13 1990-02-05 Mitsubishi Electric Corp プリント回路基板の製造方法
JP2733672B2 (ja) * 1988-10-24 1998-03-30 東京応化工業株式会社 光重合性樹脂組成物
US4942248A (en) * 1988-12-01 1990-07-17 Ppg Industries, Inc. Tertiary-alkyl esters of 1H-benzotriazole-1-carboxylic acids
JPH03179356A (ja) * 1989-05-18 1991-08-05 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性樹脂組成物積層体
JPH0351853A (ja) * 1989-07-19 1991-03-06 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性積層体
DE3926708A1 (de) * 1989-08-12 1991-02-14 Basf Ag Photopolymerisierbares schichtuebertragungsmaterial
US5204390A (en) * 1989-09-08 1993-04-20 H.B. Fuller Company Hot melt adhesive resistant to ultraviolet light-induced degradation and to plasticizer migration
JPH0511439A (ja) * 1990-09-13 1993-01-22 Fuji Photo Film Co Ltd 光重合性組成物
US5403698A (en) * 1990-10-16 1995-04-04 Hitachi Chemical Company, Ltd. Negative type photosensitive electrodepositing resin composition
US5314789A (en) * 1991-10-01 1994-05-24 Shipley Company Inc. Method of forming a relief image comprising amphoteric compositions
US5240817A (en) * 1991-12-20 1993-08-31 E. I. Du Pont De Nemours And Company Lamination of a photopolymerizable solder mask layer to a substate containing holes using an intermediate photopolymerizable liquid layer
JPH0643644A (ja) * 1992-04-01 1994-02-18 Dainippon Toryo Co Ltd ネガ型感光性電着塗料樹脂組成物、これを用いた電着塗装浴及びレジストパターンの製造法
US6297294B1 (en) 1999-10-07 2001-10-02 E. I. Du Pont De Nemours And Company Method for improving the adhesion of a photopolymerizable composition to copper
JP2003005359A (ja) * 2001-06-27 2003-01-08 Hitachi Chem Co Ltd 高解像・高密着性の感光性樹脂組成物及びその用途
JP2003035953A (ja) * 2001-07-23 2003-02-07 Hitachi Chem Co Ltd 高密度・高解像度用の感光性樹脂組成物及びその用途
EP1279699A1 (en) 2001-07-27 2003-01-29 Baselltech USA Inc. Soft polyolefin compositions
US6822047B2 (en) * 2003-01-02 2004-11-23 National Starch And Chemical Investment Holding Corporation Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates
EP1589374B1 (en) * 2004-02-26 2008-10-01 FUJIFILM Corporation Polymerizable composition and process for producing lithographic plate using the polymerizable composition
US20060027321A1 (en) * 2004-08-09 2006-02-09 3M Innovative Properties Company Adhesive composition
US20060029784A1 (en) * 2004-08-09 2006-02-09 3M Innovative Properties Company Laminated optical article
JP4449983B2 (ja) * 2004-08-11 2010-04-14 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた感光性フィルム
KR100860901B1 (ko) 2004-08-11 2008-09-29 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물 및 이것을 이용한 감광성 필름
US20060154180A1 (en) 2005-01-07 2006-07-13 Kannurpatti Anandkumar R Imaging element for use as a recording element and process of using the imaging element
US7579134B2 (en) * 2005-03-15 2009-08-25 E. I. Dupont De Nemours And Company Polyimide composite coverlays and methods and compositions relating thereto
US7618766B2 (en) * 2005-12-21 2009-11-17 E. I. Du Pont De Nemours And Company Flame retardant photoimagable coverlay compositions and methods relating thereto
CN101430507A (zh) * 2007-08-27 2009-05-13 E.I.内穆尔杜邦公司 基片上的可光聚合干膜的湿层叠以及与湿层叠有关的组合物
US20090087774A1 (en) * 2007-08-27 2009-04-02 E.I. Du Pont De Nemours And Company Compositions and methods for wet lamination of photopolymerizable dry films onto substrates

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3622334A (en) * 1969-12-31 1971-11-23 Du Pont Photopolymerizable compositions and elements containing heterocyclic nitrogen-containing compounds
US4054483A (en) * 1976-12-22 1977-10-18 E. I. Du Pont De Nemours And Company Additives process for producing plated holes in printed circuit elements
US4214936A (en) * 1978-10-24 1980-07-29 E. I. Du Pont De Nemours And Company Lamination process
US4293635A (en) * 1980-05-27 1981-10-06 E. I. Du Pont De Nemours And Company Photopolymerizable composition with polymeric binder
US4438190A (en) * 1981-03-04 1984-03-20 Hitachi Chemical Company, Ltd. Photosensitive resin composition containing unsaturated monomers and unsaturated phosphates
JPS589138A (ja) * 1981-07-10 1983-01-19 Hitachi Chem Co Ltd 感光性樹脂組成物
JPS61166541A (ja) * 1985-01-19 1986-07-28 Fuotopori Ouka Kk 光重合性組成物

Also Published As

Publication number Publication date
KR910001589B1 (ko) 1991-03-16
DE3774763D1 (de) 1992-01-09
KR870011507A (ko) 1987-12-23
JPS6324243A (ja) 1988-02-01
EP0247549A3 (en) 1988-01-13
CA1295166C (en) 1992-02-04
EP0247549A2 (en) 1987-12-02
US4680249A (en) 1987-07-14
US4710262A (en) 1987-12-01
CN87103854A (zh) 1987-12-23
EP0247549B1 (en) 1991-11-27

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Ipc: H05K 3/00 (2006.01), G03F 7/085 (2006.0