KR850007266A - 벗겨지는 땜납 마스크 - Google Patents

벗겨지는 땜납 마스크 Download PDF

Info

Publication number
KR850007266A
KR850007266A KR1019850002471A KR850002471A KR850007266A KR 850007266 A KR850007266 A KR 850007266A KR 1019850002471 A KR1019850002471 A KR 1019850002471A KR 850002471 A KR850002471 A KR 850002471A KR 850007266 A KR850007266 A KR 850007266A
Authority
KR
South Korea
Prior art keywords
film coating
coating
film
vinyl resin
microcrystalline wax
Prior art date
Application number
KR1019850002471A
Other languages
English (en)
Inventor
웨인 마틴 프랭크 (외 1)
Original Assignee
프란코이스 비손
일렉트로 머티어리얼스 코오포레이션 어브 아메리카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 프란코이스 비손, 일렉트로 머티어리얼스 코오포레이션 어브 아메리카 filed Critical 프란코이스 비손
Publication of KR850007266A publication Critical patent/KR850007266A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J191/00—Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D157/00—Coating compositions based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/008—Temporary coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

내용 없음

Description

벗겨지는 땜납 마스크
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. (a) ⅰ) 약 15 내지 50중량%의 비닐 수지; ⅱ) 약 30 내지 90중량%의 유기용매; ⅲ) 약 5 내지 15중량%의 미세결정성 왁스로 구성되는 조성물을 기판의 표면에 피복시켜 필름피복을 형성하고; (b) 재료를 고화시키기 위해 충분한 시간동안 증가된 온도에서 필름피복을 숙성하고; (c) 적당한 시간동안 용융된 땜납용제에 상기 기관 및 필름피복을 노출시키고; 및 (d) 상기 필름피복을 벗겨서 제거한후 상기 피복 필름에 의해 보호된 상기 기판은 필수적으로 변형되지 않고, 더욱 더 다른 공정없이 성분을 부착할 수 있음을 특징으로 하는 인쇄된 회로와 같은 기판의 선택적인 땜질을 수행하는 방법.
  2. 제1항에 있어서, 필름피복이 상기 기판위에 스크린 인쇄됨을 특징으로 하는 방법.
  3. 제2항에 있어서, 필름피복이 약 2 내지 180분동안 약 125℃ 내지 165℃의 온도에서 숙성됨을 특징으로 하는 방법.
  4. 제2항에 있어서, 필름이 구동벨트위에서 숙성됨을 특징으로 하는 방법.
  5. 제1항에 있어서, 비닐수지대 미세결정성 왁스의 비가 약 4 : 1 내지 2 : 1임을 특징으로 하는 방법.
  6. 제5항에 있어서, 비닐수지대 미세결정성 왁스의 비가 약 3.5 : 1 내지 2.5 : 1임을 특징으로 하는 방법.
  7. 제1항에서, 필름피복이 약 50미크론의 두께를 갖음을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850002471A 1984-04-12 1985-04-12 벗겨지는 땜납 마스크 KR850007266A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59954084A 1984-04-12 1984-04-12
US599540 1984-04-12

Publications (1)

Publication Number Publication Date
KR850007266A true KR850007266A (ko) 1985-12-02

Family

ID=24400046

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850002471A KR850007266A (ko) 1984-04-12 1985-04-12 벗겨지는 땜납 마스크

Country Status (5)

Country Link
EP (1) EP0159873A3 (ko)
JP (1) JPS60229398A (ko)
KR (1) KR850007266A (ko)
CA (1) CA1219961A (ko)
PH (1) PH21221A (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02143489A (ja) * 1988-11-24 1990-06-01 Nippon Avionics Co Ltd プリント配線板
KR100267229B1 (ko) 1997-09-03 2000-10-16 윤종용 인쇄회로기판의금도금단자부오염방지방법
JP5695110B2 (ja) * 2012-06-25 2015-04-01 Ｊｅインターナショナル株式会社 除去装置、塗布除去システム、除去方法、及び塗布除去方法
US9545011B2 (en) 2015-05-13 2017-01-10 International Business Machines Corporation Dry film solder mask composite laminate materials
FR3133193A1 (fr) * 2022-03-04 2023-09-08 Jet Metal Technologies Composition pour la realisation de revetement de masquage pour la fabrication d’articles tridimensionnels a motif(s) metallique(s)
WO2023166271A1 (fr) * 2022-03-04 2023-09-07 Jet Metal Technologies Procédé de fabrication d'articles tridimensionnels séléctivement métallisés avec une composition de revêtement de masquage

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740193A (en) * 1953-07-01 1956-04-03 Rca Corp Method of soldering printed circuits
US3322707A (en) * 1964-06-11 1967-05-30 Union Carbide Corp Coating compositions
US3375215A (en) * 1964-09-18 1968-03-26 Du Pont Cellophane coating compositions comprising vinylidene chloride copolymer, candelillawax and stearate salt
US3647730A (en) * 1969-08-27 1972-03-07 Western Electric Co Masking compositions
UST900017I4 (en) * 1971-03-22 1972-07-25 Defensive publication
US4240945A (en) * 1979-01-31 1980-12-23 Albert Gabrick Solder mask composition

Also Published As

Publication number Publication date
CA1219961A (en) 1987-03-31
PH21221A (en) 1987-08-21
EP0159873A3 (en) 1987-05-27
JPS60229398A (ja) 1985-11-14
EP0159873A2 (en) 1985-10-30

Similar Documents

Publication Publication Date Title
BR8201731A (pt) Composicao de"primer"e processo para aderir borracha de silicona a um substrato
DE58900937D1 (de) Verfahren und vorrichtung zur herstellung von pastillen.
JPS5532086A (en) Photosensitive printing plate
DE3587279T2 (de) Ultradünne chemisch widerstandsfähige Markierung und Verfahren zur Herstellung einer solchen.
PT76300A (fr) Composition liquide de base convenant pour la realisation de revetements transparents ou vernis sur des surfaces solides
JPH0584896B2 (ko)
KR850007266A (ko) 벗겨지는 땜납 마스크
KR970072184A (ko) 포토레지스트박리제 및 반도체집적회로의 제조방법
EP0786501A4 (en) REMOVABLE, AQUEOUS COATING COMPOSITION AND PROCEDURE FOR PROVISIONAL PROTECTION OF VEHICLE BODY PAINTS THEREFOR
ATE117156T1 (de) Dünnschichtleitende vorrichtung und verfahren zu ihrer herstellung.
BR8200602A (pt) Processo de producao de um trabalho artistico e trabalho artistico produzido pelo processo
KR850001443A (ko) 광 저항성 조성물
KR880001185A (ko) 인쇄회로 기판에 명칭을 제공하는 방법.
JPS5579435A (en) Photographic material
JPH0315543B2 (ko)
JPS5247673A (en) Process for production of silicon crystal film
JPS56116634A (en) Semiconductor device
KR840003185A (ko) 무마스크의 패턴 피막공정
JPS5258743A (en) Method for corrosionproof coating
JPS52123437A (en) Material for protecting surface
SE9000550D0 (sv) Reklamskylt samt foerfarande foer framstaellning daer av
JPS5335475A (en) Production of semiconductor unit
JPS54140739A (en) Pretreating agent for hair coloring
JPS56130946A (en) Protecting method of wiring layer
DE3483848D1 (de) Verfahren zur fotolithografischen herstellung von strukturen nach dem prinzip der abhebetechnik.

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid