ATE117156T1 - Dünnschichtleitende vorrichtung und verfahren zu ihrer herstellung. - Google Patents

Dünnschichtleitende vorrichtung und verfahren zu ihrer herstellung.

Info

Publication number
ATE117156T1
ATE117156T1 AT91310723T AT91310723T ATE117156T1 AT E117156 T1 ATE117156 T1 AT E117156T1 AT 91310723 T AT91310723 T AT 91310723T AT 91310723 T AT91310723 T AT 91310723T AT E117156 T1 ATE117156 T1 AT E117156T1
Authority
AT
Austria
Prior art keywords
film conductive
thin
conductive device
production
coating
Prior art date
Application number
AT91310723T
Other languages
English (en)
Inventor
Robert Parker
Roger W Phillips
Original Assignee
Flex Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flex Products Inc filed Critical Flex Products Inc
Application granted granted Critical
Publication of ATE117156T1 publication Critical patent/ATE117156T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H05B3/36—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/009—Heaters using conductive material in contact with opposing surfaces of the resistive element or resistive layer
    • H05B2203/01—Heaters comprising a particular structure with multiple layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/011—Heaters using laterally extending conductive material as connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition

Landscapes

  • Surface Heating Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Physical Vapour Deposition (AREA)
  • Resistance Heating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
AT91310723T 1990-11-21 1991-11-21 Dünnschichtleitende vorrichtung und verfahren zu ihrer herstellung. ATE117156T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61658790A 1990-11-21 1990-11-21

Publications (1)

Publication Number Publication Date
ATE117156T1 true ATE117156T1 (de) 1995-01-15

Family

ID=24470136

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91310723T ATE117156T1 (de) 1990-11-21 1991-11-21 Dünnschichtleitende vorrichtung und verfahren zu ihrer herstellung.

Country Status (5)

Country Link
EP (1) EP0487338B1 (de)
JP (1) JPH05217661A (de)
AT (1) ATE117156T1 (de)
CA (1) CA2052414A1 (de)
DE (1) DE69106675T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5448037A (en) * 1992-08-03 1995-09-05 Mitsui Toatsu Chemicals, Inc. Transparent panel heater and method for manufacturing same
FR2721788B1 (fr) * 1994-06-24 1996-09-06 Bernard Tavernier Film chauffant.
US6204480B1 (en) * 2000-02-01 2001-03-20 Southwall Technologies, Inc. Vacuum deposition of bus bars onto conductive transparent films
JP4659978B2 (ja) * 2000-12-26 2011-03-30 オプトレックス株式会社 液晶表示パネル用パネルヒータとコネクターケーブルとの接続構造
DE102006055862B4 (de) * 2006-11-22 2008-07-03 Q-Cells Ag Verfahren und Vorrichtung zum Herstellen einer elektrischen Solarzellen-Kontaktstruktur an einem Substrat
FR2939767B1 (fr) * 2008-12-11 2012-02-03 Hutchinson Systeme d'antigivrage/degivrage, son procede de fabrication et structure d'aeronef l'incorporant
GB2477336B (en) * 2010-01-29 2011-12-07 Gkn Aerospace Services Ltd Dielectric component with electrical connection
CN102485947B (zh) * 2010-12-06 2013-09-25 杭州韩世通信电子有限公司 溅射靶表面含氧量的控制系统、探针及镀ito膜的pet板制造方法
CN103052180A (zh) * 2012-12-24 2013-04-17 镇江飞达医疗器材有限公司 具有电镀导电轨的柔性导电发热体及导电轨形成方法
WO2016024610A1 (ja) * 2014-08-12 2016-02-18 積水ナノコートテクノロジー株式会社 面発熱体及びその製造方法
JP7162461B2 (ja) 2017-08-04 2022-10-28 日東電工株式会社 ヒータ用部材、ヒータ用テープ、及びヒータ用部材付成形体
CN110999532B (zh) * 2017-08-04 2022-06-28 日东电工株式会社 加热器
JP7162462B2 (ja) * 2018-08-02 2022-10-28 日東電工株式会社 ヒータ及びヒータ付物品
TWI696412B (zh) * 2019-02-27 2020-06-11 群翊工業股份有限公司 基板噴塗設備及基板噴塗方法
CN121099466B (zh) * 2025-11-12 2026-02-03 中北大学 一种基于镍金属加热的mems微加热器及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2438984C3 (de) * 1974-08-14 1981-11-19 Hoechst Ag, 6000 Frankfurt Kontaktvorrichtung an einer Folie eines Flächenheizleiters
DE2936398A1 (de) * 1979-09-08 1981-03-26 Ver Glaswerke Gmbh Elektrisch beheizbare glasscheibe
JPS599887A (ja) * 1982-07-07 1984-01-19 日本特殊陶業株式会社 セラミツク発熱体
US4593181A (en) * 1984-02-06 1986-06-03 Raychem Corporation Heating element having deformed buss bars

Also Published As

Publication number Publication date
EP0487338B1 (de) 1995-01-11
JPH05217661A (ja) 1993-08-27
DE69106675T2 (de) 1995-06-08
CA2052414A1 (en) 1992-05-22
DE69106675D1 (de) 1995-02-23
EP0487338A1 (de) 1992-05-27

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Legal Events

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