KR890016892A - 프린트회로기판의 제조방법 - Google Patents

프린트회로기판의 제조방법 Download PDF

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Publication number
KR890016892A
KR890016892A KR1019890004719A KR890004719A KR890016892A KR 890016892 A KR890016892 A KR 890016892A KR 1019890004719 A KR1019890004719 A KR 1019890004719A KR 890004719 A KR890004719 A KR 890004719A KR 890016892 A KR890016892 A KR 890016892A
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KR
South Korea
Prior art keywords
photoresist
manufacturing
circuit board
printed circuit
pattern
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Application number
KR1019890004719A
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English (en)
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KR910009483B1 (ko
Inventor
가쯔에 마스이
이사오 고바야시
시게루 구보따
도시모또 모리와끼
Original Assignee
시기 모리야
미쯔비시덴끼 가부시끼가이샤
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Publication of KR890016892A publication Critical patent/KR890016892A/ko
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Publication of KR910009483B1 publication Critical patent/KR910009483B1/ko

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/161Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09581Applying an insulating coating on the walls of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/092Particle beam, e.g. using an electron beam or an ion beam
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/135Electrophoretic deposition of insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49165Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

내용 없음

Description

프린트회로기판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. 구리를 얇게 적충한 적층판에 양성형 포토레지스터를 전기코팅으로 부착시키는 공정, 상기 포토레지스트에 활성광선을 조사하는 것에 의해 포토레지스트 패턴을 형성하는 공정 및, 상기 포토레지스트 패턴을 에칭포토제지스트로서 에칭을 행하여 도체회로 패턴을 형성하는 공정을 실행하는 프린트 회로기판의 제조방법.
  2. 특허청구의 범위 제 1 항에 있어서, 상기 양성형 프토레지스트는 비닐계 폴리머인 것을 특징으로 하는 프린트회로기판의 제조방법.
  3. 특허청구의 범위 제 2 항에 있어서. 상기 비닐치 폴리머의 분자량은 5000∼100만인 것을 특징으로 하는 프린트 회로 기판의 제조방법.
  4. 특허청구의 범위 제 1 항에 있어서, 상기 구리를 얇게 적층한 적층판에는 스루홀이 마련되어 있는 것을 특징으로 하는 프린트회로 기판의 제조방법.
  5. 막에 양성형 포토레지스트층을 도포형성하고, 상기 막을 양성형 포토레지스트층을 구리를 얇게 적층한 적층판측으로 해서 열압착하는 공정, 상기 포토레지스트에 활성광선을 조사하는 공정, 상기 막을 박리하는 공정, 조사된 포토레지스트를 제거해서 포토레지스트 패턴을 형성하는 공정 및 상기 포토레지스트 패턴을 에칭 포토레지스트로서 에칭을 행하여 도체회로 패턴을 형성하는 공정을 실행하는 프린트 회로기판의 제조방법.
  6. 특허청구의 범위 제 5 항에 있어서, 상기 양성형 포토레지스트는 비닐계 폴리머인 것을 특징으로 하는 프린트회로 기판의 제조방법.
  7. 특허청구의 범위 제 6 항에 있어서, 상기 비닐계 폴리머의 분자량은 5000∼100인 것을 특징으로 하는 프린트회로기판의 제조방법.
  8. 특허청구의 범위 제 5 항에 있어서, 상기 구리를 얇게 적층한 적층판에는 스루홀이 마련되어 있는 것을 특징으로 하는 프린트회로 기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004719A 1988-04-13 1989-04-10 프린트회로기판의 제조방법 KR910009483B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP63-90609 1988-04-13
JP88-90609 1988-04-13
JP9060988 1988-04-13
JP63207716A JPH0234984A (ja) 1988-04-13 1988-08-22 プリント回路基板の製造方法
JP63-207716 1988-08-22
JP88-207716 1988-08-22

Publications (2)

Publication Number Publication Date
KR890016892A true KR890016892A (ko) 1989-11-30
KR910009483B1 KR910009483B1 (ko) 1991-11-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890004719A KR910009483B1 (ko) 1988-04-13 1989-04-10 프린트회로기판의 제조방법

Country Status (3)

Country Link
US (1) US4983252A (ko)
JP (1) JPH0234984A (ko)
KR (1) KR910009483B1 (ko)

Cited By (3)

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Publication number Priority date Publication date Assignee Title
KR100233177B1 (ko) * 1995-08-30 1999-12-01 포만 제프리 엘. 디스크 드라이브 시스템을 위한 헤드 서스펜션 어셈블리의 로드 빔 및 로드 빔에 전선을 부착하는 방법
CN113015341A (zh) * 2021-04-22 2021-06-22 江西新华盛电子电路科技有限公司 一种家电用双面板的制备工艺
CN114828430A (zh) * 2022-05-10 2022-07-29 深圳市鼎华芯泰科技有限公司 一种双面或多层印制电路板的蚀刻方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100233177B1 (ko) * 1995-08-30 1999-12-01 포만 제프리 엘. 디스크 드라이브 시스템을 위한 헤드 서스펜션 어셈블리의 로드 빔 및 로드 빔에 전선을 부착하는 방법
CN113015341A (zh) * 2021-04-22 2021-06-22 江西新华盛电子电路科技有限公司 一种家电用双面板的制备工艺
CN114828430A (zh) * 2022-05-10 2022-07-29 深圳市鼎华芯泰科技有限公司 一种双面或多层印制电路板的蚀刻方法

Also Published As

Publication number Publication date
KR910009483B1 (ko) 1991-11-16
JPH0234984A (ja) 1990-02-05
US4983252A (en) 1991-01-08

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