KR890016892A - 프린트회로기판의 제조방법 - Google Patents

프린트회로기판의 제조방법 Download PDF

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Publication number
KR890016892A
KR890016892A KR1019890004719A KR890004719A KR890016892A KR 890016892 A KR890016892 A KR 890016892A KR 1019890004719 A KR1019890004719 A KR 1019890004719A KR 890004719 A KR890004719 A KR 890004719A KR 890016892 A KR890016892 A KR 890016892A
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KR
South Korea
Prior art keywords
photoresist
manufacturing
circuit board
printed circuit
pattern
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Application number
KR1019890004719A
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English (en)
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KR910009483B1 (ko
Inventor
가쯔에 마스이
이사오 고바야시
시게루 구보따
도시모또 모리와끼
Original Assignee
시기 모리야
미쯔비시덴끼 가부시끼가이샤
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Publication of KR890016892A publication Critical patent/KR890016892A/ko
Application granted granted Critical
Publication of KR910009483B1 publication Critical patent/KR910009483B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

내용 없음

Description

프린트회로기판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. 구리를 얇게 적충한 적층판에 양성형 포토레지스터를 전기코팅으로 부착시키는 공정, 상기 포토레지스트에 활성광선을 조사하는 것에 의해 포토레지스트 패턴을 형성하는 공정 및, 상기 포토레지스트 패턴을 에칭포토제지스트로서 에칭을 행하여 도체회로 패턴을 형성하는 공정을 실행하는 프린트 회로기판의 제조방법.
  2. 특허청구의 범위 제 1 항에 있어서, 상기 양성형 프토레지스트는 비닐계 폴리머인 것을 특징으로 하는 프린트회로기판의 제조방법.
  3. 특허청구의 범위 제 2 항에 있어서. 상기 비닐치 폴리머의 분자량은 5000∼100만인 것을 특징으로 하는 프린트 회로 기판의 제조방법.
  4. 특허청구의 범위 제 1 항에 있어서, 상기 구리를 얇게 적층한 적층판에는 스루홀이 마련되어 있는 것을 특징으로 하는 프린트회로 기판의 제조방법.
  5. 막에 양성형 포토레지스트층을 도포형성하고, 상기 막을 양성형 포토레지스트층을 구리를 얇게 적층한 적층판측으로 해서 열압착하는 공정, 상기 포토레지스트에 활성광선을 조사하는 공정, 상기 막을 박리하는 공정, 조사된 포토레지스트를 제거해서 포토레지스트 패턴을 형성하는 공정 및 상기 포토레지스트 패턴을 에칭 포토레지스트로서 에칭을 행하여 도체회로 패턴을 형성하는 공정을 실행하는 프린트 회로기판의 제조방법.
  6. 특허청구의 범위 제 5 항에 있어서, 상기 양성형 포토레지스트는 비닐계 폴리머인 것을 특징으로 하는 프린트회로 기판의 제조방법.
  7. 특허청구의 범위 제 6 항에 있어서, 상기 비닐계 폴리머의 분자량은 5000∼100인 것을 특징으로 하는 프린트회로기판의 제조방법.
  8. 특허청구의 범위 제 5 항에 있어서, 상기 구리를 얇게 적층한 적층판에는 스루홀이 마련되어 있는 것을 특징으로 하는 프린트회로 기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004719A 1988-04-13 1989-04-10 프린트회로기판의 제조방법 KR910009483B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP63-90609 1988-04-13
JP88-90609 1988-04-13
JP9060988 1988-04-13
JP63207716A JPH0234984A (ja) 1988-04-13 1988-08-22 プリント回路基板の製造方法
JP63-207716 1988-08-22
JP88-207716 1988-08-22

Publications (2)

Publication Number Publication Date
KR890016892A true KR890016892A (ko) 1989-11-30
KR910009483B1 KR910009483B1 (ko) 1991-11-16

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ID=26432072

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890004719A KR910009483B1 (ko) 1988-04-13 1989-04-10 프린트회로기판의 제조방법

Country Status (3)

Country Link
US (1) US4983252A (ko)
JP (1) JPH0234984A (ko)
KR (1) KR910009483B1 (ko)

Cited By (3)

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Publication number Priority date Publication date Assignee Title
KR100233177B1 (ko) * 1995-08-30 1999-12-01 포만 제프리 엘. 디스크 드라이브 시스템을 위한 헤드 서스펜션 어셈블리의 로드 빔 및 로드 빔에 전선을 부착하는 방법
CN113015341A (zh) * 2021-04-22 2021-06-22 江西新华盛电子电路科技有限公司 一种家电用双面板的制备工艺
CN114828430A (zh) * 2022-05-10 2022-07-29 深圳市鼎华芯泰科技有限公司 一种双面或多层印制电路板的蚀刻方法

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JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
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JPH04146687A (ja) * 1990-10-08 1992-05-20 Nippon Paint Co Ltd ソルダーマスクされた回路基板の製法
JPH04250688A (ja) * 1991-01-28 1992-09-07 Matsushita Electric Works Ltd プリント配線板の製造方法
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100233177B1 (ko) * 1995-08-30 1999-12-01 포만 제프리 엘. 디스크 드라이브 시스템을 위한 헤드 서스펜션 어셈블리의 로드 빔 및 로드 빔에 전선을 부착하는 방법
CN113015341A (zh) * 2021-04-22 2021-06-22 江西新华盛电子电路科技有限公司 一种家电用双面板的制备工艺
CN114828430A (zh) * 2022-05-10 2022-07-29 深圳市鼎华芯泰科技有限公司 一种双面或多层印制电路板的蚀刻方法

Also Published As

Publication number Publication date
KR910009483B1 (ko) 1991-11-16
JPH0234984A (ja) 1990-02-05
US4983252A (en) 1991-01-08

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