KR870002647A - 반도체장치 및 그 제조방법 - Google Patents

반도체장치 및 그 제조방법 Download PDF

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KR870002647A
KR870002647A KR1019860006161A KR860006161A KR870002647A KR 870002647 A KR870002647 A KR 870002647A KR 1019860006161 A KR1019860006161 A KR 1019860006161A KR 860006161 A KR860006161 A KR 860006161A KR 870002647 A KR870002647 A KR 870002647A
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semiconductor device
substrate
terminal
heat sink
printed wiring
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KR1019860006161A
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English (en)
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아키라 고니시
데루오 와카노
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아키라 고니시
다이이치 세이코 가부시키가이샤
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Priority claimed from JP18090285A external-priority patent/JPS6240754A/ja
Priority claimed from JP18090185A external-priority patent/JPS6240749A/ja
Priority claimed from JP60287346A external-priority patent/JPH0783069B2/ja
Application filed by 아키라 고니시, 다이이치 세이코 가부시키가이샤 filed Critical 아키라 고니시
Publication of KR870002647A publication Critical patent/KR870002647A/ko

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Abstract

내용 없음

Description

반도체장치 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 반도체장치에 대한 플러그-인형패키지의 단면도,
제5도는 본 발명에 따른 플러그-인형 패키지의 다른 실시예를 나타내는 요부확대도,
제7도는 본 발명에 따른 플러그-인형패키지에 대한 인쇄배선기판의 일부변형 상태를 나타내는 개략적인 단면도,

Claims (28)

  1. 플러그-인형 패키지와 이 패키지에 장착된 다수의 반도체 칩으로 이루어진 반도체장치에 있어서, 개구부(6)와 단자(2)를 부착하기 위한 다수의 관통공(9)을 갖고서 절연막 또는 박판으로 구성됨과 더불어, 콘덕터패턴(8)의 인쇄배선이 한쪽면이나 양쪽면에 설치되는 인쇄배선기판(1)과, 상기 인쇄배선기판(1)에 접속됨과 더불어 각 콘덕터패턴(8)에 접속되는 다수의 단자(2), 상기 인쇄배선기판(1)의 개구부(6)를 막기위해 상기 인쇄배선기판(1)상에 형성된 방열판(3)및, 상기 인쇄배선기판(1)과 단자(2)및, 방열판(3)을 갖도록 모울드되는 플라스틱 패키지 본체(4)로 구성된 것을 특징으로 하는 반도체장치.
  2. 상기 제1항에 있어서, 상기 기판(1)이 박막 또는 박판으로 형성된 내열수지로 구성된 것을 특징으로 하는 반도체장치.
  3. 상기 제1항에 있어서, 상기 기판(1)이 내열수지가 보강된 유리섬유의 박막 또는 박판으로 이루어지는 것을 특징으로 하는 반도체장치.
  4. 상기 제1항에 있어서, 상기 기판(1)이 세라믹 박막이나 박판으로 이루어지는 것을 특징으로 하는 반도체방치.
  5. 상기 제1항에 있어서, 상기 기판(1)이 다층박막으로 구성됨과 더불어 각 박막에는 적어도 하나의 개구부(6)와 단자(2) 부착용 다수의 관통공(9)및 서로 다른 콘덕터패턴(8)이 구비된 것을 특징으로 하는 반도체장치.
  6. 상기 제1항에 있어서, 상기 단자(2)는 콜킹에 의해 상기 기판(1)에 단자(2)의 선단부(2a)가 형성됨과 더불어 상기 기판(1)상에 형성된 각각의 콘덕터패턴(8)에 접속된 것을 특징으로 하는 반도체장치.
  7. 상기 제1항에 있어서, 상기 기판(1)에 기판(1)의 파손방지를 위한 보강링(8a) 또는 워셔가 설치되되, 상기 보강링(8a)은 콘덕터패턴이 형성된 측면에 마주되어 있는 기판(1)의 한쪽 단면상에서 관통홈(9)의 축과 같은 축으로 형성된 것을 특징으로 하는 반도체장치.
  8. 상기 제1항에 있어서, 상기 기판(1)이 단자(2)와 콘덕터패턴(8)을 전기적으로 결합시키기 위해 니켈과 은 또는 금으로 도금된 다수의 관통공(9)을 갖도록 된 것을 특징으로 하는 반도체장치.
  9. 상기 제1항에 있어서, 상기 인쇄배선기판(1)상이 형성된 콘덕터패턴(8)이 구리도금층과 상기 구리도금층위에 은이나 금이 도금되어 구성된 것을 특징으로 하는 반도체장치.
  10. 상기 제1항에 있어서, 상기 인쇄배선기판(1)의 콘덕터패턴이 구리도금층(16a)과 니켈도금층(16b), 파라듐층 및 은 또는 금도금층이 순서대로 증착되어 이루어진 것을 특징으로 하는 반도체장치.
  11. 상기 제1항에 있어서, 상기 인쇄배선기판(1)의 콘덕터패턴(8)이 얇은 수지막기판의 표면에 화학적으로 도금된 구리도금층으로 이루어지고, 상기 구리도금층위에 은 또는 금도금층이 전기적으로 도금된 것을 특징으로 하는 반도체장치.
  12. 상기 제11항에 있어서, 상기 구리도금층이 인쇄배선기판(1)상에 형성된 촉매층(15)위에 형성된 것을 특징으로하는 반도체장치.
  13. 상기 제1항에 있어서, 상기 방열판(3)이 열전도물질로 만들어진 것을 특징으로 하는 반도체장치.
  14. 상기 제13항에 있어서, 상기 방열판(3)이 은 또는 금으로 도금된 것을 특징으로 하는 반도체장치.
  15. 상기 제13항에 있어서, 상기 방열판(3)이 반도체 칩(27)설치를 위한 적어도 하나의 요부(10)가 그의 한쪽면에 설치된 것을 특징으로 하는 반도체장치.
  16. 상기 제15항에 있어서, 방열판(3)의 요부(10)가 금 또는 은으로 도금되는 것을 특징으로 하는 반도체장치.
  17. 상기 제15항에 있어서, 상기 방열판(3)의 요부(10)가 방열판(3)의 중앙부에 설치된 것을 특징으로 하는 반도체장치.
  18. 상기 제15항에 있어서, 상기 방열판(3)의 요부(10)가 단자(2)의 연장방향을 향하도록 상기 방열판(3)이 패키지(4)에 팽창된 것을 특징으로 하는 반도체장치.
  19. 상기 제15항에 있어서, 상기 방열판(3)의 요부(10)가 단자(2)의 연장방향과 반대방향을 향하도록 상기 방열판(3)이 패키지(4)에 매장된 것을 특징으로 하는 반도체장치.
  20. 상기 제1항에 있어서, 패키지본체(4)가 내열지수로 모울드된 것을 특징으로 하는 반도체장치.
  21. 상기 제20항에 있어서, 상기 내열수지가 충전제와 같은 무기물질이 포함된 것을 특징으로 하는 반도체장치.
  22. 상기 제1항에 있어서, 상기 단자(2)는 전기적인 전도물질에 의해 콘덕터패턴(8)에 그 하단부가 결합된 것을 특징으로 하는 반도체장치.
  23. 상기 제1항에 있어서, 패키지본체(4)의 공동(4a)이 수지로 채워지는 것을 특징으로 하는 반도체장치.
  24. 상기 제1항에 있어서, 패키지본체(4)의 공동(4a)이 덮개(28)로 봉합된 것을 특징으로 하는 반도체장치.
  25. 상기 제1항에 있어서, 다수의 모놀리틱 반도체 집적회로 칩이 방열판(3)상에 형성되고, 패키지본체(4)에는 인쇄 배선기판(1)과 단자(2)의 선단부, 방열판(3)및 반도체 칩이 패키지(4)내에 모울드되어 형성된 것을 특징으로 하는 반도체장치.
  26. 상기 제1항에 있어서, 상기 패키지본체(4)에 주요부분으로 적어도 하나 이상의 스탠드 오프(13)가 설치된 것을 특징으로 하는 반도체장치.
  27. 상기 제26항에 있어서, 상기 스탠드 오프(13)가 단자(2)의 축과 동축으로 모울드된 것을 특징으로 하는 반도체장치.
  28. 개구부(6)와 다수의 관통공(9)을 갖는 인쇄배선기판(1)을 제조하는 단계와, 관통공(9)안으로 단자의 몸체 한끝부분을 삽입하여 다수의 단자(2)를 기판(1)에 고정시킨후 단자(2)몸체의 돌출끝을 두드려펴서 상단부(2a)로 만드는 단계, 방열판(3)이 기판(1)의 개구부(6)를 막도록 금형의 공동(23)안으로 기판(1)과 방열판(3)을 부착시키는 단계, 패키지 본체(4)의 형성을 위해 기판(1)과 단자(2)의 선단부(2a) 및 방열판(3)의 측면주위에 수지를 모울딩시키는 단계로 이루어진 반도체장치용 플러그-인형 패키지의 제조방법.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860006161A 1985-08-16 1986-07-28 반도체장치 및 그 제조방법 KR870002647A (ko)

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JP60-180902 1985-08-16
JP18090285A JPS6240754A (ja) 1985-08-16 1985-08-16 ピングリッドアレイ
JP18090185A JPS6240749A (ja) 1985-08-16 1985-08-16 ピングリツドアレイ
JP60-180901 1985-08-16
JP60-287346 1985-12-19
JP60287346A JPH0783069B2 (ja) 1985-12-19 1985-12-19 半導体装置およびその製造方法

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EP0218796A2 (en) 1987-04-22
CN86105249A (zh) 1987-02-11
EP0218796B1 (en) 1990-10-31
DE3675321D1 (de) 1990-12-06
US4823234A (en) 1989-04-18

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