KR830002067A - 무전해 도금을 하기 위한 썹스트레이트 표면제조법과 그에 의한 생성물 - Google Patents

무전해 도금을 하기 위한 썹스트레이트 표면제조법과 그에 의한 생성물 Download PDF

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KR830002067A
KR830002067A KR1019800000224A KR800000224A KR830002067A KR 830002067 A KR830002067 A KR 830002067A KR 1019800000224 A KR1019800000224 A KR 1019800000224A KR 800000224 A KR800000224 A KR 800000224A KR 830002067 A KR830002067 A KR 830002067A
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metal
electrolytic cell
catalyst
metal surface
treatment step
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KR880001664B1 (ko
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쥬니어 글렌오. 맬러리
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알란 엠. 에이브람스
리차드슨 케미칼 컴페니
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

내용 없음

Description

무전해 도금을 하기 위한 썹스트레이트 표면제조법과 그에 의한 생성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
첨부도면은 생산공정을 나타내는 계통도임.

Claims (36)

  1. 니켈, 코발트 및 복합제로 구성되어 있는 단체로부터 선택된 용착촉진 금속과 주석, 몰리스테늄 구리와 텅스텐으로 구성되어 있는 단체로부터 선택된 2차 금속을 함유하는 다금속 촉매제로 회로형태를 갖는 배전판을 처리하고, 상기 촉매제가 상기 회로형태에 계속되는 도금을 촉진시키지 못하며, 후에 니켈, 코발트 및 니켈, 혹은 코발트를 함유하는 다합금으로 구성되어 있는 단체로부터 선택된 금속으로 회로형태를 도금하는 것으로 구성되어 있는 인쇄배전판 제조방법.
  2. 상기 처리단계가 상기 회로형태에 우선 촉매제 필름제재를 촉진시키기 위하여 수용성수세제로 상기 촉매제로 처리된 회로판을 수세한 다음에 실시되는 청구범위 1에 의한 방법.
  3. 상기 처리단계가 정교한 회로형태 외부에 배전판을 촉매화시키기 보다는 회로형태를 선택촉매화시키는 시간을 60초이하에서 적어도 한번 수용성수세후에 실시되는 청구범위 1에 의한 방법.
  4. 상기 처리단계가 촉매제에 포함된 금속음이온에 대한 환원제와 함께 상기 촉매제를 함유하는 전해조속으로 배전판을 담그는 청구범위 1에 의한 방법.
  5. 상기 처리 단계가 붕소를 함유하는 환원제와 함께 상기 촉매제를 함유하는 전해조속으로 배전판을 담그는 청구범위 1에 의한 방법.
  6. 상기 처리단계가 알카리성 수용액 전해조속으로 배전판을 담그늘 청구범위 1에 의한 방법.
  7. 상기 처리 단계가 pH 약 5.5-13인 수용성 전해조속에 배전판을 담그는 청구범위 1에 의한 방법.
  8. 상기 처리단계가 온도 약 20-100℃의 수용성 전해조에 배전판을 담그는 청구범위 1에 의한 방법.
  9. 상기 처리단계가 회로형태의 표면을 핵화 시키기에 충분하고 일반적으로 계속적인 도금필름을 용착 시키기에는 불충분한 시간동안 수용성 전해조에 배전판을 담그는 청구범위 1에 의한 방법.
  10. 상기 처리단계가 약 10-약 90초동안 수용성 전해조에 배전판을 담그는 청구범위 1에 의한 방법.
  11. 상기 다금속 촉매제가 니켈과 코발트로 구성되어 있는 단체로부터 선택된 금속 ; 몰리브데늄, 텅스텐, 주석 및 구리를 구성하고 있는 단체로부터 선택된 금속과 붕소 및 인을 구성하고 있는 단체로부터 선택된 요소의 제재에 포함된 청구범위 1에 의한 방법.
  12. 상기 회로형태가 구리를 함유하고 상기 배전판이 회로형태가 안정되어 있는 비전도성판을 포함하는 청구범위 1에 의한 방법.
  13. 상기 처리단계가 전해조 전해부피를 기준으로 해서 용착촉진 금속 약 0.001-0.3mol/ℓ, 2차금속 약 0.001-0.5mol/ℓ와 환원제 약 0.001-0.2mol/ℓ를 갖는 수용성 전해조에 배전판을 담그는 청구범위 1에 의한 방법.
  14. 비촉매성 금속표면을 니켈, 코발트와 혼합물로 구성되어 있는 단체로부터 선택된 용착촉진 금속과 주석, 몰리브데늄, 구리, 텅스텐 및 이들의 혼합물로 구성되어 있는 단체로부터 선택된 2차금속으로 처리하며 상기 처리가 일반적으로 알칼리 조건하에서 이고 상기 비촉매 금속표면을 핵화 시키기에 충분하고 계속적으로 도금하는 필름을 용착시키기에 불충분한 시간 동안 실시되는 비촉매성 금속 표면을 촉매화 시키는 방법.
  15. 상기 처리단계가 상기 금속표면을 우선 촉매제 필름 제제를 상기 금속표면에 부착력을 촉진시키기 위한 수용성 수세제로 수세한 다음 실시되는 청구범위 14에 의한 방법.
  16. 상기 처리단계가 촉매제 내에 포함된 상기 금속의 음이온에 대한 환원제와 함께 상기 촉매제를 함유하는 전해조로 비촉매성 금속표면을 담그는 청구범위 14에 의한 방법.
  17. 상기 처리단계가 비촉매성 금속표면을 pH가 약 5.5-13인 수용성 전해조로 담그고 전해조 온도는 약 20-100℃이며 시간은 비촉매성 금속표면을 핵화시키기에 충분하고 일반적으로 계속적인 도금필름을 용착시키기에 불충분한 청구범위 14에 의한 방법.
  18. 상기 비촉매성 금속표면이 구리를 함유하는 표면인 청구범위 14에 의한 방법.
  19. 촉매제가 니켈, 코발트 및 이들의 혼합물로 구성되어 있는 단체로부터 선택된 용착촉진 금속과 주석, 몰리브데늄, 구리, 텅스트텐 및 이들의 혼합물로 구성된 단체로부터 선택된 2차 금속을 함유하는 다금속제재로구성되어 있고 상기 다금속제재가 일반적으로 계속되는 도금 필름을 용착시키기에 불충분한 조건하에서 상기 비촉매성 표면을 핵화시킬 수 있고 비촉매성 금속표면에 도금을 촉진시키는 촉매제.
  20. 상기 금속이 용해염, 반응해염, 에스테르 혹은 폴리하이드릭 화합물의 에스테르 복합제로서 포함된 청구범위 19에 의한 촉매제.
  21. 2차금속을 함유한 화합물에 대한 용착촉진 금속을 함유한 화합물의 몰분률이 150대 1 내지 약 1대 100인 청구범위 19에 의한 촉매제.
  22. 비촉매성 금속표면이 구리를 함유하는 청구범위 19에 의한 촉매제.
  23. 니켈, 코발트 혹은 니켈이나 코발트를 함유한 다합금으로 도금시키고 상기 전해조가 니켈, 코발트 및 이들이 혼합물로 구성되어 있는 단체로부터 선택된 1차금속과 주석, 몰리브데늄, 구리 및 텅스텐으로 구성되어 있는 단체로부터 선택된 2차금속과 상기물질의 음이온에 대한 환원제를 함유한 다금속 촉매제로 구성되어 있고 상기 전해조가 금속표면에 도금을 촉진하는 금속표면을 촉매화 시키는 전해조.
  24. 상기 환원제가 붕소 수화물, 아민보란과 지급 알킬기로 치환된 아민 보란으로 구성된 단체로부터 선택된 붕소를 함유하는 화합물인 청구범위 23에 의한 전해조.
  25. 상기 전해조가 pH 약 5.5-13이고 온도는 약 20-100℃인 청구범위 23에 의한 전해조.
  26. 상기 전해조가 전해조 전체부피를 기준으로 해서 1차금속 약 0.001-0.3mol/ℓ, 2차금속 약 0.001-0.5mol/ℓ와 환원제 약 0.001-0.2mol/ℓ인 수용성 전해조인 청구범위 23에 의한 전해조.
  27. 상기 전해조가 전해조 안정제, pH조절제, 혼합제, 황화물 이온 조절제 혹은 완충제를 함유하는 청구범위 23에 의한 전해조.
  28. 금속표면이 구리를 함유하는 청구범위 23에 의한 전해조.
  29. 비촉매성 금속표면을 니켈, 코발트 및 이들의 혼합물로 구성되어 있는 단체로부터 선택된 용착증진금속과 주속, 몰리브데늄, 구리, 텅스텐 및 이들의 혼합물로 구성되어 있는 단체로부터 선택된 2차금속을 포함하는 다금속촉매제로 처리하며 상기 처리가 일반적으로 알카리성 조건하에서 실시되고 상기 비촉매성 금속표면에 충분하고 계속적인 도금필름을 용착시키기에 불충분한 시간동안 실시되는 비촉매성 금속표면을 촉매와 시키는 방법에 따라 생성되는 생성물.
  30. 상기 처리단계가 상기 금속표면에 우선 촉매제 필름형성을 촉진시키는 수용성 수세제로 상기 금속표면을 수세한 다음에 실시되는 청구범위 29에 의한 생성물.
  31. 상기 처리단계가 촉매제에 함유된 상기 금속의 음이온에 대한 환원제와 함께 상기 촉매제를 포함한 전해조에 비촉매성 금속표면을 담그는 청구범위 29에 의한 생성물.
  32. 상기 처리단계가 pH 약 5.5-13인 수용성 전해조로 비촉매성 금속표면을 담그며 전해조 온도가 약 20-100℃이며 비촉매성 금속표면을 핵화시키기에 충분하고 계속적인 도금 필름을 용착시키기에 불충분한 시간동안 실시되는 청구범위 29에 의한 생성물.
  33. 상기 비촉매성 금속표면이 구리를 함유하는 청구범위 29에 의한 생성물.
  34. 상기 배촉매성 금속표면이 비전도성 썹스트레이트에 구리를 함유하는 표면이며 처리단계가 구리를 함유하는 표면에 니켈 혹은 코발트를 함유하는 도금을 촉진시켜 동시 비전도성 썹스트레이트에 도금을 촉진시키지 못하는 적어도 한번 수세를 한후에 실시되는 청구범위 29에 의한 생성물.
  35. 상기 구리를 함유한 표면이 인쇄된 배전판에 대한 회로 형태인 청구범위 34에 의한 생성물.
  36. 오버플레이트(overplate) 자체가 구리를 함유하는 표면의 부식저항 혹은 땜납성을 촉진시키기 위하여 금속으로 도금된 청구범위 34에 의한 생성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019800000224A 1979-01-22 1980-01-22 비촉매성 금속기질의 촉매화방법 KR880001664B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5169 1979-01-22
US06/005,169 US4232060A (en) 1979-01-22 1979-01-22 Method of preparing substrate surface for electroless plating and products produced thereby

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Publication Number Publication Date
KR830002067A true KR830002067A (ko) 1983-05-21
KR880001664B1 KR880001664B1 (ko) 1988-09-05

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CA1139012A (en) 1983-01-04
FR2447130A1 (fr) 1980-08-14
KR880001664B1 (ko) 1988-09-05
HK82884A (en) 1984-11-09
JPS6325518B2 (ko) 1988-05-25
FR2447130B1 (fr) 1988-02-05
DE3002166A1 (de) 1980-07-31
US4232060A (en) 1980-11-04
GB2043115A (en) 1980-10-01
JPS55102297A (en) 1980-08-05
GB2043115B (en) 1983-05-11
DE3002166C2 (ko) 1989-12-07

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