FR2447130A1 - Procede, catalyseur et bain polymetalliques de production de plaquettes a circuits imprimes et produits obtenus - Google Patents

Procede, catalyseur et bain polymetalliques de production de plaquettes a circuits imprimes et produits obtenus

Info

Publication number
FR2447130A1
FR2447130A1 FR8001221A FR8001221A FR2447130A1 FR 2447130 A1 FR2447130 A1 FR 2447130A1 FR 8001221 A FR8001221 A FR 8001221A FR 8001221 A FR8001221 A FR 8001221A FR 2447130 A1 FR2447130 A1 FR 2447130A1
Authority
FR
France
Prior art keywords
printed circuit
circuit boards
metal
polymetallic
catalyst
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8001221A
Other languages
English (en)
Other versions
FR2447130B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Richardson Chemical Co
Original Assignee
Richardson Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Richardson Chemical Co filed Critical Richardson Chemical Co
Publication of FR2447130A1 publication Critical patent/FR2447130A1/fr
Application granted granted Critical
Publication of FR2447130B1 publication Critical patent/FR2447130B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Abstract

L'invention concerne le traitement de substrats métalliques de manière à les rendre catalytiques en vue de la déposition chimique subséquente de métaux. Le procédé de l'invention consiste notamment à traiter une plaque 11 portant le tracé 13 à circuit imprimé avec un catalyseur polymétallique comprenant un métal favorable à la déposition choisi entre Ni, Co et leurs associations, et un métal secondaire choisi entre Sn, Mo, Cu et W, l'agent catalytique favorisant le dépôt subséquent sur ce tracé 13 en l'interdisant en même temps sur des portions de la plaquette 11 qui n'appartiennent pas au tracé 13; puis à déposer sur le tracé 13 du circuit un métal choisi entre Ni, Co et des polyalliages de Ni ou Co. Les plaquettes à circuits imprimés réalisées conformément à la présente invention présentent moins de risque de court-circuit électrique que des plaquettes produites en l'absence des formulations catalytiques de l'invention.
FR8001221A 1979-01-22 1980-01-21 Procede, catalyseur et bain polymetalliques de production de plaquettes a circuits imprimes et produits obtenus Expired FR2447130B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/005,169 US4232060A (en) 1979-01-22 1979-01-22 Method of preparing substrate surface for electroless plating and products produced thereby

Publications (2)

Publication Number Publication Date
FR2447130A1 true FR2447130A1 (fr) 1980-08-14
FR2447130B1 FR2447130B1 (fr) 1988-02-05

Family

ID=21714519

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8001221A Expired FR2447130B1 (fr) 1979-01-22 1980-01-21 Procede, catalyseur et bain polymetalliques de production de plaquettes a circuits imprimes et produits obtenus

Country Status (8)

Country Link
US (1) US4232060A (fr)
JP (1) JPS55102297A (fr)
KR (1) KR880001664B1 (fr)
CA (1) CA1139012A (fr)
DE (1) DE3002166A1 (fr)
FR (1) FR2447130B1 (fr)
GB (1) GB2043115B (fr)
HK (1) HK82884A (fr)

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JPS6325518B2 (fr) 1988-05-25
GB2043115B (en) 1983-05-11
CA1139012A (fr) 1983-01-04
US4232060A (en) 1980-11-04
DE3002166C2 (fr) 1989-12-07
KR880001664B1 (ko) 1988-09-05
FR2447130B1 (fr) 1988-02-05
GB2043115A (en) 1980-10-01
HK82884A (en) 1984-11-09
DE3002166A1 (de) 1980-07-31
KR830002067A (ko) 1983-05-21
JPS55102297A (en) 1980-08-05

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