FR2411491A1 - Composition pour fabrication des conducteurs de courant de microcircuits integres et procede de fabrication des conducteurs de courant pour microcircuits integres par la mise en oeuvre de ladite composition - Google Patents

Composition pour fabrication des conducteurs de courant de microcircuits integres et procede de fabrication des conducteurs de courant pour microcircuits integres par la mise en oeuvre de ladite composition

Info

Publication number
FR2411491A1
FR2411491A1 FR7834247A FR7834247A FR2411491A1 FR 2411491 A1 FR2411491 A1 FR 2411491A1 FR 7834247 A FR7834247 A FR 7834247A FR 7834247 A FR7834247 A FR 7834247A FR 2411491 A1 FR2411491 A1 FR 2411491A1
Authority
FR
France
Prior art keywords
composition
current conductors
integrated microcircuits
manufacturing current
implementing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7834247A
Other languages
English (en)
Other versions
FR2411491B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BALTRUSHAITIS VALENTINAS
Original Assignee
BALTRUSHAITIS VALENTINAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BALTRUSHAITIS VALENTINAS filed Critical BALTRUSHAITIS VALENTINAS
Publication of FR2411491A1 publication Critical patent/FR2411491A1/fr
Application granted granted Critical
Publication of FR2411491B1 publication Critical patent/FR2411491B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)

Abstract

LA PRESENTE INVENTION CONCERNE UNE COMPOSITION ET UN PROCEDE POUR LA FABRICATION DES CONDUCTEURS DE COURANT DE MICROCIRCUITS INTEGRES. LA COMPOSITION SELON L'INVENTION EST ( EN POIDS): BORNYLMERCAPTIDE D'OR 22,2 A 20,0; BORNYLMERCAPTIDE DE RHODIUM 1,0 A 1,1; DIBUTYLDITHIOCARBAMATE DE BISMUTH 1,55 A 1,4; ABIETATE DE CHROME 1,10 A 1,20; COLOPHANE 10,55 A 9,5; CHLOROFORME 31,8 A 33,4 ET CYCLOHEXANONE 31,8 A 33,4. APPLICATION EN MICROELECTRONIQUE POUR LA FABRICATION DES CONDUCTEURS DE COURANT DES MICROCIRCUITS INTEGRES.
FR7834247A 1977-12-06 1978-12-05 Composition pour fabrication des conducteurs de courant de microcircuits integres et procede de fabrication des conducteurs de courant pour microcircuits integres par la mise en oeuvre de ladite composition Granted FR2411491A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU772550672A SU714508A1 (ru) 1977-12-06 1977-12-06 Токопровод ща композици

Publications (2)

Publication Number Publication Date
FR2411491A1 true FR2411491A1 (fr) 1979-07-06
FR2411491B1 FR2411491B1 (fr) 1984-07-20

Family

ID=20736142

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7834247A Granted FR2411491A1 (fr) 1977-12-06 1978-12-05 Composition pour fabrication des conducteurs de courant de microcircuits integres et procede de fabrication des conducteurs de courant pour microcircuits integres par la mise en oeuvre de ladite composition

Country Status (4)

Country Link
US (1) US4221826A (fr)
DE (1) DE2839833A1 (fr)
FR (1) FR2411491A1 (fr)
SU (1) SU714508A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0222618A2 (fr) * 1985-11-12 1987-05-20 Engelhard Corporation Circuit intégré hybride multicouche et son procédé de fabrication
EP0266877A2 (fr) * 1986-09-10 1988-05-11 Engelhard Corporation Substrats métallisés et procédé pour leur fabrication

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
DE3245392C2 (de) * 1982-12-08 1985-08-14 W.C. Heraeus Gmbh, 6450 Hanau Poliergoldpräparat
US4526807A (en) * 1984-04-27 1985-07-02 General Electric Company Method for deposition of elemental metals and metalloids on substrates
JPH07105282B2 (ja) * 1988-05-13 1995-11-13 富士ゼロックス株式会社 抵抗体及び抵抗体の製造方法
US5252764A (en) * 1990-12-18 1993-10-12 Degussa Aktiengesellschaft Preparation of gold (I) mercaptides
DE4040446A1 (de) * 1990-12-18 1992-06-25 Degussa Gold(i)mercaptocarbonsaeureester, verfahren zu ihrer herstellung und verwendung
DE69606942T2 (de) * 1995-09-25 2000-10-05 Dow Corning Corp., Midland Verwendung von präkeramischen Polymeren als Klebstoffe für Elektronik

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2490399A (en) * 1947-09-13 1949-12-06 Du Pont Gold compounds and ceramic-decorating compositions containing same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2994614A (en) * 1958-11-19 1961-08-01 Engelhard Ind Inc Gold decorating compositions containing gold primary mercaptides
BE621886A (fr) * 1961-08-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2490399A (en) * 1947-09-13 1949-12-06 Du Pont Gold compounds and ceramic-decorating compositions containing same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EXBK/70 *
EXBK/71 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0222618A2 (fr) * 1985-11-12 1987-05-20 Engelhard Corporation Circuit intégré hybride multicouche et son procédé de fabrication
EP0222618A3 (fr) * 1985-11-12 1988-08-17 Engelhard Corporation Circuit intégré hybride multicouche et son procédé de fabrication
EP0266877A2 (fr) * 1986-09-10 1988-05-11 Engelhard Corporation Substrats métallisés et procédé pour leur fabrication
EP0266877A3 (fr) * 1986-09-10 1989-12-13 Engelhard Corporation Substrats métallisés et procédé pour leur fabrication

Also Published As

Publication number Publication date
SU714508A1 (ru) 1980-02-05
DE2839833A1 (de) 1979-06-28
US4221826A (en) 1980-09-09
FR2411491B1 (fr) 1984-07-20

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Legal Events

Date Code Title Description
ST Notification of lapse