KR20250153317A - 박막 반도체 스위칭 장치 - Google Patents

박막 반도체 스위칭 장치

Info

Publication number
KR20250153317A
KR20250153317A KR1020257033608A KR20257033608A KR20250153317A KR 20250153317 A KR20250153317 A KR 20250153317A KR 1020257033608 A KR1020257033608 A KR 1020257033608A KR 20257033608 A KR20257033608 A KR 20257033608A KR 20250153317 A KR20250153317 A KR 20250153317A
Authority
KR
South Korea
Prior art keywords
material layer
thin film
source
film transistor
tft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257033608A
Other languages
English (en)
Korean (ko)
Inventor
더글라스 더블유. 발리지
링 젬 샤우트
케네스 씨. 캐디엔
알렉스 먼릭 마
에릭 윌슨 밀번
Original Assignee
지나이트 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 지나이트 코포레이션 filed Critical 지나이트 코포레이션
Publication of KR20250153317A publication Critical patent/KR20250153317A/ko
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6713Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6728Vertical TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6758Thin-film transistors [TFT] characterised by the insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/62Electrodes ohmically coupled to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00Three-dimensional [3D] integrated devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/20Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/427Power or ground buses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00Arrangements for protection of devices
    • H10W42/20Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/20Configurations of stacked chips
    • H10W90/297Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips

Landscapes

  • Thin Film Transistor (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
KR1020257033608A 2021-07-13 2022-07-08 박막 반도체 스위칭 장치 Pending KR20250153317A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163221292P 2021-07-13 2021-07-13
US63/221,292 2021-07-13
PCT/IB2022/056349 WO2023285936A1 (en) 2021-07-13 2022-07-08 Thin film semiconductor switching device
KR1020247002156A KR102870900B1 (ko) 2021-07-13 2022-07-08 박막 반도체 스위칭 장치

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020247002156A Division KR102870900B1 (ko) 2021-07-13 2022-07-08 박막 반도체 스위칭 장치

Publications (1)

Publication Number Publication Date
KR20250153317A true KR20250153317A (ko) 2025-10-24

Family

ID=84920064

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020257033608A Pending KR20250153317A (ko) 2021-07-13 2022-07-08 박막 반도체 스위칭 장치
KR1020247002156A Active KR102870900B1 (ko) 2021-07-13 2022-07-08 박막 반도체 스위칭 장치
KR1020257033605A Pending KR20250153316A (ko) 2021-07-13 2022-07-11 능동 비아
KR1020247003461A Active KR102870896B1 (ko) 2021-07-13 2022-07-11 능동 비아

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020247002156A Active KR102870900B1 (ko) 2021-07-13 2022-07-08 박막 반도체 스위칭 장치
KR1020257033605A Pending KR20250153316A (ko) 2021-07-13 2022-07-11 능동 비아
KR1020247003461A Active KR102870896B1 (ko) 2021-07-13 2022-07-11 능동 비아

Country Status (7)

Country Link
US (6) US20240332426A1 (https=)
EP (2) EP4371160A4 (https=)
JP (4) JP2024525817A (https=)
KR (4) KR20250153317A (https=)
CN (2) CN117795688A (https=)
CA (2) CA3224433A1 (https=)
WO (2) WO2023285936A1 (https=)

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US20260032965A1 (en) * 2024-07-25 2026-01-29 Zinite Corporation Thin-film transistors and related methods of manufacture with metal nitride source/drain

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Also Published As

Publication number Publication date
TW202303992A (zh) 2023-01-16
CA3224452A1 (en) 2023-01-19
EP4371152A1 (en) 2024-05-22
KR20240032856A (ko) 2024-03-12
KR20250153316A (ko) 2025-10-24
US20240055529A1 (en) 2024-02-15
CA3224433A1 (en) 2023-01-19
US12148838B2 (en) 2024-11-19
US20250234589A1 (en) 2025-07-17
US12446258B2 (en) 2025-10-14
CN117795688A (zh) 2024-03-29
EP4371152A4 (en) 2025-06-04
WO2023285936A1 (en) 2023-01-19
JP2026027531A (ja) 2026-02-18
US11949019B2 (en) 2024-04-02
US20250380453A1 (en) 2025-12-11
US20240136330A1 (en) 2024-04-25
EP4371160A4 (en) 2025-11-26
WO2023285951A1 (en) 2023-01-19
JP2024525817A (ja) 2024-07-12
JP2026027346A (ja) 2026-02-18
US20250022961A1 (en) 2025-01-16
US12593467B2 (en) 2026-03-31
CN117616559A (zh) 2024-02-27
KR20240035497A (ko) 2024-03-15
KR102870896B1 (ko) 2025-10-14
US20240332426A1 (en) 2024-10-03
TW202303897A (zh) 2023-01-16
JP7779997B2 (ja) 2025-12-03
KR102870900B1 (ko) 2025-10-15
EP4371160A1 (en) 2024-05-22
JP2024525824A (ja) 2024-07-12

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