CA3224433A1 - Thin film semiconductor switching device - Google Patents

Thin film semiconductor switching device Download PDF

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Publication number
CA3224433A1
CA3224433A1 CA3224433A CA3224433A CA3224433A1 CA 3224433 A1 CA3224433 A1 CA 3224433A1 CA 3224433 A CA3224433 A CA 3224433A CA 3224433 A CA3224433 A CA 3224433A CA 3224433 A1 CA3224433 A1 CA 3224433A1
Authority
CA
Canada
Prior art keywords
source
thin film
film transistor
channel
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA3224433A
Other languages
English (en)
French (fr)
Inventor
Douglas W. Barlage
Lhing Gem Shoute
Kenneth C. Cadien
Alex Munnlick Ma
Eric Wilson Milburn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zinite Corp
Original Assignee
Zinite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zinite Corp filed Critical Zinite Corp
Publication of CA3224433A1 publication Critical patent/CA3224433A1/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6713Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6728Vertical TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6758Thin-film transistors [TFT] characterised by the insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/62Electrodes ohmically coupled to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00Three-dimensional [3D] integrated devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/20Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/427Power or ground buses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00Arrangements for protection of devices
    • H10W42/20Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/20Configurations of stacked chips
    • H10W90/297Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips

Landscapes

  • Thin Film Transistor (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
CA3224433A 2021-07-13 2022-07-08 Thin film semiconductor switching device Pending CA3224433A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163221292P 2021-07-13 2021-07-13
US63/221,292 2021-07-13
PCT/IB2022/056349 WO2023285936A1 (en) 2021-07-13 2022-07-08 Thin film semiconductor switching device

Publications (1)

Publication Number Publication Date
CA3224433A1 true CA3224433A1 (en) 2023-01-19

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CA3224433A Pending CA3224433A1 (en) 2021-07-13 2022-07-08 Thin film semiconductor switching device
CA3224452A Pending CA3224452A1 (en) 2021-07-13 2022-07-11 Active via

Family Applications After (1)

Application Number Title Priority Date Filing Date
CA3224452A Pending CA3224452A1 (en) 2021-07-13 2022-07-11 Active via

Country Status (7)

Country Link
US (6) US20240332426A1 (https=)
EP (2) EP4371160A4 (https=)
JP (4) JP2024525817A (https=)
KR (4) KR20250153317A (https=)
CN (2) CN117795688A (https=)
CA (2) CA3224433A1 (https=)
WO (2) WO2023285936A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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WO2023285936A1 (en) 2021-07-13 2023-01-19 Zinite Corporation Thin film semiconductor switching device
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CN121014276A (zh) 2023-04-18 2025-11-25 任耐特公司 氮化铪粘附层
TW202505981A (zh) * 2023-07-26 2025-02-01 日商半導體能源研究所股份有限公司 氧化物半導體層、氧化物半導體層的製造方法、半導體裝置及半導體裝置的製造方法
US20250204015A1 (en) * 2023-12-14 2025-06-19 Zinite Corporation Gate stack for field effect transistors
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US20260032965A1 (en) * 2024-07-25 2026-01-29 Zinite Corporation Thin-film transistors and related methods of manufacture with metal nitride source/drain

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Also Published As

Publication number Publication date
TW202303992A (zh) 2023-01-16
CA3224452A1 (en) 2023-01-19
EP4371152A1 (en) 2024-05-22
KR20240032856A (ko) 2024-03-12
KR20250153316A (ko) 2025-10-24
US20240055529A1 (en) 2024-02-15
KR20250153317A (ko) 2025-10-24
US12148838B2 (en) 2024-11-19
US20250234589A1 (en) 2025-07-17
US12446258B2 (en) 2025-10-14
CN117795688A (zh) 2024-03-29
EP4371152A4 (en) 2025-06-04
WO2023285936A1 (en) 2023-01-19
JP2026027531A (ja) 2026-02-18
US11949019B2 (en) 2024-04-02
US20250380453A1 (en) 2025-12-11
US20240136330A1 (en) 2024-04-25
EP4371160A4 (en) 2025-11-26
WO2023285951A1 (en) 2023-01-19
JP2024525817A (ja) 2024-07-12
JP2026027346A (ja) 2026-02-18
US20250022961A1 (en) 2025-01-16
US12593467B2 (en) 2026-03-31
CN117616559A (zh) 2024-02-27
KR20240035497A (ko) 2024-03-15
KR102870896B1 (ko) 2025-10-14
US20240332426A1 (en) 2024-10-03
TW202303897A (zh) 2023-01-16
JP7779997B2 (ja) 2025-12-03
KR102870900B1 (ko) 2025-10-15
EP4371160A1 (en) 2024-05-22
JP2024525824A (ja) 2024-07-12

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