KR20240036698A - 결합 구조체를 위한 보호 반도체 소자 - Google Patents
결합 구조체를 위한 보호 반도체 소자 Download PDFInfo
- Publication number
- KR20240036698A KR20240036698A KR1020247006997A KR20247006997A KR20240036698A KR 20240036698 A KR20240036698 A KR 20240036698A KR 1020247006997 A KR1020247006997 A KR 1020247006997A KR 20247006997 A KR20247006997 A KR 20247006997A KR 20240036698 A KR20240036698 A KR 20240036698A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- protection
- protective
- active
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H01L23/576—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
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- H01L23/573—
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- H01L24/05—
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- H01L24/08—
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- H01L24/80—
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- H01L25/0657—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
- H10W42/405—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering using active circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H01L2224/05541—
-
- H01L2224/08146—
-
- H01L2224/80385—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
- H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips
Landscapes
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163203867P | 2021-08-02 | 2021-08-02 | |
| US63/203,867 | 2021-08-02 | ||
| PCT/US2022/038921 WO2023014616A1 (en) | 2021-08-02 | 2022-07-29 | Protective semiconductor elements for bonded structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240036698A true KR20240036698A (ko) | 2024-03-20 |
Family
ID=85038838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247006997A Pending KR20240036698A (ko) | 2021-08-02 | 2022-07-29 | 결합 구조체를 위한 보호 반도체 소자 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US12300634B2 (https=) |
| EP (1) | EP4381540A4 (https=) |
| JP (1) | JP2024528964A (https=) |
| KR (1) | KR20240036698A (https=) |
| CN (1) | CN118103972A (https=) |
| TW (1) | TW202312358A (https=) |
| WO (1) | WO2023014616A1 (https=) |
Families Citing this family (87)
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| TWI837879B (zh) | 2016-12-29 | 2024-04-01 | 美商艾德亞半導體接合科技有限公司 | 具有整合式被動構件的接合結構 |
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| US10217720B2 (en) | 2017-06-15 | 2019-02-26 | Invensas Corporation | Multi-chip modules formed using wafer-level processing of a reconstitute wafer |
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| US11031285B2 (en) | 2017-10-06 | 2021-06-08 | Invensas Bonding Technologies, Inc. | Diffusion barrier collar for interconnects |
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| US11244916B2 (en) | 2018-04-11 | 2022-02-08 | Invensas Bonding Technologies, Inc. | Low temperature bonded structures |
| US10790262B2 (en) | 2018-04-11 | 2020-09-29 | Invensas Bonding Technologies, Inc. | Low temperature bonded structures |
| US10964664B2 (en) | 2018-04-20 | 2021-03-30 | Invensas Bonding Technologies, Inc. | DBI to Si bonding for simplified handle wafer |
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| US11276676B2 (en) | 2018-05-15 | 2022-03-15 | Invensas Bonding Technologies, Inc. | Stacked devices and methods of fabrication |
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| EP4381540A1 (en) | 2024-06-12 |
| JP2024528964A (ja) | 2024-08-01 |
| CN118103972A (zh) | 2024-05-28 |
| WO2023014616A1 (en) | 2023-02-09 |
| TW202312358A (zh) | 2023-03-16 |
| US20250233086A1 (en) | 2025-07-17 |
| EP4381540A4 (en) | 2025-06-18 |
| US12300634B2 (en) | 2025-05-13 |
| US20230036441A1 (en) | 2023-02-02 |
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