KR20230098160A - 중공 입자의 제조 방법 및 중공 입자 - Google Patents

중공 입자의 제조 방법 및 중공 입자 Download PDF

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Publication number
KR20230098160A
KR20230098160A KR1020237012874A KR20237012874A KR20230098160A KR 20230098160 A KR20230098160 A KR 20230098160A KR 1020237012874 A KR1020237012874 A KR 1020237012874A KR 20237012874 A KR20237012874 A KR 20237012874A KR 20230098160 A KR20230098160 A KR 20230098160A
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KR
South Korea
Prior art keywords
hollow
particles
hollow particles
hydrophobic solvent
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237012874A
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English (en)
Korean (ko)
Inventor
사쿄 야규
Original Assignee
니폰 제온 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니폰 제온 가부시키가이샤 filed Critical 니폰 제온 가부시키가이샤
Publication of KR20230098160A publication Critical patent/KR20230098160A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F12/36—Divinylbenzene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/06—Making microcapsules or microballoons by phase separation
    • B01J13/14—Polymerisation; cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/06—Making microcapsules or microballoons by phase separation
    • B01J13/14—Polymerisation; cross-linking
    • B01J13/16—Interfacial polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/12—Polymerisation in non-solvents
    • C08F2/16—Aqueous medium
    • C08F2/18—Suspension polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/53—Core-shell polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
KR1020237012874A 2020-10-30 2021-10-26 중공 입자의 제조 방법 및 중공 입자 Pending KR20230098160A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-182283 2020-10-30
JP2020182283 2020-10-30
PCT/JP2021/039457 WO2022092076A1 (ja) 2020-10-30 2021-10-26 中空粒子の製造方法及び中空粒子

Publications (1)

Publication Number Publication Date
KR20230098160A true KR20230098160A (ko) 2023-07-03

Family

ID=81383939

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237012874A Pending KR20230098160A (ko) 2020-10-30 2021-10-26 중공 입자의 제조 방법 및 중공 입자

Country Status (7)

Country Link
US (1) US20230383021A1 (https=)
EP (1) EP4238998A4 (https=)
JP (1) JPWO2022092076A1 (https=)
KR (1) KR20230098160A (https=)
CN (1) CN116390958A (https=)
TW (1) TW202231349A (https=)
WO (1) WO2022092076A1 (https=)

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WO2022107674A1 (ja) * 2020-11-20 2022-05-27 日本ゼオン株式会社 中空粒子
WO2023106307A1 (ja) * 2021-12-10 2023-06-15 日本ゼオン株式会社 中空粒子、樹脂組成物、及び樹脂成形体
WO2023228964A1 (ja) * 2022-05-26 2023-11-30 日本ゼオン株式会社 中空粒子、樹脂組成物、樹脂成形体、封止用樹脂組成物、硬化物、及び半導体装置
US20250282116A1 (en) * 2022-06-21 2025-09-11 Resonac Corporation Sheet comprising thermal insulation layer and adhesive layer
US20260078240A1 (en) 2022-08-30 2026-03-19 Zeon Corporation Hollow particles, resin composition and molded body
EP4613783A1 (en) * 2022-10-31 2025-09-10 Zeon Corporation Hollow particles, manufacturing method of hollow particles, resin composition and resin structure
WO2024203876A1 (ja) 2023-03-24 2024-10-03 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2000313818A (ja) 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP2004190038A (ja) 2004-03-08 2004-07-08 New Industry Research Organization 中空高分子微粒子及びその製造法

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JP2000315845A (ja) * 1999-04-28 2000-11-14 Jsr Corp 回路基板
US6146749A (en) * 1999-05-03 2000-11-14 Jsr Corporation Low dielectric composition, insulating material, sealing material, and circuit board
JP2003181274A (ja) * 2001-12-18 2003-07-02 Sekisui Chem Co Ltd 中空ポリマー粒子の製造方法
JP4171489B2 (ja) * 2003-01-28 2008-10-22 松下電工株式会社 中空粒子を含有する樹脂組成物、同組成物を含むプリプレグおよび積層板
JP4626194B2 (ja) * 2004-06-22 2011-02-02 パナソニック電工株式会社 電気絶縁性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP4884053B2 (ja) * 2006-03-31 2012-02-22 株式会社スマート粒子創造工房 内部に空隙を有する微粒子の製造方法
JP2008115280A (ja) * 2006-11-06 2008-05-22 Hitachi Ltd 低誘電損失樹脂組成物、その硬化物およびそれを用いた電子部品
EP2098550A4 (en) * 2006-12-28 2010-02-03 Zeon Corp POLYMERIZABLE COMPOSITION
JP2008231241A (ja) * 2007-03-20 2008-10-02 Sanyo Chem Ind Ltd 中空樹脂粒子
JP5727962B2 (ja) * 2012-04-16 2015-06-03 三光株式会社 非膨張型中空ポリマー微粒子の製造方法
KR101597346B1 (ko) * 2014-05-30 2016-02-25 (주) 유니플라텍 저비중 도전 입자를 포함하는 코팅제 조성물을 이용한 전자파 차폐 필름
JP6641724B2 (ja) * 2015-05-11 2020-02-05 コニカミノルタ株式会社 中空樹脂粒子およびその製造方法
JP7107634B2 (ja) * 2015-12-28 2022-07-27 ジャパンコーティングレジン株式会社 中空ポリマー粒子、ポリマー粒子懸濁液の製造方法、および中空ポリマー粒子の製造方法
US11760857B2 (en) * 2017-08-01 2023-09-19 Zeon Corporation Method for producing latex and method for producing hollow resin particles
EP4234650B1 (en) * 2018-03-30 2024-11-27 Zeon Corporation Hollow resin particles and sheet
JP7294345B2 (ja) * 2018-09-28 2023-06-20 日本ゼオン株式会社 樹脂組成物及びその成形体
EP3922650A4 (en) * 2019-02-06 2022-10-26 Zeon Corporation PROCESS FOR MANUFACTURING HOLLOW RESIN PARTICLES
JP7342376B2 (ja) * 2019-02-25 2023-09-12 日本ゼオン株式会社 中空樹脂粒子の製造方法
EP3992213A4 (en) * 2019-06-27 2023-07-26 Zeon Corporation PROCESS FOR PRODUCTION OF HOLLOW RESIN PARTICLES
US12485399B2 (en) * 2019-12-06 2025-12-02 Zeon Corporation Hollow particles, resin composition and molded body
WO2021112117A1 (ja) * 2019-12-06 2021-06-10 日本ゼオン株式会社 中空粒子の製造方法
CN116194495B (zh) * 2020-09-30 2024-06-28 日本瑞翁株式会社 中空颗粒
WO2022071276A1 (ja) * 2020-09-30 2022-04-07 日本ゼオン株式会社 中空粒子の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000313818A (ja) 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP2004190038A (ja) 2004-03-08 2004-07-08 New Industry Research Organization 中空高分子微粒子及びその製造法

Also Published As

Publication number Publication date
EP4238998A4 (en) 2025-03-26
JPWO2022092076A1 (https=) 2022-05-05
WO2022092076A1 (ja) 2022-05-05
TW202231349A (zh) 2022-08-16
CN116390958A (zh) 2023-07-04
US20230383021A1 (en) 2023-11-30
EP4238998A1 (en) 2023-09-06

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