JPWO2022092076A1 - - Google Patents
Info
- Publication number
- JPWO2022092076A1 JPWO2022092076A1 JP2022559152A JP2022559152A JPWO2022092076A1 JP WO2022092076 A1 JPWO2022092076 A1 JP WO2022092076A1 JP 2022559152 A JP2022559152 A JP 2022559152A JP 2022559152 A JP2022559152 A JP 2022559152A JP WO2022092076 A1 JPWO2022092076 A1 JP WO2022092076A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/06—Making microcapsules or microballoons by phase separation
- B01J13/14—Polymerisation; cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/06—Making microcapsules or microballoons by phase separation
- B01J13/14—Polymerisation; cross-linking
- B01J13/16—Interfacial polymerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
- C08F12/36—Divinylbenzene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/12—Polymerisation in non-solvents
- C08F2/16—Aqueous medium
- C08F2/18—Suspension polymerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacturing Of Micro-Capsules (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020182283 | 2020-10-30 | ||
| PCT/JP2021/039457 WO2022092076A1 (ja) | 2020-10-30 | 2021-10-26 | 中空粒子の製造方法及び中空粒子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022092076A1 true JPWO2022092076A1 (https=) | 2022-05-05 |
Family
ID=81383939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022559152A Pending JPWO2022092076A1 (https=) | 2020-10-30 | 2021-10-26 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230383021A1 (https=) |
| EP (1) | EP4238998A4 (https=) |
| JP (1) | JPWO2022092076A1 (https=) |
| KR (1) | KR20230098160A (https=) |
| CN (1) | CN116390958A (https=) |
| TW (1) | TW202231349A (https=) |
| WO (1) | WO2022092076A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022107674A1 (ja) * | 2020-11-20 | 2022-05-27 | 日本ゼオン株式会社 | 中空粒子 |
| WO2023106307A1 (ja) * | 2021-12-10 | 2023-06-15 | 日本ゼオン株式会社 | 中空粒子、樹脂組成物、及び樹脂成形体 |
| WO2023228964A1 (ja) * | 2022-05-26 | 2023-11-30 | 日本ゼオン株式会社 | 中空粒子、樹脂組成物、樹脂成形体、封止用樹脂組成物、硬化物、及び半導体装置 |
| US20250282116A1 (en) * | 2022-06-21 | 2025-09-11 | Resonac Corporation | Sheet comprising thermal insulation layer and adhesive layer |
| US20260078240A1 (en) | 2022-08-30 | 2026-03-19 | Zeon Corporation | Hollow particles, resin composition and molded body |
| EP4613783A1 (en) * | 2022-10-31 | 2025-09-10 | Zeon Corporation | Hollow particles, manufacturing method of hollow particles, resin composition and resin structure |
| WO2024203876A1 (ja) | 2023-03-24 | 2024-10-03 | 積水化成品工業株式会社 | 中空樹脂粒子、その製造方法、およびその用途 |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315845A (ja) * | 1999-04-28 | 2000-11-14 | Jsr Corp | 回路基板 |
| JP2003181274A (ja) * | 2001-12-18 | 2003-07-02 | Sekisui Chem Co Ltd | 中空ポリマー粒子の製造方法 |
| WO2004067638A1 (ja) * | 2003-01-28 | 2004-08-12 | Matsushita Electric Works, Ltd. | 中空粒子を含有する樹脂組成物、同組成物を含むプリプレグおよび積層板 |
| JP2006008750A (ja) * | 2004-06-22 | 2006-01-12 | Matsushita Electric Works Ltd | 電気絶縁性樹脂組成物、プリプレグ、積層板及び多層プリント配線板 |
| JP2007270096A (ja) * | 2006-03-31 | 2007-10-18 | Kobe Univ | 内部に空隙を有する微粒子の製造方法 |
| JP2008115280A (ja) * | 2006-11-06 | 2008-05-22 | Hitachi Ltd | 低誘電損失樹脂組成物、その硬化物およびそれを用いた電子部品 |
| JP2008231241A (ja) * | 2007-03-20 | 2008-10-02 | Sanyo Chem Ind Ltd | 中空樹脂粒子 |
| JP2013221070A (ja) * | 2012-04-16 | 2013-10-28 | Sanko Kk | 中空ポリマー微粒子とその製造方法 |
| KR20150137783A (ko) * | 2014-05-30 | 2015-12-09 | (주) 유니플라텍 | 저비중 도전 입자를 포함하는 코팅제 조성물을 이용한 전자파 차폐 필름 |
| JP2016210902A (ja) * | 2015-05-11 | 2016-12-15 | コニカミノルタ株式会社 | 中空樹脂粒子およびその製造方法 |
| JP2017119843A (ja) * | 2015-12-28 | 2017-07-06 | 日本合成化学工業株式会社 | 中空ポリマー粒子、ポリマー粒子懸濁液の製造方法、および中空ポリマー粒子の製造方法 |
| WO2019026899A1 (ja) * | 2017-08-01 | 2019-02-07 | 日本ゼオン株式会社 | ラテックスの製造方法及び中空樹脂粒子の製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000313818A (ja) | 1999-03-03 | 2000-11-14 | Jsr Corp | 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板 |
| US6146749A (en) * | 1999-05-03 | 2000-11-14 | Jsr Corporation | Low dielectric composition, insulating material, sealing material, and circuit board |
| JP3600845B2 (ja) | 2004-03-08 | 2004-12-15 | 財団法人新産業創造研究機構 | 中空高分子微粒子及びその製造法 |
| EP2098550A4 (en) * | 2006-12-28 | 2010-02-03 | Zeon Corp | POLYMERIZABLE COMPOSITION |
| EP4234650B1 (en) * | 2018-03-30 | 2024-11-27 | Zeon Corporation | Hollow resin particles and sheet |
| JP7294345B2 (ja) * | 2018-09-28 | 2023-06-20 | 日本ゼオン株式会社 | 樹脂組成物及びその成形体 |
| EP3922650A4 (en) * | 2019-02-06 | 2022-10-26 | Zeon Corporation | PROCESS FOR MANUFACTURING HOLLOW RESIN PARTICLES |
| JP7342376B2 (ja) * | 2019-02-25 | 2023-09-12 | 日本ゼオン株式会社 | 中空樹脂粒子の製造方法 |
| EP3992213A4 (en) * | 2019-06-27 | 2023-07-26 | Zeon Corporation | PROCESS FOR PRODUCTION OF HOLLOW RESIN PARTICLES |
| US12485399B2 (en) * | 2019-12-06 | 2025-12-02 | Zeon Corporation | Hollow particles, resin composition and molded body |
| WO2021112117A1 (ja) * | 2019-12-06 | 2021-06-10 | 日本ゼオン株式会社 | 中空粒子の製造方法 |
| CN116194495B (zh) * | 2020-09-30 | 2024-06-28 | 日本瑞翁株式会社 | 中空颗粒 |
| WO2022071276A1 (ja) * | 2020-09-30 | 2022-04-07 | 日本ゼオン株式会社 | 中空粒子の製造方法 |
-
2021
- 2021-10-26 KR KR1020237012874A patent/KR20230098160A/ko active Pending
- 2021-10-26 US US18/031,815 patent/US20230383021A1/en active Pending
- 2021-10-26 EP EP21886194.6A patent/EP4238998A4/en active Pending
- 2021-10-26 JP JP2022559152A patent/JPWO2022092076A1/ja active Pending
- 2021-10-26 CN CN202180070712.9A patent/CN116390958A/zh active Pending
- 2021-10-26 WO PCT/JP2021/039457 patent/WO2022092076A1/ja not_active Ceased
- 2021-10-29 TW TW110140187A patent/TW202231349A/zh unknown
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315845A (ja) * | 1999-04-28 | 2000-11-14 | Jsr Corp | 回路基板 |
| JP2003181274A (ja) * | 2001-12-18 | 2003-07-02 | Sekisui Chem Co Ltd | 中空ポリマー粒子の製造方法 |
| WO2004067638A1 (ja) * | 2003-01-28 | 2004-08-12 | Matsushita Electric Works, Ltd. | 中空粒子を含有する樹脂組成物、同組成物を含むプリプレグおよび積層板 |
| JP2006008750A (ja) * | 2004-06-22 | 2006-01-12 | Matsushita Electric Works Ltd | 電気絶縁性樹脂組成物、プリプレグ、積層板及び多層プリント配線板 |
| JP2007270096A (ja) * | 2006-03-31 | 2007-10-18 | Kobe Univ | 内部に空隙を有する微粒子の製造方法 |
| JP2008115280A (ja) * | 2006-11-06 | 2008-05-22 | Hitachi Ltd | 低誘電損失樹脂組成物、その硬化物およびそれを用いた電子部品 |
| JP2008231241A (ja) * | 2007-03-20 | 2008-10-02 | Sanyo Chem Ind Ltd | 中空樹脂粒子 |
| JP2013221070A (ja) * | 2012-04-16 | 2013-10-28 | Sanko Kk | 中空ポリマー微粒子とその製造方法 |
| KR20150137783A (ko) * | 2014-05-30 | 2015-12-09 | (주) 유니플라텍 | 저비중 도전 입자를 포함하는 코팅제 조성물을 이용한 전자파 차폐 필름 |
| JP2016210902A (ja) * | 2015-05-11 | 2016-12-15 | コニカミノルタ株式会社 | 中空樹脂粒子およびその製造方法 |
| JP2017119843A (ja) * | 2015-12-28 | 2017-07-06 | 日本合成化学工業株式会社 | 中空ポリマー粒子、ポリマー粒子懸濁液の製造方法、および中空ポリマー粒子の製造方法 |
| WO2019026899A1 (ja) * | 2017-08-01 | 2019-02-07 | 日本ゼオン株式会社 | ラテックスの製造方法及び中空樹脂粒子の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4238998A4 (en) | 2025-03-26 |
| KR20230098160A (ko) | 2023-07-03 |
| WO2022092076A1 (ja) | 2022-05-05 |
| TW202231349A (zh) | 2022-08-16 |
| CN116390958A (zh) | 2023-07-04 |
| US20230383021A1 (en) | 2023-11-30 |
| EP4238998A1 (en) | 2023-09-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240924 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20251111 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260106 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260108 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20260414 |