TW202231349A - 空心粒子的製造方法及空心粒子 - Google Patents

空心粒子的製造方法及空心粒子 Download PDF

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Publication number
TW202231349A
TW202231349A TW110140187A TW110140187A TW202231349A TW 202231349 A TW202231349 A TW 202231349A TW 110140187 A TW110140187 A TW 110140187A TW 110140187 A TW110140187 A TW 110140187A TW 202231349 A TW202231349 A TW 202231349A
Authority
TW
Taiwan
Prior art keywords
hollow
particles
hollow particles
solvent
hydrophobic solvent
Prior art date
Application number
TW110140187A
Other languages
English (en)
Chinese (zh)
Inventor
柳生左京
Original Assignee
日商日本瑞翁股份有限公司
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Publication date
Application filed by 日商日本瑞翁股份有限公司 filed Critical 日商日本瑞翁股份有限公司
Publication of TW202231349A publication Critical patent/TW202231349A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/06—Making microcapsules or microballoons by phase separation
    • B01J13/14—Polymerisation; cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/06—Making microcapsules or microballoons by phase separation
    • B01J13/14—Polymerisation; cross-linking
    • B01J13/16—Interfacial polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F12/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/12—Polymerisation in non-solvents
    • C08F2/16—Aqueous medium
    • C08F2/18—Suspension polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/53—Core-shell polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
TW110140187A 2020-10-30 2021-10-29 空心粒子的製造方法及空心粒子 TW202231349A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-182283 2020-10-30
JP2020182283 2020-10-30

Publications (1)

Publication Number Publication Date
TW202231349A true TW202231349A (zh) 2022-08-16

Family

ID=81383939

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140187A TW202231349A (zh) 2020-10-30 2021-10-29 空心粒子的製造方法及空心粒子

Country Status (7)

Country Link
US (1) US20230383021A1 (https=)
EP (1) EP4238998A4 (https=)
JP (1) JPWO2022092076A1 (https=)
KR (1) KR20230098160A (https=)
CN (1) CN116390958A (https=)
TW (1) TW202231349A (https=)
WO (1) WO2022092076A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022107674A1 (ja) * 2020-11-20 2022-05-27 日本ゼオン株式会社 中空粒子
WO2023106307A1 (ja) * 2021-12-10 2023-06-15 日本ゼオン株式会社 中空粒子、樹脂組成物、及び樹脂成形体
WO2023228964A1 (ja) * 2022-05-26 2023-11-30 日本ゼオン株式会社 中空粒子、樹脂組成物、樹脂成形体、封止用樹脂組成物、硬化物、及び半導体装置
US20250282116A1 (en) * 2022-06-21 2025-09-11 Resonac Corporation Sheet comprising thermal insulation layer and adhesive layer
US20260078240A1 (en) 2022-08-30 2026-03-19 Zeon Corporation Hollow particles, resin composition and molded body
EP4613783A1 (en) * 2022-10-31 2025-09-10 Zeon Corporation Hollow particles, manufacturing method of hollow particles, resin composition and resin structure
WO2024203876A1 (ja) 2023-03-24 2024-10-03 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途

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JP2000313818A (ja) 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP2000315845A (ja) * 1999-04-28 2000-11-14 Jsr Corp 回路基板
US6146749A (en) * 1999-05-03 2000-11-14 Jsr Corporation Low dielectric composition, insulating material, sealing material, and circuit board
JP2003181274A (ja) * 2001-12-18 2003-07-02 Sekisui Chem Co Ltd 中空ポリマー粒子の製造方法
JP4171489B2 (ja) * 2003-01-28 2008-10-22 松下電工株式会社 中空粒子を含有する樹脂組成物、同組成物を含むプリプレグおよび積層板
JP3600845B2 (ja) 2004-03-08 2004-12-15 財団法人新産業創造研究機構 中空高分子微粒子及びその製造法
JP4626194B2 (ja) * 2004-06-22 2011-02-02 パナソニック電工株式会社 電気絶縁性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP4884053B2 (ja) * 2006-03-31 2012-02-22 株式会社スマート粒子創造工房 内部に空隙を有する微粒子の製造方法
JP2008115280A (ja) * 2006-11-06 2008-05-22 Hitachi Ltd 低誘電損失樹脂組成物、その硬化物およびそれを用いた電子部品
EP2098550A4 (en) * 2006-12-28 2010-02-03 Zeon Corp POLYMERIZABLE COMPOSITION
JP2008231241A (ja) * 2007-03-20 2008-10-02 Sanyo Chem Ind Ltd 中空樹脂粒子
JP5727962B2 (ja) * 2012-04-16 2015-06-03 三光株式会社 非膨張型中空ポリマー微粒子の製造方法
KR101597346B1 (ko) * 2014-05-30 2016-02-25 (주) 유니플라텍 저비중 도전 입자를 포함하는 코팅제 조성물을 이용한 전자파 차폐 필름
JP6641724B2 (ja) * 2015-05-11 2020-02-05 コニカミノルタ株式会社 中空樹脂粒子およびその製造方法
JP7107634B2 (ja) * 2015-12-28 2022-07-27 ジャパンコーティングレジン株式会社 中空ポリマー粒子、ポリマー粒子懸濁液の製造方法、および中空ポリマー粒子の製造方法
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EP3992213A4 (en) * 2019-06-27 2023-07-26 Zeon Corporation PROCESS FOR PRODUCTION OF HOLLOW RESIN PARTICLES
US12485399B2 (en) * 2019-12-06 2025-12-02 Zeon Corporation Hollow particles, resin composition and molded body
WO2021112117A1 (ja) * 2019-12-06 2021-06-10 日本ゼオン株式会社 中空粒子の製造方法
CN116194495B (zh) * 2020-09-30 2024-06-28 日本瑞翁株式会社 中空颗粒
WO2022071276A1 (ja) * 2020-09-30 2022-04-07 日本ゼオン株式会社 中空粒子の製造方法

Also Published As

Publication number Publication date
EP4238998A4 (en) 2025-03-26
JPWO2022092076A1 (https=) 2022-05-05
KR20230098160A (ko) 2023-07-03
WO2022092076A1 (ja) 2022-05-05
CN116390958A (zh) 2023-07-04
US20230383021A1 (en) 2023-11-30
EP4238998A1 (en) 2023-09-06

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