KR20230071116A - 대전 방지성 수지 조성물, 수지 필름 및 대전 방지성 다이싱 테이프용 기재 필름 - Google Patents

대전 방지성 수지 조성물, 수지 필름 및 대전 방지성 다이싱 테이프용 기재 필름 Download PDF

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KR20230071116A
KR20230071116A KR1020237003911A KR20237003911A KR20230071116A KR 20230071116 A KR20230071116 A KR 20230071116A KR 1020237003911 A KR1020237003911 A KR 1020237003911A KR 20237003911 A KR20237003911 A KR 20237003911A KR 20230071116 A KR20230071116 A KR 20230071116A
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South Korea
Prior art keywords
mass
propylene
component
resin
parts
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KR1020237003911A
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English (en)
Korean (ko)
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고스케 신보
겐 사이토
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리껭테크노스 가부시키가이샤
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Publication of KR20230071116A publication Critical patent/KR20230071116A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/04—Antistatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1020237003911A 2020-09-24 2021-08-26 대전 방지성 수지 조성물, 수지 필름 및 대전 방지성 다이싱 테이프용 기재 필름 KR20230071116A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020159210 2020-09-24
JPJP-P-2020-159210 2020-09-24
PCT/JP2021/031337 WO2022064949A1 (ja) 2020-09-24 2021-08-26 帯電防止性樹脂組成物、樹脂フィルム及び帯電防止性ダイシングテープ用基材フィルム

Publications (1)

Publication Number Publication Date
KR20230071116A true KR20230071116A (ko) 2023-05-23

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ID=80845154

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237003911A KR20230071116A (ko) 2020-09-24 2021-08-26 대전 방지성 수지 조성물, 수지 필름 및 대전 방지성 다이싱 테이프용 기재 필름

Country Status (5)

Country Link
JP (1) JPWO2022064949A1 (zh)
KR (1) KR20230071116A (zh)
CN (1) CN115996981B (zh)
TW (1) TW202229450A (zh)
WO (1) WO2022064949A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244377A (ja) 2007-03-29 2008-10-09 Sumitomo Bakelite Co Ltd シート及び半導体ウエハ加工用粘着テープ
JP2011210887A (ja) 2010-03-29 2011-10-20 Furukawa Electric Co Ltd:The 放射線硬化型ウエハ加工用粘着テープ
JP2017098369A (ja) 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5193474B2 (ja) * 2006-02-23 2013-05-08 テクノポリマー株式会社 多層シートおよび成形品
JP5361136B2 (ja) * 2006-03-16 2013-12-04 テクノポリマー株式会社 制電性樹脂組成物および成形品
JP4916741B2 (ja) * 2006-03-24 2012-04-18 住友化学株式会社 積層体及び電子部品搬送用トレイ
JP5863157B2 (ja) * 2006-12-18 2016-02-16 日東電工株式会社 粘着シート
JP2008274031A (ja) * 2007-04-26 2008-11-13 Sumitomo Chemical Co Ltd 帯電防止性樹脂組成物および熱可塑性樹脂製多層シート
JP4951484B2 (ja) * 2007-12-12 2012-06-13 ダイセルパックシステムズ株式会社 帯電防止性シート及び包装用成形品
JP5954943B2 (ja) * 2010-07-12 2016-07-20 三井化学東セロ株式会社 積層フィルム
KR102513777B1 (ko) * 2015-08-05 2023-03-24 리켄 테크노스 가부시키가이샤 제전성 수지 조성물
JP2017214491A (ja) * 2016-05-31 2017-12-07 旭化成株式会社 樹脂組成物及び成形体
JP7222679B2 (ja) * 2018-11-30 2023-02-15 ダイヤプラスフィルム株式会社 半導体製造工程用基材フィルム及び該基材フィルムを用いたダイシング用粘着フィルム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244377A (ja) 2007-03-29 2008-10-09 Sumitomo Bakelite Co Ltd シート及び半導体ウエハ加工用粘着テープ
JP2011210887A (ja) 2010-03-29 2011-10-20 Furukawa Electric Co Ltd:The 放射線硬化型ウエハ加工用粘着テープ
JP2017098369A (ja) 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム

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Publication number Publication date
TW202229450A (zh) 2022-08-01
CN115996981B (zh) 2024-09-17
CN115996981A (zh) 2023-04-21
JPWO2022064949A1 (zh) 2022-03-31
WO2022064949A1 (ja) 2022-03-31

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