JPWO2022064949A1 - - Google Patents
Info
- Publication number
- JPWO2022064949A1 JPWO2022064949A1 JP2022551217A JP2022551217A JPWO2022064949A1 JP WO2022064949 A1 JPWO2022064949 A1 JP WO2022064949A1 JP 2022551217 A JP2022551217 A JP 2022551217A JP 2022551217 A JP2022551217 A JP 2022551217A JP WO2022064949 A1 JPWO2022064949 A1 JP WO2022064949A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020159210 | 2020-09-24 | ||
PCT/JP2021/031337 WO2022064949A1 (ja) | 2020-09-24 | 2021-08-26 | 帯電防止性樹脂組成物、樹脂フィルム及び帯電防止性ダイシングテープ用基材フィルム |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022064949A1 true JPWO2022064949A1 (zh) | 2022-03-31 |
Family
ID=80845154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022551217A Pending JPWO2022064949A1 (zh) | 2020-09-24 | 2021-08-26 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022064949A1 (zh) |
KR (1) | KR20230071116A (zh) |
CN (1) | CN115996981A (zh) |
TW (1) | TW202229450A (zh) |
WO (1) | WO2022064949A1 (zh) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5193474B2 (ja) * | 2006-02-23 | 2013-05-08 | テクノポリマー株式会社 | 多層シートおよび成形品 |
JP5361136B2 (ja) * | 2006-03-16 | 2013-12-04 | テクノポリマー株式会社 | 制電性樹脂組成物および成形品 |
JP4916741B2 (ja) * | 2006-03-24 | 2012-04-18 | 住友化学株式会社 | 積層体及び電子部品搬送用トレイ |
JP5863157B2 (ja) * | 2006-12-18 | 2016-02-16 | 日東電工株式会社 | 粘着シート |
JP5056112B2 (ja) | 2007-03-29 | 2012-10-24 | 住友ベークライト株式会社 | シート及び半導体ウエハ加工用粘着テープ |
JP2008274031A (ja) * | 2007-04-26 | 2008-11-13 | Sumitomo Chemical Co Ltd | 帯電防止性樹脂組成物および熱可塑性樹脂製多層シート |
JP4951484B2 (ja) * | 2007-12-12 | 2012-06-13 | ダイセルパックシステムズ株式会社 | 帯電防止性シート及び包装用成形品 |
JP2011210887A (ja) | 2010-03-29 | 2011-10-20 | Furukawa Electric Co Ltd:The | 放射線硬化型ウエハ加工用粘着テープ |
JP5954943B2 (ja) * | 2010-07-12 | 2016-07-20 | 三井化学東セロ株式会社 | 積層フィルム |
JP6656253B2 (ja) * | 2015-08-05 | 2020-03-04 | リケンテクノス株式会社 | 制電性樹脂組成物 |
JP6554708B2 (ja) | 2015-11-20 | 2019-08-07 | 三井・ダウポリケミカル株式会社 | ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム |
JP2017214491A (ja) * | 2016-05-31 | 2017-12-07 | 旭化成株式会社 | 樹脂組成物及び成形体 |
JP7222679B2 (ja) * | 2018-11-30 | 2023-02-15 | ダイヤプラスフィルム株式会社 | 半導体製造工程用基材フィルム及び該基材フィルムを用いたダイシング用粘着フィルム |
-
2021
- 2021-08-26 KR KR1020237003911A patent/KR20230071116A/ko active Search and Examination
- 2021-08-26 CN CN202180052830.7A patent/CN115996981A/zh active Pending
- 2021-08-26 JP JP2022551217A patent/JPWO2022064949A1/ja active Pending
- 2021-08-26 WO PCT/JP2021/031337 patent/WO2022064949A1/ja active Application Filing
- 2021-09-01 TW TW110132516A patent/TW202229450A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202229450A (zh) | 2022-08-01 |
CN115996981A (zh) | 2023-04-21 |
WO2022064949A1 (ja) | 2022-03-31 |
KR20230071116A (ko) | 2023-05-23 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20230110 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240617 |