WO2022064949A1 - 帯電防止性樹脂組成物、樹脂フィルム及び帯電防止性ダイシングテープ用基材フィルム - Google Patents

帯電防止性樹脂組成物、樹脂フィルム及び帯電防止性ダイシングテープ用基材フィルム Download PDF

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WO2022064949A1
WO2022064949A1 PCT/JP2021/031337 JP2021031337W WO2022064949A1 WO 2022064949 A1 WO2022064949 A1 WO 2022064949A1 JP 2021031337 W JP2021031337 W JP 2021031337W WO 2022064949 A1 WO2022064949 A1 WO 2022064949A1
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mass
resin
propylene
component
parts
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PCT/JP2021/031337
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English (en)
French (fr)
Japanese (ja)
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光祐 新保
健 齋藤
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リケンテクノス株式会社
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Priority to KR1020237003911A priority Critical patent/KR20230071116A/ko
Priority to CN202180052830.7A priority patent/CN115996981A/zh
Priority to JP2022551217A priority patent/JPWO2022064949A1/ja
Publication of WO2022064949A1 publication Critical patent/WO2022064949A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/04—Antistatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

Definitions

  • the present invention relates to an antistatic resin composition, a resin film containing a layer formed from the antistatic resin composition, and a base film for an antistatic dicing tape containing the resin composition layer.
  • Semiconductor chips are produced by forming a large number of semiconductor chips together on a large-diameter silicon wafer and then dicing them into individual semiconductor chips.
  • the dicing step is performed on the front surface and / or the back surface of a silicon wafer (a large number of semiconductor chips formed) for the purpose of protecting the surface of the semiconductor chip; fixing individual cut semiconductor chips, picking up, and the like. It is often done after applying dicing tape.
  • An object of the present invention is to have sufficient antistatic properties and to have an inconvenience that the antistatic agent contaminates the metal roll of the film forming machine during film forming (hereinafter, the inconvenience is abbreviated as "plate out”). It is an object of the present invention to provide a resin composition in which (there is) is suppressed, and a resin film containing a layer formed from such a resin composition.
  • a further object of the present invention is an adhesive tape used by adhering to the front surface and / or the back surface of the silicon wafer or the like for the purpose of surface protection or the like when dicing (cutting and separating) the silicon wafer or the like (hereinafter referred to as an adhesive tape). It is an object of the present invention to provide a resin film suitable as a base film for a "dicing tape").
  • the present inventor has found that the above object can be achieved by a resin composition having a specific component and content ratio.
  • the sum of the blending amount of the above component (A) ethylene resin and the blending amount of the above component (B) propylene resin is 100 parts by mass;
  • the above component (B) propylene-based resin does not contain a block copolymer of propylene and a polyhydric alcohol.
  • Resin composition [2].
  • the mass ratio of the compounding amount of the component (B) propylene resin to the compounding amount of the block copolymer of the component (C) propylene and the polyhydric alcohol is 0.4 or more, according to the above item [1].
  • the melt mass flow rate of the component (A) ethylene resin is lower than the melt mass flow rate of the block copolymer of the component (C) propylene and a polyhydric alcohol.
  • the melt mass flow rate of the component (A) ethylene resin and the melt mass flow rate of the block copolymer of the component (C) propylene and a polyhydric alcohol are based on JIS K7210-1: 2014 and have a temperature. Measured at 190 ° C.
  • the melting point of the propylene polymer segment of the block copolymer of the component (C) propylene and the polyhydric alcohol is (Tm-30) to (Tm + 30) ° C.
  • Tm is the melting point (unit: ° C.) of the component (B) propylene-based resin.
  • the resin composition of the present invention has sufficient antistatic properties and plate-out is suppressed.
  • the preferable resin composition of the present invention has sufficient antistatic properties, plate-out is suppressed, and the resin film containing a layer formed by forming a film thereof is excellent in expandability. Therefore, the resin film containing the layer formed by using the resin composition of the present invention can be used as a base film for a dicing tape, particularly as a base film for a dicing tape used when producing a small and thin semiconductor chip. It can be suitably used.
  • FIG. 1 is a conceptual diagram of the film forming apparatus used in the embodiment.
  • the term "resin” is used as a term including a resin mixture containing two or more kinds of resins and a resin composition containing components other than the resin.
  • the term “film” is used interchangeably or interchangeably with “sheet”.
  • the terms “film” and “sheet” are used for those that can be industrially rolled into rolls.
  • the term “board” is used for things that cannot be industrially rolled into rolls.
  • laminating one layer and another layer in order means directly laminating those layers and interposing another layer such as an anchor coat between the layers. Includes both stacking.
  • the term "greater than or equal to” related to a numerical range is used to mean a certain numerical value or a certain numerical value or more. For example, 20% or more means 20% or more than 20%.
  • the term “below” for a numerical range is used to mean a numerical value or less than a certain numerical value. For example, 20% or less means 20% or less than 20%.
  • the symbol “ ⁇ ” related to the numerical range is used to mean a certain numerical value, more than a certain numerical value and less than another certain numerical value, or another certain numerical value.
  • 10-90% means 10%, more than 10% and less than 90%, or 90%.
  • the upper limit and the lower limit of the numerical range can be arbitrarily combined, and the embodiment in which the arbitrary combination can be read can be read. For example, “usually 10% or more, preferably 20% or more. On the other hand, usually 40% or less, preferably 30% or less.” Or “usually 10 to 40%, preferably 20" related to the numerical range of a certain characteristic. From the description, "is 30%.”, It can be read that the numerical range of the certain characteristic is 10 to 40%, 20 to 30%, 10 to 30%, or 20 to 40% in one embodiment. do.
  • the resin composition of the present invention contains (A) an ethylene resin, (B) a propylene resin, and (C) a block copolymer of propylene and a polyhydric alcohol.
  • the component (B) propylene-based resin does not contain a block copolymer of propylene and a polyhydric alcohol. Therefore, the compound corresponding to the block copolymer of the component (C) propylene and the polyhydric alcohol is excluded from the range of the component (B) propylene resin.
  • the compound corresponding to the block copolymer of propylene and the polyhydric alcohol is the component (C), not the component (B).
  • each component will be described.
  • ethylene-based resin is a resin mainly containing a structural unit derived from ethylene.
  • "mainly containing a structural unit derived from ethylene” means that the content of the structural unit derived from ethylene is usually 50% by mass or more, preferably 60% by mass or more, based on the total mass of the ethylene resin. It means that it is more preferably 70% by mass or more, typically 75 to 100% by mass.
  • the above component (A) ethylene resin functions to improve the expandability of the resin film.
  • ethylene-based resin examples include low-density polyethylene, linear low-density polyethylene, ultra-low-density polyethylene, medium-density polyethylene, and high-density polyethylene; ethylene / 1-butene copolymer and ethylene / 1-. Hexene copolymers and ethylene / ⁇ -olefin copolymers such as ethylene / 1-octene copolymers; ethylene / vinyl acetate copolymers; ethylene / ethyl acrylate copolymers, and ethylene / methyl methacrylate copolymers.
  • Ethylene / unsaturated carboxylic acid ester copolymers such as ethylene / (meth) acrylic acid alkyl ester copolymers such as coalesced; ethylene / unsaturated such as ethylene / acrylic acid copolymers and ethylene / methacrylic acid copolymers.
  • Carboxylic acid copolymer ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid ester copolymer such as ethylene / (meth) acrylic acid / (meth) acrylic acid alkyl ester copolymer; and the ethylene / unsaturated carboxylic Examples thereof include an ionomer resin in which the molecules of the acid copolymer or the ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid ester copolymer are crosslinked with metal ions.
  • Examples of the metal ion used in the ionomer resin include lithium ion, sodium ion, potassium ion, rubidium ion, cesium ion, zinc ion, magnesium ion, and manganese ion.
  • these metal ions magnesium ion, sodium ion, and zinc ion are preferable, and sodium ion and zinc ion are more preferable.
  • the content of the structural unit derived from ethylene is usually 98% by mass or less, preferably 96% by mass, based on the total mass of the ethylene-based resin from the viewpoint of expandability of the resin film. It may be mass% or less, more preferably 94 mass% or less. On the other hand, this content may be usually 70% by mass or more, preferably 75% by mass or more, and more preferably 80% by mass or more from the viewpoint of blocking resistance of the resin film.
  • the density (JIS) When low-density polyethylene, linear low-density polyethylene, ultra-low-density polyethylene, medium-density polyethylene, high-density polyethylene, or an ethylene / ⁇ -olefin copolymer is used as the component (A) ethylene-based resin, the density (JIS)
  • the dipping method (measured by the immersion method (ISO1183-1: 2019) according to K6922-2: 2018) is usually 950 kg / m 3 or less, preferably 945 kg / m 3 or less, more preferably 940 kg / m 3 or less, from the viewpoint of expandability of the resin film.
  • this density may be usually 880 kg / m 3 or more, preferably 890 kg / m 3 or more, and more preferably 900 kg / m 3 or more, from the viewpoint of blocking resistance of the resin film.
  • the melt mass flow rate of the above component (A) ethylene resin at 190 ° C. may be usually 0.1 to 20 g / 10 minutes, preferably 0.5 to 10 g / 10 minutes from the viewpoint of film forming property.
  • the melt mass flow rate of the above component (A) ethylene resin is measured according to JIS K7210-1: 2014 under the conditions of a temperature of 190 ° C. and a load of 21.18N.
  • ethylene resin includes an ethylene / unsaturated carboxylic acid copolymer and an ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid ester copolymer from the viewpoint of suppressing plate-out.
  • An ionomer resin of an ethylene / unsaturated carboxylic acid copolymer and an ionomer resin of an ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid ester copolymer are preferable.
  • the carboxyl group is contained in the block copolymer of the above-mentioned component (C) propylene and a polyhydric alcohol. It strongly interacts with structural units derived from polyhydric alcohols and metal ions contained in the above component (C). Therefore, it is considered that the plate-out of the block copolymer of the component (C) propylene and the polyhydric alcohol can be suppressed.
  • component (A) ethylene resin one kind or a mixture of two or more kinds of these can be used. Needless to say, when two or more kinds of mixtures are used as the component (A) ethylene resin, the characteristics thereof should be determined by measuring the mixture.
  • the above-mentioned component (B) propylene-based resin is a resin mainly containing a constituent unit derived from propylene.
  • "mainly containing a structural unit derived from propylene” means that the content of the structural unit derived from propylene is usually 50% by mass or more, preferably 60% by mass or more, based on the total mass of the propylene-based resin. It means that it is more preferably 70% by mass or more, typically 75 to 100% by mass.
  • the component (B) propylene-based resin does not contain a block copolymer of propylene and a polyhydric alcohol. Therefore, the compound corresponding to the block copolymer of the component (C) propylene and the polyhydric alcohol is excluded from the component (B) propylene resin.
  • the component (B) propylene-based resin suppresses the plate-out of the block copolymer of the component (C) propylene and the polyhydric alcohol, and functions to assist the antistatic property-imparting effect of the component (C). .. Although it is not intended to be bound by theory, it is considered that these functions of the above-mentioned component (B) propylene-based resin are due to the following expression mechanism.
  • the above component (B) propylene resin is added thereto, that is, the above component (A) ethylene resin, the above component (B) propylene resin, and the block of the above component (C) propylene and the polyhydric alcohol.
  • the segment having the same structure as the component (B) of the component (C) that is, the propylene polymer segment of the component (C) is compatible with the component (B). Form an island facies or co-crystals. Therefore, even if a large amount of the above component (C) is blended, the plate-out of the above component (C) is suppressed.
  • the essential segment of the component (C), that is, the polyhydric alcohol polymer segment of the component (C) is compatible with the component (B). Since the properties are not sufficient, when the propylene polymer segments of the above component (B) and the above component (C) are solidified / crystallized, the phase still in a molten state (the crystallization temperature of the above component (A) is high). When it is lower than the above component (B) and the above component (C), the sea phase of the above component (A), and when the crystallization temperature of the above component (A) is higher than the above component (B) and the above component (C).
  • the polyvalent alcohol polymer segment of the component (C) is present in a high concentration in the still-melted phase, and is close to the still-melted phase when it solidifies. , A continuous island phase, that is, an electric flow path is formed, and sufficient antistatic property is exhibited.
  • component (B) propylene-based resin for example, one or more of a propylene copolymer and propylene and ⁇ -olefin (for example, ethylene, 1-butene, 1-hexene, and 1-octene). Copolymers with (including block copolymers and random copolymers) and the like can be mentioned.
  • a propylene copolymer and propylene and ⁇ -olefin for example, ethylene, 1-butene, 1-hexene, and 1-octene.
  • component (B) propylene-based resin a copolymer of propylene and ⁇ -olefin is preferable from the viewpoint of miscibility and compatibility with the component (A) ethylene-based resin.
  • the melting point of the component (B) propylene-based resin may be usually 120 ° C. or higher, preferably 125 ° C. or higher, and more preferably 130 ° C. or higher from the viewpoint of heat resistance and solvent resistance of the resin film.
  • the melting point may be usually 160 ° C. or lower, preferably 150 ° C. or lower, from the viewpoint of forming a eutectic with the propylene polymer segment of the block copolymer of the component (C) propylene and the polyhydric alcohol.
  • the melting enthalpy of the component (B) propylene-based resin may be usually 20 J / g or more, preferably 30 J / g or more from the viewpoint of heat resistance and solvent resistance of the resin film.
  • this melting enthalpy is usually 90 J / g or less, preferably 88 J / g or less, more preferably 80 J / g or less, still more preferably 70 J / g or less, still more preferably 60 J, from the viewpoint of expandability of the resin film. It may be less than / g.
  • the melting point and melting enthalpy of the component (B) propylene-based resin are in accordance with JIS K7121-1987, and are held at 190 ° C. for 5 minutes using a differential scanning calorimetry device (DSC measuring device). Second melting curve measured by a program that cools to -10 ° C at 10 ° C / min, holds at -10 ° C for 5 minutes, and heats up to 190 ° C at 10 ° C / min (measured during the final heating process). Calculated from the melting curve). At this time, the melting point is the peak top temperature of the melting peak appearing in the second melting curve.
  • the peak top temperature of the melting peak having the maximum peak top height is defined as the melting point.
  • the melting peak appearing in the second melting curve of DSC usually has a hem extending gently and long on both the high temperature side and the low temperature side; and the baseline is JIS K7121-1987. It should be noted that the straight line extending the baseline on the high temperature side to the low temperature side and the straight line extending the baseline on the low temperature side to the high temperature side in FIG. 1 of how to read the DTA or DSC curve should be drawn so as to coincide with each other. ..
  • the melt mass flow rate of the component (B) propylene resin at 230 ° C. is preferably 0.1 to 20 g / 10 minutes, more preferably 0.5 to 15 g / 10 minutes, still more preferably, from the viewpoint of film forming property. May be 1 to 10 g / 10 minutes.
  • the melt mass flow rate of the component (B) propylene-based resin is measured in accordance with JIS K7210-1: 2014 under the conditions of a temperature of 230 ° C. and a load of 21.18 N.
  • the melt mass flow rate of the component (B) propylene resin at 190 ° C. can be measured under the conditions of a temperature of 190 ° C. and a load of 21.18 N in accordance with JIS K7210-1: 2014.
  • component (B) propylene-based resin one or a mixture of two or more of these can be used. Needless to say, when two or more kinds of mixtures are used as the component (B) propylene-based resin, the characteristics thereof should be determined by measuring the mixture.
  • (C) Block copolymer of propylene and polyhydric alcohol The above-mentioned component (C) The block copolymer of propylene and polyhydric alcohol is composed of a propylene polymer segment mainly containing a constituent unit derived from propylene and polyhydric alcohol. It is a block copolymer having a polyhydric alcohol polymer segment mainly containing a derived structural unit.
  • "mainly containing a structural unit derived from propylene” means that the content of the structural unit derived from propylene is usually 60% by mass or more, preferably 70% by mass or more, based on the total mass of the propylene polymer segment.
  • mainly containing the constituent units derived from the polyhydric alcohol means that the content of the constituent units derived from the polyhydric alcohol is usually 60% by mass or more with respect to the total mass of the polyhydric alcohol polymer segment. It means that it is preferably 70% by mass or more, more preferably 80% by mass or more, still more preferably 90% by mass or more, and typically 95 to 100% by mass.
  • the block copolymer of the component (C) propylene and a polyhydric alcohol has a function of exhibiting antistatic properties.
  • the propylene polymer segment may be a propylene homopolymer segment, and may be one or more of propylene and ⁇ -olefin (for example, ethylene, 1-butene, 1-hexene, and 1-octene). May be a copolymer segment of.
  • polyhydric alcohol constituting the polyvalent alcohol polymer segment
  • examples of the polyhydric alcohol constituting the polyvalent alcohol polymer segment include ethylene glycol, diethylene glycol, neopentyl glycol, polyethylene glycol, 1,2-propanediol, 1,3-propanediol (trimethylethylene glycol), and polypropylene.
  • Glycol 1,2-butanediol, 1,3-butanediol, 1,4-butanediol (tetramethylene glycol), 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, decamethylene glycol, 3-Methyl-1,5-pentanediol, 2-methyl-1,3-propanediol, 1,2-cyclohexanediol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, 2,2,4 Alibo polyhydric alcohols such as 4'-tetramethyl-1,3-cyclobutanediol, glycerin, and trimethylolpropane can be mentioned.
  • the polyhydric alcohol constituting the polyhydric alcohol polymer segment ethylene glycol, diethylene glycol, and polyethylene glycol are used from the viewpoint of forming a larger number of ether bonds in comparison with the number of carbon atoms and improving antistatic property. , 1,2-Propanediol, 1,3-propanediol (trimethylethylene glycol), and polypropylene glycol are preferable, and ethylene glycol, diethylene glycol, and polyethylene glycol are more preferable.
  • the polyhydric alcohol polymer segment may be a polymer segment composed of only structural units derived from the polyhydric alcohol, and may be a copolymer with one or more of the monomers copolymerizable with the polyhydric alcohol.
  • the monomer copolymerizable with the polyvalent alcohol has two or more carboxyl groups in one molecule such as, for example, an aliphatic dicarboxylic acid such as oxalic acid, amber acid, adipic acid, suberic acid, and sebacic acid.
  • an aliphatic dicarboxylic acid such as oxalic acid, amber acid, adipic acid, suberic acid, and sebacic acid.
  • examples thereof include compounds having two or more isocyanate groups in one molecule such as aliphatic diisocyanates such as hexamethylene diisocyanate.
  • the amount of the structural unit derived from propylene in the block copolymer of the component (C) propylene and the polyhydric alcohol is usually 30% by mass or more, preferably 40% by mass or more, from the viewpoint of suppressing plate-out. It may be preferably 50% by mass or more.
  • the amount of the structural unit derived from propylene may be usually 90% by mass or less, preferably 80% by mass or less, and more preferably 70% by mass or less from the viewpoint of antistatic property.
  • the amount of the structural unit derived from the polyhydric alcohol in the block copolymer of the component (C) propylene and the polyhydric alcohol is usually 70% by mass or less, preferably 60% by mass or less from the viewpoint of suppressing plate-out.
  • the amount of the structural unit derived from the polyhydric alcohol may be usually 10% by mass or more, preferably 20% by mass or more, and more preferably 30% by mass or more from the viewpoint of antistatic property.
  • the sum of the amount of the structural unit derived from propylene and the amount of the structural unit derived from the polyhydric alcohol is 100% by mass.
  • the sum of the amount of the structural unit derived from propylene in the block copolymer of the component (C) propylene and the polyhydric alcohol and the amount of the structural unit derived from the polyhydric alcohol is each of the above components (C).
  • the total amount of the constituent units may be 100% by mass, and may be usually 80% by mass or more, preferably 90% by mass or more, and typically 95 to 100% by mass.
  • the block copolymer of the above component (C) propylene and a polyhydric alcohol may be doped with metal ions. Antistatic property can be improved.
  • the metal ion examples include lithium ion, cesium ion, rubidium ion, potassium ion, barium ion, strontium ion, calcium ion, and sodium ion.
  • lithium ion is preferable from the viewpoint of improving antistatic property.
  • the content of the metal ion in the block copolymer of the component (C) propylene and the polyhydric alcohol is usually 100 ppm or more, preferably 150 ppm or more, more preferably 300 ppm or more, and more, from the viewpoint of improving antistatic property. More preferably, it may be 500 ppm or more.
  • the content of the metal ion may be usually 2000 ppm or less, preferably 1500 ppm or less, and more preferably 1000 ppm or less from the viewpoint of suppressing plate-out.
  • the content of the metal ion in the block copolymer of the component (C) propylene and the polyhydric alcohol is measured by an atomic absorption spectrometry method.
  • the measurement sample is calcified (wet decomposition) using a mixed acid of nitrate and hydrochloric acid (volume ratio 8: 2) using a microwave device, and then filtered by adding an aqueous hydrochloric acid solution. Prepare the solution by rectifying it with purified water. At this time (when the filtrate is conditioned with purified water), yttrium is added as an internal standard.
  • the melting point of the propylene polymer segment of the block copolymer of the component (C) propylene and the polyhydric alcohol is usually (from the viewpoint of forming a eutectic with the component (B) propylene resin and suppressing plate-out. It may be Tm-30) to (Tm + 30) ° C., preferably (Tm-20) to (Tm + 20) ° C., and more preferably (Tm-10) to (Tm + 10) ° C.
  • Tm is the melting point (unit: ° C.) of the component (B) propylene-based resin.
  • the melting point of the block copolymer of the component (C) propylene and the polyhydric alcohol conforms to JIS K7121-1987, and a differential scanning calorimetry device (DSC measuring device) is used at 190 ° C.
  • the melting point of the propylene polymer segment is the peak top temperature of the melting peak appearing in the temperature range of 100 to 165 ° C. on the second melting curve.
  • the peak top temperature of the melting peak having the maximum peak top height is defined as the melting point.
  • the melting point of the polyhydric alcohol polymer segment depends on its composition, but in the case of the polyethylene glycol segment, for example, it is the peak top temperature of the melting peak appearing in the temperature range of 20 to 60 ° C. on the second melting curve. ..
  • the peak top temperature of the melting peak having the maximum peak top height is similarly used as the melting point.
  • the melting peak appearing in the second melting curve of DSC usually has a hem extending gently and long on both the high temperature side and the low temperature side; and the baseline is JIS K7121-1987.
  • the straight line extending the baseline on the high temperature side to the low temperature side and the straight line extending the baseline on the low temperature side to the high temperature side in FIG. 1 of how to read the DTA or DSC curve should be drawn so as to coincide with each other. ..
  • the melt mass flow rate of the block copolymer of the component (C) propylene and the polyhydric alcohol at 190 ° C. is preferably 0.1 to 20 g / 10 minutes, more preferably 0.5, from the viewpoint of film forming property. It may be ⁇ 15 g / 10 minutes, more preferably 1-10 g / 10 minutes.
  • the melt mass flow rate of the block copolymer of the component (C) propylene and the polyhydric alcohol is measured in accordance with JIS K7210-1: 2014 under the conditions of a temperature of 190 ° C. and a load of 21.18 N.
  • the block copolymer of the component (C) propylene and the polyhydric alcohol one or a mixture of two or more thereof can be used. Needless to say, when two or more kinds of mixtures are used as the block copolymer of the component (C) propylene and the polyhydric alcohol, the characteristics thereof should be determined by measuring the mixture.
  • the blending amount of the component (A) ethylene resin is 100 parts by mass, which is the sum of the blending amount of the component (A) ethylene resin and the blending amount of the component (B) propylene resin, from the viewpoint of antistatic property. From the viewpoint of suppressing plate-out, the amount may be usually 99 parts by mass or less, preferably 95 parts by mass or less, and more preferably 92 parts by mass or less. On the other hand, from the viewpoint of expandability of the resin film, the blending amount may be usually 20 parts by mass or more, preferably 35 parts by mass or more, more preferably 45 parts by mass or more, and further preferably 55 parts by mass or more.
  • the blending amount of the component (A) ethylene resin is usually 100 parts by mass, which is the sum of the blending amount of the component (A) ethylene resin and the blending amount of the component (B) propylene resin. 20 parts by mass or more and 99 parts by mass or less, preferably 20 parts by mass or more and 95 parts by mass or less, 20 parts by mass or more and 92 parts by mass or less, 35 parts by mass or more and 99 parts by mass or less, 35 parts by mass or more and 95 parts by mass or less, 35 parts by mass.
  • the blending amount of the component (B) propylene resin is 100 parts by mass, which is the sum of the blending amount of the component (A) ethylene resin and the blending amount of the component (B) propylene resin, from the viewpoint of antistatic property. From the viewpoint of suppressing plate-out, it may be usually 1 part by mass or more, preferably 5 parts by mass or more, and more preferably 8 parts by mass or more. On the other hand, from the viewpoint of expandability of the resin film, the blending amount may be usually 80 parts by mass or less, preferably 65 parts by mass or less, more preferably 55 parts by mass or less, and further preferably 45 parts by mass or less.
  • the blending amount of the component (B) propylene-based resin is usually 100 parts by mass, which is the sum of the blending amount of the component (A) ethylene-based resin and the blending amount of the component (B) propylene-based resin.
  • 1 part by mass or more and 80 parts by mass or less preferably 1 part by mass or more and 65 parts by mass or less, 1 part by mass or more and 55 parts by mass or less, 1 part by mass or more and 45 parts by mass or less, 5 parts by mass or more and 80 parts by mass or less, 5 parts by mass 65 parts by mass or less, 5 parts by mass or more and 55 parts by mass or less, 5 parts by mass or more and 45 parts by mass or less, 8 parts by mass or more and 80 parts by mass or less, 8 parts by mass or more and 65 parts by mass or less, 8 parts by mass or more and 55 parts by mass or less , Or 8 parts by mass or more and 45 parts by mass or less.
  • the amount of the block copolymer of the component (C) propylene and the polyhydric alcohol is 100 parts by mass, which is the sum of the amount of the component (A) ethylene resin and the amount of the component (B) propylene resin.
  • it may be usually 1 part by mass or more, preferably 5 parts by mass or more, more preferably 10 parts by mass or more, and further preferably 15 parts by mass or more.
  • it may be usually 39 parts by mass or less, preferably 35 parts by mass or less, more preferably 32 parts by mass or less, and further preferably 29 parts by mass or less.
  • the blending amount of the block copolymer of the component (C) propylene and the polyhydric alcohol is the blending amount of the component (A) ethylene resin and the blending amount of the component (B) propylene resin.
  • the sum is usually 1 part by mass or more and 39 parts by mass or less, preferably 1 part by mass or more and 35 parts by mass or less, 1 part by mass or more and 32 parts by mass or less, 1 part by mass or more and 29 parts by mass or less, 5 parts by mass.
  • 3 parts or more and 39 parts by mass or less 5 parts by mass or more and 35 parts by mass or less, 5 parts by mass or more and 32 parts by mass or less, 5 parts by mass or more and 29 parts by mass or less, 10 parts by mass or more and 39 parts by mass or less, 10 parts by mass or more and 35 parts by mass or less 10 parts by mass or more and 32 parts by mass or less, 10 parts by mass or more and 29 parts by mass or less, 15 parts by mass or more and 39 parts by mass or less, 15 parts by mass or more and 35 parts by mass or less, 15 parts by mass or more and 32 parts by mass or less, or 15 parts by mass. It may be 2 parts or more and 29 parts by mass or less.
  • Mass ratio of the compounding amount of the component (B) propylene resin to the compounding amount of the block copolymer of the component (C) propylene and the polyhydric alcohol (the compounding amount of the component (B) / the compounding amount of the component (C)).
  • the blending amount of the above may be preferably 0.4 or more, preferably 0.6 or more, and more preferably 0.8 or more.
  • this mass ratio causes eutectic formation in both components even when the difference between the melting point of the component (B) and the melting point of the propylene polymer segment of the component (C) is large, and suppresses plate-out. From the viewpoint, it may be preferably 10 or less, more preferably 6 or less.
  • the melt mass flow rate of the component (A) ethylene resin at 190 ° C. may be lower than the melt mass flow rate of the block copolymer of the component (C) propylene and a polyhydric alcohol at 190 ° C. , Preferably as low as 1/2 or less.
  • the polyhydric alcohol polymer segment of the component (C) is subjected to shear stress to form an elongated island phase, which facilitates the formation of an electric flow path and is sufficiently charged. Antibacterial properties can be manifested.
  • the resin film of the present invention is a resin film containing at least one layer formed from the resin composition of the present invention.
  • the resin film of the present invention usually comprises at least one layer formed from the resin composition of the present invention, and the layer forms at least one surface of the resin film.
  • the resin film of the present invention may be a single-layer film or a multilayer film.
  • the resin film of the present invention may be a single layer film.
  • both outer layers are formed by using the virgin material of the resin composition of the present invention, and the intermediate layer is the virgin material of the resin composition of the present invention and the ear of the film. It may be a multilayer film formed by using a mixture with a recycled material such as (cut portions at both ends beyond the set range in the width direction) generated during the film.
  • the method for forming the resin film of the present invention is not particularly limited, and a known film forming method can be used.
  • a film forming method for example, a method of forming a film using a calendar roll rolling processing machine and a calendar roll rolling film forming apparatus provided with a take-up apparatus; an extruder, a T-die, and a take-up apparatus can be used.
  • a method of forming a film using a T-die film forming apparatus provided; and a method of forming a film using an inflation film forming apparatus equipped with an extruder, a circular die, an inflation device, and a take-up device having a nip mechanism, etc. Can be given.
  • Examples of the calendar roll rolling machine include an upright type 3 roll, an upright type 4 roll, an L type 4 roll, an inverted L type 4 roll, and a Z type roll.
  • Examples of the extruder include a single-screw extruder, a co-directional rotary twin-screw extruder, and a different-direction rotary twin-screw extruder.
  • Examples of the T-die include a manifold die, a fishtail die, a coat hanger die, and the like.
  • the thickness of the resin film of the present invention is not particularly limited and can be appropriately selected in consideration of the use of the resin film.
  • the thickness thereof may be usually 30 to 300 ⁇ m, preferably 50 to 200 ⁇ m, and more preferably 70 to 150 ⁇ m.
  • the thickness here refers to the thickness of the entire resin film including at least one layer formed from the resin composition of the present invention (in the case of a plurality of layers, the total thickness of those layers).
  • the surface resistivity of the resin film of the present invention is usually 1 ⁇ 10 6 to 1 ⁇ 10 11 ⁇ / ⁇ , preferably 1 ⁇ 10 7 to 1 ⁇ 10 10 ⁇ / ⁇ , and more preferably 1 ⁇ 10 8 to 1 ⁇ . It may be 10 10 ⁇ / ⁇ , and even more preferably 1 ⁇ 10 8 to 1 ⁇ 10 9 ⁇ / ⁇ . Since the resin film of the present invention has a surface resistivity in the above range, it can be suitably used as a base film for an antistatic dicing tape.
  • the surface resistivity is determined by pretreating the test piece by leaving it in an environment with a temperature of 25 ° C. and a relative humidity of 50% for 24 hours, and measuring the resistivity at a temperature of 25 ° C. and a relative humidity of 50%. Except for the above environment, the probe is crimped to the test piece with a load of 30 N according to the 5.13 resistivity of JIS K6911: 1995, and after 30 seconds have passed by applying a voltage of 100 V. Measure the surface resistivity (unit: ⁇ / ⁇ ) of. As the test piece, a square film piece having a side of 10 cm is collected from a resin film (typically, a base film for dicing tape) and used.
  • a resin film typically, a base film for dicing tape
  • the 5% strain tensile stress of the resin film of the present invention in the machine direction is usually 15 MPa or less (more than 0 MPa), preferably 12 MPa or less (more than 0 MPa), more preferably 2 to 10 MPa, still more preferably 3 to 8 MPa. May be.
  • the 10% strain tensile stress of the resin film of the present invention in the machine direction is usually 20 MPa or less (more than 0 MPa), preferably 18 MPa or less (more than 0 MPa), more preferably 2 to 15 MPa, still more preferably 4 to 12 MPa. ..
  • the 20% strain tensile stress of the resin film of the present invention in the machine direction is usually 20 MPa or less (more than 0 MPa), preferably 18 MPa or less (more than 0 MPa), more preferably 3 to 15 MPa, still more preferably 6 to 12 MPa. ..
  • the 100% strain tensile stress of the resin film of the present invention in the machine direction is usually 25 MPa or less (more than 0 MPa), preferably 20 MPa or less (more than 0 MPa), more preferably 4 to 18 MPa, still more preferably 8 to 15 MPa. .. Since the resin film of the present invention has a strain-tensile stress in the above range, it can be suitably used as a base film for an antistatic dicing tape having excellent expandability.
  • the 10% strain tensile stress is preferably larger than the 5% strain tensile stress
  • the 20% strain tensile stress is larger than the 10% strain tensile stress. It may be large and the 100% strain tensile stress may be larger than the 20% strain tensile stress. Since each strain and tensile stress in the machine direction of the resin film of the present invention has the above-mentioned relationship, the necking phenomenon is strongly suppressed, and it can be suitably used as a base film for an antistatic dicing tape having excellent expandability. can.
  • the "necking phenomenon” here means the occurrence of partial elongation due to poor force propagation that occurs when the film is stretched.
  • each strain tensile stress is measured according to the following test (iv) tensile test.
  • the dicing tape of the present invention is a dicing tape using the resin film of the present invention as a base film.
  • the dicing tape of the present invention is usually produced by forming an adhesive layer directly or via an anchor coat on one side of the resin film of the present invention and then slitting it to a desired width.
  • the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer is not particularly limited, and any pressure-sensitive adhesive can be used.
  • the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer include acrylic pressure-sensitive adhesives such as poly (meth) acrylic acid alkyl esters and copolymers of (meth) acrylic acid alkyl esters and other monomers; natural rubber. , Butyl / isoprene rubber and other rubber-based adhesives; polyurethane-based adhesives; polyester-based adhesives; polystyrene-based adhesives; and silicon-based adhesives.
  • the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer a pressure-sensitive adhesive having excellent transparency is preferable from the viewpoint of sufficiently ensuring the transparency required for the dicing tape, for example, the visibility when performing laser marking.
  • the "adhesive having excellent transparency” means a pressure-sensitive adhesive having a visible light transmittance of usually 50% or more, preferably 70% or more, more preferably 80% or more, still more preferably 85% or more.
  • the visible light transmittance is measured using a spectrophotometer "Solid Spec-3700" (trade name) manufactured by Shimadzu Corporation and a quartz cell having an optical path length of 10 mm, and the wavelength of the pressure-sensitive adhesive is 380 to 780 nanometers. It can be calculated as a ratio of the integrated area of the transmission spectrum in the above to the integrated area of the transmission spectrum assuming that the transmittance in the entire range of wavelengths of 380 to 780 nanometers is 100%.
  • a pressure-sensitive adhesive that can reduce the pressure-sensitive adhesive strength by thermosetting or active energy ray curing is also preferable. Due to the decrease in adhesive strength, when the dicing tape is peeled off from the work (workpiece), no adhesive remains and the dicing tape can be easily peeled off cleanly. In addition, the amount of static electricity generated when the dicing tape is peeled off from the work can be suppressed.
  • the pressure-sensitive adhesive that can reduce the pressure-sensitive adhesive strength by heat-curing or active energy ray-curing include, for example, two or more reactive functional groups (for example, amino group, vinyl group, epoxy group) in one molecule.
  • the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer a pressure-sensitive adhesive having antistatic properties is also preferable.
  • the surface resistivity of the pressure-sensitive adhesive layer formed by using the antistatic pressure-sensitive adhesive is usually 1 ⁇ 10 6 to 1 ⁇ 10 11 ⁇ / ⁇ , preferably 1 ⁇ 10 7 to 1 ⁇ 10 10 ⁇ /. ⁇ , more preferably 1 ⁇ 10 8 to 1 ⁇ 10 10 ⁇ / ⁇ , and even more preferably 1 ⁇ 10 8 to 1 ⁇ 10 9 ⁇ / ⁇ .
  • Examples of the antistatic pressure-sensitive adhesive are disclosed in JP-A-2007-191532, JP-A-2008-007702, JP-A-2009-242745, and International Publication No. 2015/030186. You can give the adhesive that you have.
  • the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer one or a mixture of two or more of these can be used.
  • the thickness of the adhesive layer is not particularly limited and can be any thickness.
  • the thickness of the pressure-sensitive adhesive layer may be usually about 1 to 25 ⁇ m, preferably about 5 to 20 ⁇ m.
  • Measurement method (i) Surface resistivity The pretreatment of the test piece was performed by leaving it in an environment with a temperature of 25 ° C and a relative humidity of 50% for 24 hours, and the resistivity was measured at a temperature of 25 ° C and a relative humidity of 50%.
  • (Ii) Plate-out index ( ⁇ G) A film forming apparatus (diameter 40 mm extruder 1, resin outlet width 600 mm T die 2, diameter 150 mm smooth roll (mirror surface metal roll) 4 and diameter 250 mm chevo roll (pear-skin rubber roll) 5) whose conceptual diagram is shown in FIG. A film-forming device equipped with a take-up device having a mechanism for niping with and is used. 8 degree mirror gloss value (hereinafter referred to as "predetermined location") of the smooth roll surface of the film forming apparatus (a portion 5 cm from the portion where the right end portion in the width direction of the molten film is grounded to the surface of the smooth roll in the width direction). Spectral measurement by Konica Minolta Co., Ltd.
  • the resin composition was used as the molten film 3 and continuously extruded from the T-die 2, and the extruded molten film 3 was supplied and charged between the rotating smooth roll 4 and the rotating chebolol 5.
  • the molten film 3 pressed by the smoothing roll 4 and the grain roll 5 was held by the smoothing roll 4 and sent out to the next rotating roll 6 to form a film 7 having a thickness of 100 ⁇ m.
  • the temperature of the T-die outlet resin was 210 ° C.
  • the surface temperature of the smoothing roll 4 was 25 ° C.
  • the temperature of the cooling water flowing through the shibolol 5 was 25 ° C.
  • the take-up speed was 4 m / min.
  • the 8 degree mirror gloss value (G 1 ) at a predetermined position on the smooth roll surface of the film forming device is set to the 8 degree mirror gloss value (G 0 ).
  • the plate-out index ( ⁇ G) was calculated from the 8 degree mirror gloss value of the smooth roll surface before and after film formation by the following equation (1).
  • ⁇ G (1-G 1 / G 0 ) ⁇ 100 ⁇ ⁇ ⁇ (1)
  • ⁇ G was approximately 10% or less.
  • ⁇ G was approximately over 10% to 20%.
  • ⁇ G was approximately over 20% to 30%.
  • ⁇ G was approximately over 30%.
  • Ethylene resin (A-1) Ionomer resin "Himilan 1855" (trade name) crosslinked with zinc ions from Mitsui Dow Polychemical Co., Ltd., melt mass flow rate (190 ° C, 21.18N) 1 .0 g / 10 minutes, melting point 83 ° C.
  • melt mass flow rate (190 ° C, 21.18N) 1 .0 g / 10 minutes, melting point 83 ° C.
  • an ionomer resin obtained by cross-linking an ethylene / methacrylic acid / ethyl methacrylate copolymer with zinc ions.
  • the content of the structural unit derived from ethylene is 80% by mass
  • the content of the structural unit derived from methacrylic acid is 10% by mass
  • the content of the structural unit derived from ethyl methacrylate is 10% by mass.
  • (A-2) Ionomer resin "Himilan 1652" (trade name) crosslinked with zinc ions from Mitsui Dow Polychemical Co., Ltd., melt mass flow rate (190 ° C., 21.18N) 5.5 g / 10 minutes, melting point 96 ° C. ..
  • melt mass flow rate 190 ° C., 21.18N
  • the content of the constituent unit derived from 9% by mass (content of the constituent unit derived from ethylene is 91% by mass), the melting point is 98 ° C. (A-5) Ethylene-vinyl acetate copolymer "Ultrasen 515" (trade name) from Tosoh Corporation, melt mass flow rate 2.5 g / 10 minutes, content of 6% by mass of constituent units derived from vinyl acetate (A-5) Content of structural unit derived from ethylene 94% by mass), melting point 100 ° C.
  • B Propylene Resin
  • B-1 Propylene / Ethylene Copolymer "Wellnex RFX4V" (trade name) from Nippon Polypro Co., Ltd., Melt Mass Flow Rate (230 ° C, 21.18N) 6.0 g / 10 minutes, Melt Mass flow rate (190 ° C., 21.18N) 3.0 g / 10 min, melting point 131 ° C., melting enthalpy 55 J / g. According to JP-A-2017-1000357, a propylene / ethylene block copolymer.
  • the content of the constituent unit derived from ethylene is 29 mol% (converted to 21% by mass) (the content of the constituent unit derived from propylene is 71 mol% (converted to 79% by mass)).
  • B-2 Sumitomo Chemical Co., Ltd.'s propylene / 1-butene copolymer "Tough Serene T3732" (trade name), melt mass flow rate (230 ° C., 21.18N) 3 g / 10 minutes, melt mass flow rate (190 ° C., 21.18N) 1.3g / 10min, melting point 129 ° C., melting enthalpy 32J / g.
  • Perectron PVH (trade name) having a propylene polymer segment and a polyethylene glycol segment, melt mass flow rate (190 ° C., 21.18N) 8 g / 10 minutes, structural unit derived from propylene. The content is 60% by mass, the content of the structural unit derived from polyethylene glycol is 40% by mass, the melting point of the
  • Block copolymer "Pelectron LMP-FS" (trade name) having a propylene polymer segment and a polyethylene glycol segment, melt mass flow rate (190 ° C., 21.18N) 15 g / 10 minutes, derived from propylene.
  • the content of the constituent unit is 56% by mass
  • the content of the constituent unit derived from polyethylene glycol is 44% by mass
  • the melting point of the propylene polymer segment is 113 ° C.
  • the melting point of the polyethylene glycol segment is 34 ° C.
  • the lithium ion is 180 ppm.
  • Block copolymer "Pelectron PVL” (trade name) having a propylene polymer segment and a polyethylene glycol segment, melt mass flow rate (190 ° C., 21.18N) 15 g / 10 minutes, structural unit derived from propylene.
  • the content is 59% by mass
  • the content of the structural unit derived from polyethylene glycol is 41% by mass
  • the melting point of the propylene polymer segment is 132 ° C
  • the melting point of the polyethylene glycol segment is 33 ° C
  • the lithium ion is 180 ppm.
  • Example 1 A film-forming apparatus showing a conceptual diagram in FIG. 1 using a resin composition of 80 parts by mass of the component (A-1), 20 parts by mass of the component (B-1), and 20 parts by mass of the component (C-1).
  • Extruder 1, T-die 2, and film-forming device equipped with a take-up device having a mechanism for niping between a smoothing roll (mirror surface metal roll) 4 and a grained rubber roll 5 The material was continuously extruded from the T-die 2 as a molten film 3. Next, the extruded molten film 3 was supplied and charged between the rotating smoothing roll 4 and the rotating shibolol 5, and pressed by the smoothing roll 4 and the shibolol 5.
  • the pressed molten film 3 was held by the smoothing roll 4 and sent out to the next rotating roll 6 to form a film 7 having a thickness of 100 ⁇ m.
  • the temperature of the T-die outlet resin was 210 ° C.
  • the surface temperature of the smoothing roll 4 was 25 ° C.
  • the temperature of the cooling water flowing through the shibolol 5 was 25 ° C.
  • the take-up speed was 4 m / min.
  • Examples 2-25 A film was formed in the same manner as in Example 1 except that the composition of the resin composition was changed to that shown in any one of Tables 1 to 3. The above tests (i) to (iv) were performed. The results are shown in any one of Tables 1 to 3.
  • the resin composition of the present invention suppresses plate-out, and the resin film formed by using this has sufficient antistatic properties. It was found that the preferable resin composition of the present invention suppresses plate-out, and the resin film formed by using the same has sufficient antistatic property and is also excellent in expandability. Therefore, it was considered that the resin film formed by using the resin composition of the present invention is suitable as a base film for an antistatic dicing tape.
  • the resin composition of the present invention has preferable properties as described above, it will be obvious to those skilled in the art that it can be suitably used as a material for injection molded products and extruded products. Further, since the resin film formed by using the resin composition of the present invention has preferable characteristics as described above, a film or tape for manufacturing semiconductors other than the dicing tape, for example, a backgrinding tape (thinning the wafer). It will be obvious to those skilled in the art that it can be suitably used as a die attach film (used for adhering and laminating and mounting cut wafer chips) (used for protecting the circuit surface in the polishing process).

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JP2020084143A (ja) * 2018-11-30 2020-06-04 ダイヤプラスフィルム株式会社 半導体製造工程用基材フィルム及び該基材フィルムを用いたダイシング用粘着フィルム

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