KR20210038331A - 폴리이미드 필름, 금속 피복 적층판 및 회로 기판 - Google Patents

폴리이미드 필름, 금속 피복 적층판 및 회로 기판 Download PDF

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Publication number
KR20210038331A
KR20210038331A KR1020200122729A KR20200122729A KR20210038331A KR 20210038331 A KR20210038331 A KR 20210038331A KR 1020200122729 A KR1020200122729 A KR 1020200122729A KR 20200122729 A KR20200122729 A KR 20200122729A KR 20210038331 A KR20210038331 A KR 20210038331A
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KR
South Korea
Prior art keywords
polyimide
layer
thermoplastic polyimide
thermoplastic
mol
Prior art date
Application number
KR1020200122729A
Other languages
English (en)
Korean (ko)
Inventor
도모노리 안도
요시키 스토
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Publication of KR20210038331A publication Critical patent/KR20210038331A/ko
Priority to KR1020210123699A priority Critical patent/KR102571970B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020200122729A 2019-09-28 2020-09-23 폴리이미드 필름, 금속 피복 적층판 및 회로 기판 KR20210038331A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020210123699A KR102571970B1 (ko) 2019-09-28 2021-09-16 금속 피복 적층판 및 회로 기판

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-178131 2019-09-28
JP2019178131 2019-09-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020210123699A Division KR102571970B1 (ko) 2019-09-28 2021-09-16 금속 피복 적층판 및 회로 기판

Publications (1)

Publication Number Publication Date
KR20210038331A true KR20210038331A (ko) 2021-04-07

Family

ID=75119549

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020200122729A KR20210038331A (ko) 2019-09-28 2020-09-23 폴리이미드 필름, 금속 피복 적층판 및 회로 기판
KR1020210123699A KR102571970B1 (ko) 2019-09-28 2021-09-16 금속 피복 적층판 및 회로 기판
KR1020230097185A KR20230117670A (ko) 2019-09-28 2023-07-26 금속 피복 적층판 및 회로 기판

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020210123699A KR102571970B1 (ko) 2019-09-28 2021-09-16 금속 피복 적층판 및 회로 기판
KR1020230097185A KR20230117670A (ko) 2019-09-28 2023-07-26 금속 피복 적층판 및 회로 기판

Country Status (4)

Country Link
JP (2) JP7184858B2 (ja)
KR (3) KR20210038331A (ja)
CN (1) CN112571901A (ja)
TW (1) TW202112912A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113604045B (zh) * 2021-08-31 2022-09-02 烟台丰鲁精细化工有限责任公司 一种低介电性能的热塑性聚酰亚胺树脂复合薄膜及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017159274A1 (ja) 2016-03-17 2017-09-21 新日鉄住金化学株式会社 ポリアミド酸、熱可塑性ポリイミド、樹脂フィルム、金属張積層板及び回路基板
WO2018061727A1 (ja) 2016-09-29 2018-04-05 新日鉄住金化学株式会社 ポリイミドフィルム、銅張積層板及び回路基板

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JP4124521B2 (ja) * 1998-08-05 2008-07-23 三井化学株式会社 ポリイミド金属箔積層板及びその製造方法
JP3783870B2 (ja) * 2003-11-05 2006-06-07 東洋紡績株式会社 半導体実装用フィルムサブストレート
JP3912614B2 (ja) * 2005-04-19 2007-05-09 東洋紡績株式会社 薄膜積層ポリイミドフィルム薄膜積層ポリイミドフィルムロール及びその利用
KR100993063B1 (ko) * 2008-03-31 2010-11-08 엘에스엠트론 주식회사 연성회로 동장적층판
JP5266925B2 (ja) * 2008-07-23 2013-08-21 住友金属鉱山株式会社 金属化ポリイミドフィルムとその製造方法
JP2011131456A (ja) * 2009-12-24 2011-07-07 Du Pont-Toray Co Ltd ガスバリアー性ポリイミドフィルムおよびそれを用いた金属積層体
JP5442491B2 (ja) * 2010-02-26 2014-03-12 新日鉄住金化学株式会社 熱伝導性金属−絶縁樹脂基板及びその製造方法
CN102009506A (zh) * 2010-07-16 2011-04-13 广东生益科技股份有限公司 双面挠性覆铜板及其制作方法
KR20140122207A (ko) * 2013-04-09 2014-10-17 주식회사 엘지화학 적층체 및 이를 이용하여 제조된 기판을 포함하는 소자
CN107405907B (zh) * 2015-03-26 2019-06-18 东丽株式会社 树脂层叠膜及含有其的层叠体、tft基板、有机el元件滤色片，以及它们的制造方法
JP6603032B2 (ja) * 2015-03-30 2019-11-06 日鉄ケミカル＆マテリアル株式会社 銅張積層板及び回路基板
JP6839594B2 (ja) 2016-04-27 2021-03-10 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及び銅張積層板
JP6966847B2 (ja) * 2016-08-10 2021-11-17 日鉄ケミカル＆マテリアル株式会社 透明ポリイミドフィルムの製造方法
JP7053208B2 (ja) * 2017-09-29 2022-04-12 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及び回路基板
JP6996997B2 (ja) * 2018-02-03 2022-01-17 日鉄ケミカル＆マテリアル株式会社 金属張積層板及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017159274A1 (ja) 2016-03-17 2017-09-21 新日鉄住金化学株式会社 ポリアミド酸、熱可塑性ポリイミド、樹脂フィルム、金属張積層板及び回路基板
WO2018061727A1 (ja) 2016-09-29 2018-04-05 新日鉄住金化学株式会社 ポリイミドフィルム、銅張積層板及び回路基板

Also Published As

Publication number Publication date
JP2022017273A (ja) 2022-01-25
KR102571970B1 (ko) 2023-08-29
CN112571901A (zh) 2021-03-30
JP7230148B2 (ja) 2023-02-28
KR20230117670A (ko) 2023-08-08
KR20210118024A (ko) 2021-09-29
TW202112912A (zh) 2021-04-01
JP2021054062A (ja) 2021-04-08
JP7184858B2 (ja) 2022-12-06

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