TW202112912A - 聚醯亞胺膜、覆金屬積層板及電路基板 - Google Patents

聚醯亞胺膜、覆金屬積層板及電路基板 Download PDF

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Publication number
TW202112912A
TW202112912A TW109133184A TW109133184A TW202112912A TW 202112912 A TW202112912 A TW 202112912A TW 109133184 A TW109133184 A TW 109133184A TW 109133184 A TW109133184 A TW 109133184A TW 202112912 A TW202112912 A TW 202112912A
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TW
Taiwan
Prior art keywords
polyimide
layer
thermoplastic
thermoplastic polyimide
polyimide film
Prior art date
Application number
TW109133184A
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English (en)
Chinese (zh)
Inventor
安藤智典
須藤芳樹
Original Assignee
日商日鐵化學材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日鐵化學材料股份有限公司 filed Critical 日商日鐵化學材料股份有限公司
Publication of TW202112912A publication Critical patent/TW202112912A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW109133184A 2019-09-28 2020-09-25 聚醯亞胺膜、覆金屬積層板及電路基板 TW202112912A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019178131 2019-09-28
JP2019-178131 2019-09-28

Publications (1)

Publication Number Publication Date
TW202112912A true TW202112912A (zh) 2021-04-01

Family

ID=75119549

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109133184A TW202112912A (zh) 2019-09-28 2020-09-25 聚醯亞胺膜、覆金屬積層板及電路基板

Country Status (4)

Country Link
JP (2) JP7184858B2 (ja)
KR (3) KR20210038331A (ja)
CN (1) CN112571901A (ja)
TW (1) TW202112912A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113604045B (zh) * 2021-08-31 2022-09-02 烟台丰鲁精细化工有限责任公司 一种低介电性能的热塑性聚酰亚胺树脂复合薄膜及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4124521B2 (ja) 1998-08-05 2008-07-23 三井化学株式会社 ポリイミド金属箔積層板及びその製造方法
JP3783870B2 (ja) * 2003-11-05 2006-06-07 東洋紡績株式会社 半導体実装用フィルムサブストレート
JP3912614B2 (ja) * 2005-04-19 2007-05-09 東洋紡績株式会社 薄膜積層ポリイミドフィルム薄膜積層ポリイミドフィルムロール及びその利用
KR100993063B1 (ko) * 2008-03-31 2010-11-08 엘에스엠트론 주식회사 연성회로 동장적층판
JP5266925B2 (ja) * 2008-07-23 2013-08-21 住友金属鉱山株式会社 金属化ポリイミドフィルムとその製造方法
JP2011131456A (ja) * 2009-12-24 2011-07-07 Du Pont-Toray Co Ltd ガスバリアー性ポリイミドフィルムおよびそれを用いた金属積層体
JP5442491B2 (ja) 2010-02-26 2014-03-12 新日鉄住金化学株式会社 熱伝導性金属−絶縁樹脂基板及びその製造方法
CN102009506A (zh) * 2010-07-16 2011-04-13 广东生益科技股份有限公司 双面挠性覆铜板及其制作方法
KR20140122677A (ko) * 2013-04-09 2014-10-20 주식회사 엘지화학 폴리이미드계 필름 및 이의 제조방법
WO2016152906A1 (ja) * 2015-03-26 2016-09-29 東レ株式会社 樹脂積層膜、それを含む積層体、ｔｆｔ基板、有機ｅｌ素子カラーフィルターならびにそれらの製造方法。
JP6603032B2 (ja) * 2015-03-30 2019-11-06 日鉄ケミカル＆マテリアル株式会社 銅張積層板及び回路基板
CN108699243B (zh) 2016-03-17 2021-05-18 日铁化学材料株式会社 聚酰胺酸、热塑性聚酰亚胺、树脂膜、层叠板及电路基板
JP6839594B2 (ja) * 2016-04-27 2021-03-10 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及び銅張積層板
JP6966847B2 (ja) * 2016-08-10 2021-11-17 日鉄ケミカル＆マテリアル株式会社 透明ポリイミドフィルムの製造方法
KR102290631B1 (ko) * 2016-09-29 2021-08-19 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 폴리이미드 필름, 동장 적층판 및 회로 기판
JP7053208B2 (ja) * 2017-09-29 2022-04-12 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及び回路基板
JP6996997B2 (ja) * 2018-02-03 2022-01-17 日鉄ケミカル＆マテリアル株式会社 金属張積層板及びその製造方法

Also Published As

Publication number Publication date
KR102571970B1 (ko) 2023-08-29
JP7230148B2 (ja) 2023-02-28
JP7184858B2 (ja) 2022-12-06
JP2021054062A (ja) 2021-04-08
KR20210038331A (ko) 2021-04-07
JP2022017273A (ja) 2022-01-25
CN112571901A (zh) 2021-03-30
KR20210118024A (ko) 2021-09-29
KR20230117670A (ko) 2023-08-08

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