KR20200133659A - 전자부품 부착장치, 전자부품 부착구조 및 전자부품의 부착방법 - Google Patents

전자부품 부착장치, 전자부품 부착구조 및 전자부품의 부착방법 Download PDF

Info

Publication number
KR20200133659A
KR20200133659A KR1020200013769A KR20200013769A KR20200133659A KR 20200133659 A KR20200133659 A KR 20200133659A KR 1020200013769 A KR1020200013769 A KR 1020200013769A KR 20200013769 A KR20200013769 A KR 20200013769A KR 20200133659 A KR20200133659 A KR 20200133659A
Authority
KR
South Korea
Prior art keywords
electronic component
receiving
adherend
fixing
main body
Prior art date
Application number
KR1020200013769A
Other languages
English (en)
Korean (ko)
Inventor
슈신 노다
다이수케 쿠수다
코타 오노야마
아츠로 타케시타
Original Assignee
호시덴 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 호시덴 가부시기가이샤 filed Critical 호시덴 가부시기가이샤
Publication of KR20200133659A publication Critical patent/KR20200133659A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
    • B60R11/02—Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the like; Arrangement of controls thereof
    • B60R11/0247—Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the like; Arrangement of controls thereof for microphones or earphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R13/00—Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
    • B60R13/02—Internal Trim mouldings ; Internal Ledges; Wall liners for passenger compartments; Roof liners
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
    • F16B5/06—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of clamps or clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
    • B60R2011/0001—Arrangements for holding or mounting articles, not otherwise provided for characterised by position
    • B60R2011/0003—Arrangements for holding or mounting articles, not otherwise provided for characterised by position inside the vehicle
    • B60R2011/0028—Ceiling, e.g. roof rails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Connection Of Plates (AREA)
  • Gasket Seals (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Telephone Set Structure (AREA)
KR1020200013769A 2019-05-20 2020-02-05 전자부품 부착장치, 전자부품 부착구조 및 전자부품의 부착방법 KR20200133659A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019094462 2019-05-20
JPJP-P-2019-094462 2019-05-20
JPJP-P-2019-153819 2019-08-26
JP2019153819A JP7278907B2 (ja) 2019-05-20 2019-08-26 電子部品取付装置、電子部品取付構造及び電子部品の取付方法

Publications (1)

Publication Number Publication Date
KR20200133659A true KR20200133659A (ko) 2020-11-30

Family

ID=73453933

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200013769A KR20200133659A (ko) 2019-05-20 2020-02-05 전자부품 부착장치, 전자부품 부착구조 및 전자부품의 부착방법

Country Status (3)

Country Link
US (1) US11102904B2 (ja)
JP (1) JP7278907B2 (ja)
KR (1) KR20200133659A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11827162B2 (en) * 2020-10-30 2023-11-28 Harman International Industries, Incorporated Methods for forming a hidden audio assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009264564A (ja) 2008-04-30 2009-11-12 Panasonic Corp 部品取付け装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008191007A (ja) 2007-02-05 2008-08-21 Denso Corp センサ装置の取り付け構造
WO2010146618A1 (ja) 2009-06-15 2010-12-23 三菱電機株式会社 超音波センサモジュールの取り付け装置および取り付け方法
DE102010044996A1 (de) 2010-09-10 2012-03-15 Valeo Schalter Und Sensoren Gmbh Sensoranordnung für ein Fahrzeug, Fahrzeug mit einer Sensoranordnung, Verfahren zum Herstellen einer Sensoranordnung und Versteifungsteil
DE102010049818A1 (de) 2010-10-27 2012-05-03 Valeo Schalter Und Sensoren Gmbh Anordnung mit einem Außenverkleidungselement und einer Haltevorrichtung, Fahrzeug mit einer Anordnung und Verfahren zum Herstellen einer Anordnung
JP5938673B2 (ja) 2011-12-28 2016-06-22 パナソニックＩｐマネジメント株式会社 超音波センサ
JP6160952B2 (ja) 2013-05-23 2017-07-12 パナソニックＩｐマネジメント株式会社 超音波装置
DE102015212599B3 (de) 2015-07-06 2016-06-23 Robert Bosch Gmbh Ultraschallsensorvorrichtung zur Anordnung an einem Verkleidungsbauteil eines Fahrzeugs
DE102015016206A1 (de) 2015-12-14 2017-06-14 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Sensoranordnung für eine Kraftfahrzeugkarosserie

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009264564A (ja) 2008-04-30 2009-11-12 Panasonic Corp 部品取付け装置

Also Published As

Publication number Publication date
US11102904B2 (en) 2021-08-24
JP2020191435A (ja) 2020-11-26
JP7278907B2 (ja) 2023-05-22
US20200375055A1 (en) 2020-11-26

Similar Documents

Publication Publication Date Title
US10362378B2 (en) Microphone
US7822221B2 (en) Speaker device
JP2000101699A (ja) 電話ラウドスピ―カ包囲体
US11910139B2 (en) Acoustic device and electronic apparatus
JP6634354B2 (ja) 緊急通報システム用ハンズフリー通話装置
JP2019205167A (ja) 見えないヘッドライナーマイクロフォン
KR20200133659A (ko) 전자부품 부착장치, 전자부품 부착구조 및 전자부품의 부착방법
EP0691773A2 (en) Resealable module for supporting acoustic transducer and printed circuit components within receiver end of craftperson's test set
CN111963531B (zh) 电子部件组件及其与粘附体的组合件、及用于安装电子部件的方法
JP2013207125A (ja) 電子装置
WO2015076408A1 (ja) 携帯端末
US20040240699A1 (en) Microphone
JP2917758B2 (ja) 振動部品搭載プリント基板収容箱
WO2022114087A1 (ja) スピーカ及びスピーカの取付構造
EP4228281A1 (en) Driver holder, driver module, and headset
CN112601974B (zh) 保持器部件
KR102007201B1 (ko) 엘리베이터용 비상통화장치의 스피커 모듈
JP7294223B2 (ja) 超音波センサおよび振動吸収体
JP3868851B2 (ja) 電気音響変換器
JP2021078079A (ja) マイク取付装置
JP2023085757A (ja) マイク取付構造および電気機器
JP2013244905A (ja) スイッチ構造
JPH11249662A (ja) 表面実装型電磁発音体
CN112601974A (zh) 保持器部件
JPH1168349A (ja) 発音体の取付構造

Legal Events

Date Code Title Description
E902 Notification of reason for refusal