KR20200123182A - 실장 장치 - Google Patents

실장 장치 Download PDF

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Publication number
KR20200123182A
KR20200123182A KR1020207026812A KR20207026812A KR20200123182A KR 20200123182 A KR20200123182 A KR 20200123182A KR 1020207026812 A KR1020207026812 A KR 1020207026812A KR 20207026812 A KR20207026812 A KR 20207026812A KR 20200123182 A KR20200123182 A KR 20200123182A
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KR
South Korea
Prior art keywords
substrate
mounting
magazine rack
chip component
stage
Prior art date
Application number
KR1020207026812A
Other languages
English (en)
Korean (ko)
Inventor
가츠미 데라다
다카시 하레
겐 기타무라
Original Assignee
토레이 엔지니어링 컴퍼니, 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 토레이 엔지니어링 컴퍼니, 리미티드 filed Critical 토레이 엔지니어링 컴퍼니, 리미티드
Publication of KR20200123182A publication Critical patent/KR20200123182A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
KR1020207026812A 2018-02-22 2019-02-13 실장 장치 KR20200123182A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018029257A JP7023740B2 (ja) 2018-02-22 2018-02-22 実装装置
JPJP-P-2018-029257 2018-02-22
PCT/JP2019/004924 WO2019163586A1 (ja) 2018-02-22 2019-02-13 実装装置

Publications (1)

Publication Number Publication Date
KR20200123182A true KR20200123182A (ko) 2020-10-28

Family

ID=67687190

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207026812A KR20200123182A (ko) 2018-02-22 2019-02-13 실장 장치

Country Status (4)

Country Link
JP (1) JP7023740B2 (ja)
KR (1) KR20200123182A (ja)
TW (1) TWI756517B (ja)
WO (1) WO2019163586A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022011530A (ja) * 2020-06-30 2022-01-17 キヤノン株式会社 物品の製造装置、物品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243703A (ja) 2004-02-24 2005-09-08 Matsushita Electric Ind Co Ltd 基板搬送機及び基板搬送方法
KR20170022275A (ko) 2015-08-20 2017-03-02 주식회사 안소프트 스팸 콘텐츠의 필터링이 가능한 통화 대기 중 콘텐츠 제공 시스템 및 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6139529A (ja) * 1984-07-31 1986-02-25 Toshiba Corp マウンタ装置
JPS6139940U (ja) * 1984-08-15 1986-03-13 株式会社東芝 半導体デバイスのボンデイング装置
JPS62285843A (ja) * 1986-06-04 1987-12-11 Fujitsu Ltd 基板形部品授受装置
JP2849519B2 (ja) * 1993-02-17 1999-01-20 シャープ株式会社 半導体素子接合装置
JPH0722780A (ja) * 1993-06-30 1995-01-24 Matsushita Electric Ind Co Ltd プリント基板の実装設備
JPH09260896A (ja) * 1996-03-19 1997-10-03 Matsushita Electric Ind Co Ltd 回路基板搬送装置
JPH11266099A (ja) * 1998-03-17 1999-09-28 Matsushita Electric Ind Co Ltd 基板の送り出し装置
JP2001036291A (ja) * 1999-07-16 2001-02-09 Matsushita Electric Ind Co Ltd 板状ワークの供給装置
JP3972941B2 (ja) * 2004-06-30 2007-09-05 オムロン株式会社 部品実装基板用のはんだ印刷検査方法およびはんだ印刷検査用の検査機
JP5211295B2 (ja) * 2008-09-10 2013-06-12 株式会社アドウェルズ 部品供給装置および部品供給方法
JP5373517B2 (ja) * 2009-09-14 2013-12-18 株式会社ディスコ 搬送機構および加工装置
JP6218600B2 (ja) * 2013-12-26 2017-10-25 株式会社ディスコ 加工装置
JP6717630B2 (ja) * 2016-03-29 2020-07-01 芝浦メカトロニクス株式会社 電子部品の実装装置
WO2018008066A1 (ja) * 2016-07-04 2018-01-11 株式会社鈴木 転写方法および実装方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243703A (ja) 2004-02-24 2005-09-08 Matsushita Electric Ind Co Ltd 基板搬送機及び基板搬送方法
KR20170022275A (ko) 2015-08-20 2017-03-02 주식회사 안소프트 스팸 콘텐츠의 필터링이 가능한 통화 대기 중 콘텐츠 제공 시스템 및 방법

Also Published As

Publication number Publication date
TWI756517B (zh) 2022-03-01
WO2019163586A1 (ja) 2019-08-29
JP2019145692A (ja) 2019-08-29
TW201937621A (zh) 2019-09-16
JP7023740B2 (ja) 2022-02-22

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