TWI756517B - 安裝裝置 - Google Patents
安裝裝置 Download PDFInfo
- Publication number
- TWI756517B TWI756517B TW108105963A TW108105963A TWI756517B TW I756517 B TWI756517 B TW I756517B TW 108105963 A TW108105963 A TW 108105963A TW 108105963 A TW108105963 A TW 108105963A TW I756517 B TWI756517 B TW I756517B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- mounting
- conveying
- mentioned
- stage
- Prior art date
Links
- 238000009434 installation Methods 0.000 title description 27
- 239000000758 substrate Substances 0.000 claims abstract description 490
- 230000007246 mechanism Effects 0.000 claims abstract description 75
- 230000007723 transport mechanism Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 53
- 238000001179 sorption measurement Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 8
- 238000000605 extraction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000032258 transport Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018029257A JP7023740B2 (ja) | 2018-02-22 | 2018-02-22 | 実装装置 |
JP2018-029257 | 2018-02-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201937621A TW201937621A (zh) | 2019-09-16 |
TWI756517B true TWI756517B (zh) | 2022-03-01 |
Family
ID=67687190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108105963A TWI756517B (zh) | 2018-02-22 | 2019-02-22 | 安裝裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7023740B2 (ja) |
KR (1) | KR20200123182A (ja) |
TW (1) | TWI756517B (ja) |
WO (1) | WO2019163586A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022011530A (ja) * | 2020-06-30 | 2022-01-17 | キヤノン株式会社 | 物品の製造装置、物品の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722780A (ja) * | 1993-06-30 | 1995-01-24 | Matsushita Electric Ind Co Ltd | プリント基板の実装設備 |
JPH11266099A (ja) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | 基板の送り出し装置 |
TW200613723A (en) * | 2004-06-30 | 2006-05-01 | Omron Tateisi Electronics Co | Inspection method and system for and method of producing component mounting substrate |
TW201803436A (zh) * | 2016-07-04 | 2018-01-16 | 鈴木股份有限公司 | 轉印方法及安裝方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6139529A (ja) * | 1984-07-31 | 1986-02-25 | Toshiba Corp | マウンタ装置 |
JPS6139940U (ja) * | 1984-08-15 | 1986-03-13 | 株式会社東芝 | 半導体デバイスのボンデイング装置 |
JPS62285843A (ja) * | 1986-06-04 | 1987-12-11 | Fujitsu Ltd | 基板形部品授受装置 |
JP2849519B2 (ja) * | 1993-02-17 | 1999-01-20 | シャープ株式会社 | 半導体素子接合装置 |
JPH09260896A (ja) * | 1996-03-19 | 1997-10-03 | Matsushita Electric Ind Co Ltd | 回路基板搬送装置 |
JP2001036291A (ja) | 1999-07-16 | 2001-02-09 | Matsushita Electric Ind Co Ltd | 板状ワークの供給装置 |
JP2005243703A (ja) | 2004-02-24 | 2005-09-08 | Matsushita Electric Ind Co Ltd | 基板搬送機及び基板搬送方法 |
JP5211295B2 (ja) | 2008-09-10 | 2013-06-12 | 株式会社アドウェルズ | 部品供給装置および部品供給方法 |
JP5373517B2 (ja) | 2009-09-14 | 2013-12-18 | 株式会社ディスコ | 搬送機構および加工装置 |
JP6218600B2 (ja) | 2013-12-26 | 2017-10-25 | 株式会社ディスコ | 加工装置 |
KR20170022275A (ko) | 2015-08-20 | 2017-03-02 | 주식회사 안소프트 | 스팸 콘텐츠의 필터링이 가능한 통화 대기 중 콘텐츠 제공 시스템 및 방법 |
JP6717630B2 (ja) | 2016-03-29 | 2020-07-01 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
-
2018
- 2018-02-22 JP JP2018029257A patent/JP7023740B2/ja active Active
-
2019
- 2019-02-13 WO PCT/JP2019/004924 patent/WO2019163586A1/ja active Application Filing
- 2019-02-13 KR KR1020207026812A patent/KR20200123182A/ko not_active Application Discontinuation
- 2019-02-22 TW TW108105963A patent/TWI756517B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722780A (ja) * | 1993-06-30 | 1995-01-24 | Matsushita Electric Ind Co Ltd | プリント基板の実装設備 |
JPH11266099A (ja) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | 基板の送り出し装置 |
TW200613723A (en) * | 2004-06-30 | 2006-05-01 | Omron Tateisi Electronics Co | Inspection method and system for and method of producing component mounting substrate |
TW201803436A (zh) * | 2016-07-04 | 2018-01-16 | 鈴木股份有限公司 | 轉印方法及安裝方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2019163586A1 (ja) | 2019-08-29 |
TW201937621A (zh) | 2019-09-16 |
JP7023740B2 (ja) | 2022-02-22 |
KR20200123182A (ko) | 2020-10-28 |
JP2019145692A (ja) | 2019-08-29 |
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