TWI756517B - 安裝裝置 - Google Patents

安裝裝置 Download PDF

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Publication number
TWI756517B
TWI756517B TW108105963A TW108105963A TWI756517B TW I756517 B TWI756517 B TW I756517B TW 108105963 A TW108105963 A TW 108105963A TW 108105963 A TW108105963 A TW 108105963A TW I756517 B TWI756517 B TW I756517B
Authority
TW
Taiwan
Prior art keywords
substrate
mounting
conveying
mentioned
stage
Prior art date
Application number
TW108105963A
Other languages
English (en)
Chinese (zh)
Other versions
TW201937621A (zh
Inventor
寺田勝美
晴孝志
北村賢
Original Assignee
日商東麗工程股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗工程股份有限公司 filed Critical 日商東麗工程股份有限公司
Publication of TW201937621A publication Critical patent/TW201937621A/zh
Application granted granted Critical
Publication of TWI756517B publication Critical patent/TWI756517B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
TW108105963A 2018-02-22 2019-02-22 安裝裝置 TWI756517B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018029257A JP7023740B2 (ja) 2018-02-22 2018-02-22 実装装置
JP2018-029257 2018-02-22

Publications (2)

Publication Number Publication Date
TW201937621A TW201937621A (zh) 2019-09-16
TWI756517B true TWI756517B (zh) 2022-03-01

Family

ID=67687190

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108105963A TWI756517B (zh) 2018-02-22 2019-02-22 安裝裝置

Country Status (4)

Country Link
JP (1) JP7023740B2 (ja)
KR (1) KR20200123182A (ja)
TW (1) TWI756517B (ja)
WO (1) WO2019163586A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022011530A (ja) * 2020-06-30 2022-01-17 キヤノン株式会社 物品の製造装置、物品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722780A (ja) * 1993-06-30 1995-01-24 Matsushita Electric Ind Co Ltd プリント基板の実装設備
JPH11266099A (ja) * 1998-03-17 1999-09-28 Matsushita Electric Ind Co Ltd 基板の送り出し装置
TW200613723A (en) * 2004-06-30 2006-05-01 Omron Tateisi Electronics Co Inspection method and system for and method of producing component mounting substrate
TW201803436A (zh) * 2016-07-04 2018-01-16 鈴木股份有限公司 轉印方法及安裝方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6139529A (ja) * 1984-07-31 1986-02-25 Toshiba Corp マウンタ装置
JPS6139940U (ja) * 1984-08-15 1986-03-13 株式会社東芝 半導体デバイスのボンデイング装置
JPS62285843A (ja) * 1986-06-04 1987-12-11 Fujitsu Ltd 基板形部品授受装置
JP2849519B2 (ja) * 1993-02-17 1999-01-20 シャープ株式会社 半導体素子接合装置
JPH09260896A (ja) * 1996-03-19 1997-10-03 Matsushita Electric Ind Co Ltd 回路基板搬送装置
JP2001036291A (ja) 1999-07-16 2001-02-09 Matsushita Electric Ind Co Ltd 板状ワークの供給装置
JP2005243703A (ja) 2004-02-24 2005-09-08 Matsushita Electric Ind Co Ltd 基板搬送機及び基板搬送方法
JP5211295B2 (ja) 2008-09-10 2013-06-12 株式会社アドウェルズ 部品供給装置および部品供給方法
JP5373517B2 (ja) 2009-09-14 2013-12-18 株式会社ディスコ 搬送機構および加工装置
JP6218600B2 (ja) 2013-12-26 2017-10-25 株式会社ディスコ 加工装置
KR20170022275A (ko) 2015-08-20 2017-03-02 주식회사 안소프트 스팸 콘텐츠의 필터링이 가능한 통화 대기 중 콘텐츠 제공 시스템 및 방법
JP6717630B2 (ja) 2016-03-29 2020-07-01 芝浦メカトロニクス株式会社 電子部品の実装装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722780A (ja) * 1993-06-30 1995-01-24 Matsushita Electric Ind Co Ltd プリント基板の実装設備
JPH11266099A (ja) * 1998-03-17 1999-09-28 Matsushita Electric Ind Co Ltd 基板の送り出し装置
TW200613723A (en) * 2004-06-30 2006-05-01 Omron Tateisi Electronics Co Inspection method and system for and method of producing component mounting substrate
TW201803436A (zh) * 2016-07-04 2018-01-16 鈴木股份有限公司 轉印方法及安裝方法

Also Published As

Publication number Publication date
WO2019163586A1 (ja) 2019-08-29
TW201937621A (zh) 2019-09-16
JP7023740B2 (ja) 2022-02-22
KR20200123182A (ko) 2020-10-28
JP2019145692A (ja) 2019-08-29

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