KR20180084622A - 척 테이블의 막힘 검출 방법 및 가공 장치 - Google Patents

척 테이블의 막힘 검출 방법 및 가공 장치 Download PDF

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Publication number
KR20180084622A
KR20180084622A KR1020170180910A KR20170180910A KR20180084622A KR 20180084622 A KR20180084622 A KR 20180084622A KR 1020170180910 A KR1020170180910 A KR 1020170180910A KR 20170180910 A KR20170180910 A KR 20170180910A KR 20180084622 A KR20180084622 A KR 20180084622A
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South Korea
Prior art keywords
chuck table
processing apparatus
detection method
clogging
clogging detection
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KR1020170180910A
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English (en)
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KR102386559B1 (ko
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히데키 마츠이
시게노리 하라다
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가부시기가이샤 디스코
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Publication of KR20180084622A publication Critical patent/KR20180084622A/ko
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Publication of KR102386559B1 publication Critical patent/KR102386559B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Abstract

본 발명은 척 테이블의 막힘을 검출할 때에, 시간을 들이지 않고, 또한, 작업자의 수고가 들지 않도록 하는 것을 목적으로 한다.
척 테이블(30A)의 막힘을 검출하는 검출 방법으로서, 척 테이블(30A)의 유지면(300a)에 에어와 물을 분출시킨 상태에서 척 테이블(30A)의 유지면(300a)을 촬상하는 촬상 단계와, 촬상한 화상을 2치화 처리하는 화상 처리 단계와, 화상 처리 단계에서 2치화 처리된 화상에 의해 척 테이블(30A)의 눈 막힘량을 판단하는 판단 단계를 포함한다.
KR1020170180910A 2017-01-16 2017-12-27 척 테이블의 막힘 검출 방법 및 가공 장치 KR102386559B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017005019A JP6879747B2 (ja) 2017-01-16 2017-01-16 チャックテーブルの詰まり検出方法及び加工装置
JPJP-P-2017-005019 2017-01-16

Publications (2)

Publication Number Publication Date
KR20180084622A true KR20180084622A (ko) 2018-07-25
KR102386559B1 KR102386559B1 (ko) 2022-04-15

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US (1) US10500696B2 (ko)
JP (1) JP6879747B2 (ko)
KR (1) KR102386559B1 (ko)
CN (1) CN108321095B (ko)
MY (1) MY192104A (ko)
TW (1) TWI752131B (ko)

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JP7254611B2 (ja) * 2019-05-10 2023-04-10 株式会社ディスコ 加工装置
JP7408306B2 (ja) * 2019-06-26 2024-01-05 株式会社ディスコ 切削装置
JP7299773B2 (ja) * 2019-07-09 2023-06-28 株式会社ディスコ 研削装置
JP2021010996A (ja) * 2019-07-09 2021-02-04 株式会社ディスコ 加工装置
JP2021044330A (ja) * 2019-09-10 2021-03-18 株式会社ディスコ ウェーハの研削方法
JP7292164B2 (ja) * 2019-09-25 2023-06-16 株式会社ディスコ 加工装置
JP7481135B2 (ja) 2020-03-17 2024-05-10 株式会社ディスコ チャックテーブルの検査方法
CN112917312B (zh) * 2021-01-21 2022-02-08 浙江科菱智能装备有限公司 一种全自动上下料的数控磨床用机械手
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CN114061648A (zh) * 2021-09-29 2022-02-18 君原电子科技(海宁)有限公司 一种静电卡盘细孔堵塞检测装置及检测方法

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Also Published As

Publication number Publication date
JP6879747B2 (ja) 2021-06-02
TW201834048A (zh) 2018-09-16
TWI752131B (zh) 2022-01-11
MY192104A (en) 2022-07-27
JP2018114563A (ja) 2018-07-26
US10500696B2 (en) 2019-12-10
US20180200865A1 (en) 2018-07-19
CN108321095B (zh) 2023-04-14
CN108321095A (zh) 2018-07-24
KR102386559B1 (ko) 2022-04-15

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