KR20170095371A - 재료 증착 어레인지먼트, 진공 증착 시스템, 및 재료를 증착하기 위한 방법 - Google Patents

재료 증착 어레인지먼트, 진공 증착 시스템, 및 재료를 증착하기 위한 방법 Download PDF

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KR20170095371A
KR20170095371A KR1020177019900A KR20177019900A KR20170095371A KR 20170095371 A KR20170095371 A KR 20170095371A KR 1020177019900 A KR1020177019900 A KR 1020177019900A KR 20177019900 A KR20177019900 A KR 20177019900A KR 20170095371 A KR20170095371 A KR 20170095371A
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South Korea
Prior art keywords
section
nozzle
substrate
deposition
vacuum
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KR1020177019900A
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English (en)
Korean (ko)
Inventor
토마스 게벨
우베 쉬쓸러
요세 마누엘 디에게즈-캄포
안드레아스 로프
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20170095371A publication Critical patent/KR20170095371A/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H01L51/001—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020177019900A 2014-12-17 2014-12-17 재료 증착 어레인지먼트, 진공 증착 시스템, 및 재료를 증착하기 위한 방법 Ceased KR20170095371A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/078299 WO2016095997A1 (en) 2014-12-17 2014-12-17 Material deposition arrangement, a vacuum deposition system and method for depositing material

Publications (1)

Publication Number Publication Date
KR20170095371A true KR20170095371A (ko) 2017-08-22

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KR1020177019900A Ceased KR20170095371A (ko) 2014-12-17 2014-12-17 재료 증착 어레인지먼트, 진공 증착 시스템, 및 재료를 증착하기 위한 방법

Country Status (7)

Country Link
US (1) US20170314120A1 (enExample)
EP (1) EP3234213A1 (enExample)
JP (1) JP6513201B2 (enExample)
KR (1) KR20170095371A (enExample)
CN (1) CN107109624B (enExample)
TW (1) TWI619829B (enExample)
WO (1) WO2016095997A1 (enExample)

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JP6512543B2 (ja) * 2015-02-28 2019-05-15 ケニックス株式会社 蒸着セル、薄膜作製装置および薄膜作製方法
WO2018054472A1 (en) * 2016-09-22 2018-03-29 Applied Materials, Inc. Nozzle for a distribution assembly of a material deposition source arrangement, material deposition source arrangement, vacuum deposition system and method for depositing material
KR101899678B1 (ko) * 2016-12-21 2018-09-17 주식회사 포스코 필터유닛 및 이를 포함하는 도금장치
JP2019508571A (ja) * 2017-01-31 2019-03-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 材料堆積装置、真空堆積システム、及び真空堆積を行う方法
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
CN110621803B (zh) * 2018-04-18 2022-07-12 应用材料公司 用于沉积已蒸发材料于基板上的蒸发源、沉积设备、用于测量已蒸发材料的蒸汽压力的方法、及用于确定已蒸发材料的蒸发率的方法
CN112135921A (zh) * 2018-06-08 2020-12-25 应用材料公司 静态蒸发源、真空处理腔室以及在基板上沉积材料的方法
CN113166925B (zh) * 2018-12-11 2023-12-22 应用材料公司 用于沉积已蒸发材料的蒸气源、用于蒸气源的喷嘴、真空沉积系统和用于沉积已蒸发材料的方法
WO2020122944A1 (en) * 2018-12-14 2020-06-18 Applied Materials, Inc. Measurement assembly for measuring a deposition rate and method therefore
KR102219435B1 (ko) * 2019-05-28 2021-02-24 경기대학교 산학협력단 노즐 및 노즐을 포함한 증착 장치
JP7304435B2 (ja) 2019-05-31 2023-07-06 アプライド マテリアルズ インコーポレイテッド 基板上に膜を形成するための方法およびシステム
JP2021041375A (ja) * 2019-09-13 2021-03-18 株式会社東芝 導電性流体用吐出ヘッド
KR102800267B1 (ko) * 2019-10-31 2025-04-23 어플라이드 머티어리얼스, 인코포레이티드 재료 증착 장치, 진공 증착 시스템, 및 재료 증착 장치를 제조하기 위한 방법
CN117396629A (zh) * 2021-05-21 2024-01-12 应用材料公司 用于材料沉积源的分配器的喷嘴、材料沉积源、真空沉积系统以及用于将材料沉积的方法

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US4854263B1 (en) * 1987-08-14 1997-06-17 Applied Materials Inc Inlet manifold and methods for increasing gas dissociation and for PECVD of dielectric films
JP4440837B2 (ja) * 2005-01-31 2010-03-24 三星モバイルディスプレイ株式會社 蒸発源及びこれを採用した蒸着装置
JP4545010B2 (ja) * 2005-02-18 2010-09-15 日立造船株式会社 蒸着装置
US20080131587A1 (en) * 2006-11-30 2008-06-05 Boroson Michael L Depositing organic material onto an oled substrate
WO2011065999A1 (en) * 2008-12-18 2011-06-03 Veeco Instruments Inc. Linear deposition source
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KR101182265B1 (ko) * 2009-12-22 2012-09-12 삼성디스플레이 주식회사 증발원 및 이를 포함하는 증착 장치
JP5620137B2 (ja) * 2010-03-31 2014-11-05 田中貴金属工業株式会社 超音速ノズルおよび切削工具
KR101708420B1 (ko) * 2010-09-15 2017-02-21 삼성디스플레이 주식회사 기판 증착 시스템 및 이를 이용한 증착 방법
JP2014005478A (ja) * 2010-10-08 2014-01-16 Kaneka Corp 蒸着装置
JP5735304B2 (ja) * 2010-12-21 2015-06-17 株式会社日立国際電気 基板処理装置、基板の製造方法、半導体デバイスの製造方法およびガス供給管
DE102010055285A1 (de) * 2010-12-21 2012-06-21 Solarion Ag Photovoltaik Verdampferquelle, Verdampferkammer und Beschichtungsverfahren
WO2012124564A1 (ja) * 2011-03-14 2012-09-20 シャープ株式会社 蒸着粒子射出装置および蒸着装置並びに蒸着方法
PL2524974T3 (pl) * 2011-05-18 2014-09-30 Riber Wtryskiwacz dla układu osadzania próżniowego oparów
JP2014015637A (ja) * 2012-07-06 2014-01-30 Hitachi High-Technologies Corp 蒸着装置
KR101361917B1 (ko) * 2012-07-31 2014-02-13 주식회사 야스 대용량 고온 증발원
US9142779B2 (en) * 2013-08-06 2015-09-22 University Of Rochester Patterning of OLED materials

Also Published As

Publication number Publication date
US20170314120A1 (en) 2017-11-02
TWI619829B (zh) 2018-04-01
CN107109624B (zh) 2019-10-15
JP2018501405A (ja) 2018-01-18
TW201631192A (zh) 2016-09-01
WO2016095997A1 (en) 2016-06-23
EP3234213A1 (en) 2017-10-25
CN107109624A (zh) 2017-08-29
JP6513201B2 (ja) 2019-05-15

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