TWI619829B - 材料沉積裝置、真空沉積系統及沉積材料的方法 - Google Patents

材料沉積裝置、真空沉積系統及沉積材料的方法 Download PDF

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Publication number
TWI619829B
TWI619829B TW104142233A TW104142233A TWI619829B TW I619829 B TWI619829 B TW I619829B TW 104142233 A TW104142233 A TW 104142233A TW 104142233 A TW104142233 A TW 104142233A TW I619829 B TWI619829 B TW I619829B
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TW
Taiwan
Prior art keywords
section
nozzle
size
deposition apparatus
vacuum
Prior art date
Application number
TW104142233A
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English (en)
Chinese (zh)
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TW201631192A (zh
Inventor
湯瑪士 爵伯勒
佑維 史奇伯勒
喬斯曼紐 地古坎柏
安德率斯 露博
Original Assignee
應用材料股份有限公司
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Publication of TW201631192A publication Critical patent/TW201631192A/zh
Application granted granted Critical
Publication of TWI619829B publication Critical patent/TWI619829B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW104142233A 2014-12-17 2015-12-16 材料沉積裝置、真空沉積系統及沉積材料的方法 TWI619829B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP2014/078299 WO2016095997A1 (en) 2014-12-17 2014-12-17 Material deposition arrangement, a vacuum deposition system and method for depositing material
??PCT/EP2014/078299 2014-12-17

Publications (2)

Publication Number Publication Date
TW201631192A TW201631192A (zh) 2016-09-01
TWI619829B true TWI619829B (zh) 2018-04-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142233A TWI619829B (zh) 2014-12-17 2015-12-16 材料沉積裝置、真空沉積系統及沉積材料的方法

Country Status (7)

Country Link
US (1) US20170314120A1 (enExample)
EP (1) EP3234213A1 (enExample)
JP (1) JP6513201B2 (enExample)
KR (1) KR20170095371A (enExample)
CN (1) CN107109624B (enExample)
TW (1) TWI619829B (enExample)
WO (1) WO2016095997A1 (enExample)

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JP6512543B2 (ja) * 2015-02-28 2019-05-15 ケニックス株式会社 蒸着セル、薄膜作製装置および薄膜作製方法
EP3317433A1 (en) * 2016-09-22 2018-05-09 Applied Materials, Inc. Nozzle for a distribution assembly of a material deposition source arrangement, material deposition source arrangement, vacuum deposition system and method for depositing material
KR101899678B1 (ko) * 2016-12-21 2018-09-17 주식회사 포스코 필터유닛 및 이를 포함하는 도금장치
JP2019508571A (ja) * 2017-01-31 2019-03-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 材料堆積装置、真空堆積システム、及び真空堆積を行う方法
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
EP3781721A1 (en) * 2018-04-18 2021-02-24 Applied Materials, Inc. Evaporation source for deposition of evaporated material on a substrate, deposition apparatus, method for measuring a vapor pressure of evaporated material, and method for determining an evaporation rate of an evaporated material
WO2019233601A1 (en) * 2018-06-08 2019-12-12 Applied Materials, Inc. Static evaporation source, vacuum processing chamber, and method of depositing material on a substrate
KR102680574B1 (ko) * 2018-12-11 2024-07-01 어플라이드 머티어리얼스, 인코포레이티드 증발 재료를 증착하기 위한 증기 소스, 증기 소스를 위한 노즐, 진공 증착 시스템, 및 증발 재료를 증착하기 위한 방법
KR20210078567A (ko) * 2018-12-14 2021-06-28 어플라이드 머티어리얼스, 인코포레이티드 측정 조립체, 증착 소스, 증착 장치 및 방법
KR102219435B1 (ko) * 2019-05-28 2021-02-24 경기대학교 산학협력단 노즐 및 노즐을 포함한 증착 장치
CN113853449B (zh) * 2019-05-31 2023-10-10 应用材料公司 用于在基板上形成膜的方法及系统
JP2021041375A (ja) * 2019-09-13 2021-03-18 株式会社東芝 導電性流体用吐出ヘッド
KR102800267B1 (ko) * 2019-10-31 2025-04-23 어플라이드 머티어리얼스, 인코포레이티드 재료 증착 장치, 진공 증착 시스템, 및 재료 증착 장치를 제조하기 위한 방법
WO2022243734A1 (en) * 2021-05-21 2022-11-24 Applied Materials, Inc. Nozzle for a distributor of a material deposition source, material deposition source, vacuum deposition system and method for depositing material

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US20120064728A1 (en) * 2010-09-15 2012-03-15 Jeong-Ho Yi Substrate depositing system and depositing method using the same
KR20140017730A (ko) * 2012-07-31 2014-02-12 주식회사 야스 대용량 고온 증발원

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KR20140017730A (ko) * 2012-07-31 2014-02-12 주식회사 야스 대용량 고온 증발원

Also Published As

Publication number Publication date
WO2016095997A1 (en) 2016-06-23
JP2018501405A (ja) 2018-01-18
TW201631192A (zh) 2016-09-01
US20170314120A1 (en) 2017-11-02
CN107109624B (zh) 2019-10-15
CN107109624A (zh) 2017-08-29
EP3234213A1 (en) 2017-10-25
JP6513201B2 (ja) 2019-05-15
KR20170095371A (ko) 2017-08-22

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