TWI619829B - 材料沉積裝置、真空沉積系統及沉積材料的方法 - Google Patents

材料沉積裝置、真空沉積系統及沉積材料的方法 Download PDF

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Publication number
TWI619829B
TWI619829B TW104142233A TW104142233A TWI619829B TW I619829 B TWI619829 B TW I619829B TW 104142233 A TW104142233 A TW 104142233A TW 104142233 A TW104142233 A TW 104142233A TW I619829 B TWI619829 B TW I619829B
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TW
Taiwan
Prior art keywords
section
nozzle
size
deposition apparatus
vacuum
Prior art date
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TW104142233A
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English (en)
Chinese (zh)
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TW201631192A (zh
Inventor
湯瑪士 爵伯勒
佑維 史奇伯勒
喬斯曼紐 地古坎柏
安德率斯 露博
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應用材料股份有限公司
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Publication of TW201631192A publication Critical patent/TW201631192A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW104142233A 2014-12-17 2015-12-16 材料沉積裝置、真空沉積系統及沉積材料的方法 TWI619829B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??PCT/EP2014/078299 2014-12-17
PCT/EP2014/078299 WO2016095997A1 (en) 2014-12-17 2014-12-17 Material deposition arrangement, a vacuum deposition system and method for depositing material

Publications (2)

Publication Number Publication Date
TW201631192A TW201631192A (zh) 2016-09-01
TWI619829B true TWI619829B (zh) 2018-04-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142233A TWI619829B (zh) 2014-12-17 2015-12-16 材料沉積裝置、真空沉積系統及沉積材料的方法

Country Status (7)

Country Link
US (1) US20170314120A1 (enExample)
EP (1) EP3234213A1 (enExample)
JP (1) JP6513201B2 (enExample)
KR (1) KR20170095371A (enExample)
CN (1) CN107109624B (enExample)
TW (1) TWI619829B (enExample)
WO (1) WO2016095997A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6512543B2 (ja) * 2015-02-28 2019-05-15 ケニックス株式会社 蒸着セル、薄膜作製装置および薄膜作製方法
JP6657239B2 (ja) * 2016-09-22 2020-03-04 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 材料堆積源構成の分配アセンブリのためのノズル、材料堆積源構成、真空堆積システム、及び材料を堆積させるための方法
KR101899678B1 (ko) * 2016-12-21 2018-09-17 주식회사 포스코 필터유닛 및 이를 포함하는 도금장치
EP3374540A1 (en) * 2017-01-31 2018-09-19 Applied Materials, Inc. Material deposition arrangement, vacuum deposition system and method therefor
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
US20210147975A1 (en) * 2018-04-18 2021-05-20 Applied Materials, Inc. Evaporation source for deposition of evaporated material on a substrate, deposition apparatus, method for measuring a vapor pressure of evaporated material, and method for determining an evaporation rate of an evaporated material
CN112135921A (zh) * 2018-06-08 2020-12-25 应用材料公司 静态蒸发源、真空处理腔室以及在基板上沉积材料的方法
JP2022512348A (ja) * 2018-12-11 2022-02-03 アプライド マテリアルズ インコーポレイテッド 蒸発材料を堆積するための蒸気源、蒸気源のためのノズル、真空堆積システム、及び蒸発材料を堆積するための方法
CN112996948A (zh) * 2018-12-14 2021-06-18 应用材料公司 用于测量沉积速率的测量组件及其方法
KR102219435B1 (ko) * 2019-05-28 2021-02-24 경기대학교 산학협력단 노즐 및 노즐을 포함한 증착 장치
KR102732061B1 (ko) * 2019-05-31 2024-11-18 어플라이드 머티어리얼스, 인코포레이티드 기판들 상에 막들을 형성하기 위한 방법들 및 시스템들
JP2021041375A (ja) * 2019-09-13 2021-03-18 株式会社東芝 導電性流体用吐出ヘッド
WO2021085685A1 (en) * 2019-10-31 2021-05-06 Applied Materials, Inc Material deposition arrangement, vacuum deposition system, and method for manufacturing a material deposition arrangement
CN117396629A (zh) * 2021-05-21 2024-01-12 应用材料公司 用于材料沉积源的分配器的喷嘴、材料沉积源、真空沉积系统以及用于将材料沉积的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006225725A (ja) * 2005-02-18 2006-08-31 Hitachi Zosen Corp 蒸着装置
US20120064728A1 (en) * 2010-09-15 2012-03-15 Jeong-Ho Yi Substrate depositing system and depositing method using the same
KR20140017730A (ko) * 2012-07-31 2014-02-12 주식회사 야스 대용량 고온 증발원

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6015698B2 (ja) * 1981-09-30 1985-04-20 日本真空技術株式会社 ノズル付蒸発器
US4854263B1 (en) * 1987-08-14 1997-06-17 Applied Materials Inc Inlet manifold and methods for increasing gas dissociation and for PECVD of dielectric films
JP4440837B2 (ja) * 2005-01-31 2010-03-24 三星モバイルディスプレイ株式會社 蒸発源及びこれを採用した蒸着装置
US20080131587A1 (en) * 2006-11-30 2008-06-05 Boroson Michael L Depositing organic material onto an oled substrate
WO2011065999A1 (en) * 2008-12-18 2011-06-03 Veeco Instruments Inc. Linear deposition source
KR20110024223A (ko) * 2009-09-01 2011-03-09 주식회사 선익시스템 증발 장치 및 이를 포함하는 진공 증착 장치
KR101182265B1 (ko) * 2009-12-22 2012-09-12 삼성디스플레이 주식회사 증발원 및 이를 포함하는 증착 장치
JP5620137B2 (ja) * 2010-03-31 2014-11-05 田中貴金属工業株式会社 超音速ノズルおよび切削工具
JP2014005478A (ja) * 2010-10-08 2014-01-16 Kaneka Corp 蒸着装置
DE102010055285A1 (de) * 2010-12-21 2012-06-21 Solarion Ag Photovoltaik Verdampferquelle, Verdampferkammer und Beschichtungsverfahren
JP5735304B2 (ja) * 2010-12-21 2015-06-17 株式会社日立国際電気 基板処理装置、基板の製造方法、半導体デバイスの製造方法およびガス供給管
CN103385035B (zh) * 2011-03-14 2016-02-17 夏普株式会社 蒸镀颗粒射出装置和蒸镀装置以及蒸镀方法
EP2524974B1 (en) * 2011-05-18 2014-05-07 Riber Injector for a vacuum vapour deposition system
JP2014015637A (ja) * 2012-07-06 2014-01-30 Hitachi High-Technologies Corp 蒸着装置
US9142779B2 (en) * 2013-08-06 2015-09-22 University Of Rochester Patterning of OLED materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006225725A (ja) * 2005-02-18 2006-08-31 Hitachi Zosen Corp 蒸着装置
US20120064728A1 (en) * 2010-09-15 2012-03-15 Jeong-Ho Yi Substrate depositing system and depositing method using the same
KR20140017730A (ko) * 2012-07-31 2014-02-12 주식회사 야스 대용량 고온 증발원

Also Published As

Publication number Publication date
JP2018501405A (ja) 2018-01-18
WO2016095997A1 (en) 2016-06-23
EP3234213A1 (en) 2017-10-25
CN107109624B (zh) 2019-10-15
JP6513201B2 (ja) 2019-05-15
US20170314120A1 (en) 2017-11-02
TW201631192A (zh) 2016-09-01
KR20170095371A (ko) 2017-08-22
CN107109624A (zh) 2017-08-29

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