CN107109624B - 材料沉积布置、真空沉积系统和沉积材料的方法 - Google Patents

材料沉积布置、真空沉积系统和沉积材料的方法 Download PDF

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Publication number
CN107109624B
CN107109624B CN201480084154.1A CN201480084154A CN107109624B CN 107109624 B CN107109624 B CN 107109624B CN 201480084154 A CN201480084154 A CN 201480084154A CN 107109624 B CN107109624 B CN 107109624B
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section
nozzle
arrangement
deposition
substrate
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Expired - Fee Related
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Chinese (zh)
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CN107109624A (zh
Inventor
托马斯·格比利
乌韦·许斯勒
乔斯·曼纽尔·迭格斯-坎波
安德烈亚斯·勒普
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Applied Materials Inc
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Applied Materials Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201480084154.1A 2014-12-17 2014-12-17 材料沉积布置、真空沉积系统和沉积材料的方法 Expired - Fee Related CN107109624B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/078299 WO2016095997A1 (en) 2014-12-17 2014-12-17 Material deposition arrangement, a vacuum deposition system and method for depositing material

Publications (2)

Publication Number Publication Date
CN107109624A CN107109624A (zh) 2017-08-29
CN107109624B true CN107109624B (zh) 2019-10-15

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CN201480084154.1A Expired - Fee Related CN107109624B (zh) 2014-12-17 2014-12-17 材料沉积布置、真空沉积系统和沉积材料的方法

Country Status (7)

Country Link
US (1) US20170314120A1 (enExample)
EP (1) EP3234213A1 (enExample)
JP (1) JP6513201B2 (enExample)
KR (1) KR20170095371A (enExample)
CN (1) CN107109624B (enExample)
TW (1) TWI619829B (enExample)
WO (1) WO2016095997A1 (enExample)

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JP6512543B2 (ja) * 2015-02-28 2019-05-15 ケニックス株式会社 蒸着セル、薄膜作製装置および薄膜作製方法
KR20180048444A (ko) * 2016-09-22 2018-05-10 어플라이드 머티어리얼스, 인코포레이티드 재료 증착 소스 어레인지먼트의 분배 어셈블리를 위한 노즐, 재료 증착 소스 어레인지먼트, 진공 증착 시스템, 및 재료를 증착하기 위한 방법
KR101899678B1 (ko) * 2016-12-21 2018-09-17 주식회사 포스코 필터유닛 및 이를 포함하는 도금장치
WO2018141365A1 (en) * 2017-01-31 2018-08-09 Applied Materials, Inc. Material deposition arrangement, vacuum deposition system and method therefor
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
EP3781721A1 (en) * 2018-04-18 2021-02-24 Applied Materials, Inc. Evaporation source for deposition of evaporated material on a substrate, deposition apparatus, method for measuring a vapor pressure of evaporated material, and method for determining an evaporation rate of an evaporated material
CN112135921A (zh) * 2018-06-08 2020-12-25 应用材料公司 静态蒸发源、真空处理腔室以及在基板上沉积材料的方法
KR102680574B1 (ko) * 2018-12-11 2024-07-01 어플라이드 머티어리얼스, 인코포레이티드 증발 재료를 증착하기 위한 증기 소스, 증기 소스를 위한 노즐, 진공 증착 시스템, 및 증발 재료를 증착하기 위한 방법
KR20210078567A (ko) * 2018-12-14 2021-06-28 어플라이드 머티어리얼스, 인코포레이티드 측정 조립체, 증착 소스, 증착 장치 및 방법
KR102219435B1 (ko) * 2019-05-28 2021-02-24 경기대학교 산학협력단 노즐 및 노즐을 포함한 증착 장치
JP7304435B2 (ja) * 2019-05-31 2023-07-06 アプライド マテリアルズ インコーポレイテッド 基板上に膜を形成するための方法およびシステム
JP2021041375A (ja) * 2019-09-13 2021-03-18 株式会社東芝 導電性流体用吐出ヘッド
KR102800267B1 (ko) * 2019-10-31 2025-04-23 어플라이드 머티어리얼스, 인코포레이티드 재료 증착 장치, 진공 증착 시스템, 및 재료 증착 장치를 제조하기 위한 방법
US20240247362A1 (en) * 2021-05-21 2024-07-25 Applied Materials, Inc. Nozzle for a distributor of a material deposition source, material deposition source, vacuum deposition system and method for depositing material

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JP2006225725A (ja) * 2005-02-18 2006-08-31 Hitachi Zosen Corp 蒸着装置
CN101548410A (zh) * 2006-11-30 2009-09-30 伊斯曼柯达公司 在oled基板上沉积有机材料
US20100285218A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source
CN102102176A (zh) * 2009-12-22 2011-06-22 三星移动显示器株式会社 蒸发源和具有该蒸发源的沉积设备

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KR20110024223A (ko) * 2009-09-01 2011-03-09 주식회사 선익시스템 증발 장치 및 이를 포함하는 진공 증착 장치
JP5620137B2 (ja) * 2010-03-31 2014-11-05 田中貴金属工業株式会社 超音速ノズルおよび切削工具
KR101708420B1 (ko) * 2010-09-15 2017-02-21 삼성디스플레이 주식회사 기판 증착 시스템 및 이를 이용한 증착 방법
JP2014005478A (ja) * 2010-10-08 2014-01-16 Kaneka Corp 蒸着装置
DE102010055285A1 (de) * 2010-12-21 2012-06-21 Solarion Ag Photovoltaik Verdampferquelle, Verdampferkammer und Beschichtungsverfahren
JP5735304B2 (ja) * 2010-12-21 2015-06-17 株式会社日立国際電気 基板処理装置、基板の製造方法、半導体デバイスの製造方法およびガス供給管
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Publication number Priority date Publication date Assignee Title
JP2006225725A (ja) * 2005-02-18 2006-08-31 Hitachi Zosen Corp 蒸着装置
CN101548410A (zh) * 2006-11-30 2009-09-30 伊斯曼柯达公司 在oled基板上沉积有机材料
US20100285218A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source
CN102102176A (zh) * 2009-12-22 2011-06-22 三星移动显示器株式会社 蒸发源和具有该蒸发源的沉积设备

Also Published As

Publication number Publication date
WO2016095997A1 (en) 2016-06-23
CN107109624A (zh) 2017-08-29
JP6513201B2 (ja) 2019-05-15
US20170314120A1 (en) 2017-11-02
JP2018501405A (ja) 2018-01-18
TWI619829B (zh) 2018-04-01
EP3234213A1 (en) 2017-10-25
TW201631192A (zh) 2016-09-01
KR20170095371A (ko) 2017-08-22

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