KR20160134502A - 고체 촬상 센서 및 카메라 - Google Patents

고체 촬상 센서 및 카메라 Download PDF

Info

Publication number
KR20160134502A
KR20160134502A KR1020160056116A KR20160056116A KR20160134502A KR 20160134502 A KR20160134502 A KR 20160134502A KR 1020160056116 A KR1020160056116 A KR 1020160056116A KR 20160056116 A KR20160056116 A KR 20160056116A KR 20160134502 A KR20160134502 A KR 20160134502A
Authority
KR
South Korea
Prior art keywords
microlens
array
center
axis
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020160056116A
Other languages
English (en)
Korean (ko)
Inventor
가즈나리 가와바타
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20160134502A publication Critical patent/KR20160134502A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H04N5/2254—
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
    • G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N5/335—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B2003/0093—Simple or compound lenses characterised by the shape

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
KR1020160056116A 2015-05-14 2016-05-09 고체 촬상 센서 및 카메라 Ceased KR20160134502A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015099511A JP6506614B2 (ja) 2015-05-14 2015-05-14 固体撮像装置およびカメラ
JPJP-P-2015-099511 2015-05-14

Publications (1)

Publication Number Publication Date
KR20160134502A true KR20160134502A (ko) 2016-11-23

Family

ID=55802223

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160056116A Ceased KR20160134502A (ko) 2015-05-14 2016-05-09 고체 촬상 센서 및 카메라

Country Status (9)

Country Link
US (1) US10114151B2 (enExample)
EP (1) EP3093887B1 (enExample)
JP (1) JP6506614B2 (enExample)
KR (1) KR20160134502A (enExample)
CN (1) CN106161891B (enExample)
BR (1) BR102016009246A2 (enExample)
PH (1) PH12016000181A1 (enExample)
RU (1) RU2650729C2 (enExample)
SG (1) SG10201603687RA (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3293887A1 (en) 2016-09-08 2018-03-14 Samsung Electronics Co., Ltd. Near field communication device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10205894B2 (en) 2015-09-11 2019-02-12 Canon Kabushiki Kaisha Imaging device and imaging system
JP6776011B2 (ja) 2016-06-10 2020-10-28 キヤノン株式会社 撮像装置及び撮像システム
JP6688165B2 (ja) 2016-06-10 2020-04-28 キヤノン株式会社 撮像装置及び撮像システム
JP6727938B2 (ja) 2016-06-10 2020-07-22 キヤノン株式会社 撮像装置、撮像装置の制御方法、及び撮像システム
JP7013119B2 (ja) 2016-07-21 2022-01-31 キヤノン株式会社 固体撮像素子、固体撮像素子の製造方法、及び撮像システム
CN109842766B (zh) * 2018-12-28 2021-05-18 上海集成电路研发中心有限公司 一种极坐标图像传感器及其进行图像处理的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5662401A (en) * 1995-12-13 1997-09-02 Philips Electronics North America Corporation Integrating lens array and image forming method for improved optical efficiency
US7375892B2 (en) * 2003-10-09 2008-05-20 Micron Technology, Inc. Ellipsoidal gapless microlens array and method of fabrication
JP2007335723A (ja) 2006-06-16 2007-12-27 Fujifilm Corp 固体撮像素子用マイクロレンズ及びその製造方法
US20080011936A1 (en) 2006-07-14 2008-01-17 Visera Technologies Company Ltd, Roc Imaging sensor having microlenses of different radii of curvature
JP4941233B2 (ja) 2007-10-31 2012-05-30 大日本印刷株式会社 固体撮像素子およびそれを用いた撮像装置
US7687757B1 (en) * 2009-01-29 2010-03-30 Visera Technologies Company Limited Design of microlens on pixel array
US8102460B2 (en) 2009-11-20 2012-01-24 Fujifilm Corporation Solid-state imaging device
GB2498972A (en) * 2012-02-01 2013-08-07 St Microelectronics Ltd Pixel and microlens array
JP5791664B2 (ja) 2013-06-28 2015-10-07 キヤノン株式会社 光学素子アレイ、及び固体撮像装置
JP2015109314A (ja) 2013-12-03 2015-06-11 株式会社東芝 固体撮像装置
JP2016058538A (ja) 2014-09-09 2016-04-21 キヤノン株式会社 固体撮像装置およびカメラ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3293887A1 (en) 2016-09-08 2018-03-14 Samsung Electronics Co., Ltd. Near field communication device

Also Published As

Publication number Publication date
RU2016118405A (ru) 2017-11-16
JP2016219469A (ja) 2016-12-22
EP3093887B1 (en) 2018-01-24
CN106161891A (zh) 2016-11-23
RU2650729C2 (ru) 2018-04-17
CN106161891B (zh) 2019-07-30
US20160334550A1 (en) 2016-11-17
EP3093887A1 (en) 2016-11-16
JP6506614B2 (ja) 2019-04-24
SG10201603687RA (en) 2016-12-29
PH12016000181A1 (en) 2018-01-22
BR102016009246A2 (pt) 2016-11-16
US10114151B2 (en) 2018-10-30

Similar Documents

Publication Publication Date Title
KR20160134502A (ko) 고체 촬상 센서 및 카메라
CN206947348U (zh) 图像传感器
CN206759600U (zh) 成像系统
JP2021069118A (ja) 色分離レンズアレイを具備するイメージセンサ、及びそれを含む電子装置
KR102765854B1 (ko) 색분리 렌즈 어레이를 적용한 영상 획득 장치 및 방법
CN205211754U (zh) 图像传感器
JP2011221253A (ja) 撮像装置、固体撮像素子、撮像方法およびプログラム
US20180288398A1 (en) Asymmetric angular response pixels for singl sensor stereo
US20160360134A1 (en) Imaging device and imaging module
CN113037956B (zh) 成像装置、移动终端和图像感测方法
JP2017059589A (ja) 固体撮像素子及び撮像装置
CN105280654A (zh) 图像拾取装置和图像拾取系统
US20160073016A1 (en) Sensor with focus detection units
US8842214B2 (en) Color imaging element, imaging device, and storage medium storing an imaging program
US20160286104A1 (en) Imaging element and imaging device
JP4884465B2 (ja) ピクセルアレイ上の非対称マイクロレンズ
CN110890390B (zh) 包括多个成像像素的图像传感器
JP2007335723A (ja) 固体撮像素子用マイクロレンズ及びその製造方法
US10074683B2 (en) Imaging systems having lens substrates with total internal reflection mitigation structures
US20190258026A1 (en) Image sensor and focus adjustment device
US20190268543A1 (en) Image sensor and focus adjustment device
JP2017079243A (ja) 固体撮像装置及びカメラ
US9955053B2 (en) Image-capturing assembly and array lens units thereof
US20190267422A1 (en) Image sensor and focus adjustment device
JP5699573B2 (ja) 撮像素子

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20160509

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20171109

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20160509

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190221

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20190705

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20190221

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I