JP6506614B2 - 固体撮像装置およびカメラ - Google Patents

固体撮像装置およびカメラ Download PDF

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Publication number
JP6506614B2
JP6506614B2 JP2015099511A JP2015099511A JP6506614B2 JP 6506614 B2 JP6506614 B2 JP 6506614B2 JP 2015099511 A JP2015099511 A JP 2015099511A JP 2015099511 A JP2015099511 A JP 2015099511A JP 6506614 B2 JP6506614 B2 JP 6506614B2
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JP
Japan
Prior art keywords
microlens
array
center
imaging device
solid
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JP2015099511A
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English (en)
Japanese (ja)
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JP2016219469A (ja
JP2016219469A5 (enExample
Inventor
一成 川端
一成 川端
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2015099511A priority Critical patent/JP6506614B2/ja
Priority to EP16165488.4A priority patent/EP3093887B1/en
Priority to US15/136,017 priority patent/US10114151B2/en
Priority to BR102016009246A priority patent/BR102016009246A2/pt
Priority to KR1020160056116A priority patent/KR20160134502A/ko
Priority to SG10201603687RA priority patent/SG10201603687RA/en
Priority to PH12016000181A priority patent/PH12016000181A1/en
Priority to RU2016118405A priority patent/RU2650729C2/ru
Priority to CN201610317738.XA priority patent/CN106161891B/zh
Publication of JP2016219469A publication Critical patent/JP2016219469A/ja
Publication of JP2016219469A5 publication Critical patent/JP2016219469A5/ja
Application granted granted Critical
Publication of JP6506614B2 publication Critical patent/JP6506614B2/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
    • G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B2003/0093—Simple or compound lenses characterised by the shape

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2015099511A 2015-05-14 2015-05-14 固体撮像装置およびカメラ Active JP6506614B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2015099511A JP6506614B2 (ja) 2015-05-14 2015-05-14 固体撮像装置およびカメラ
EP16165488.4A EP3093887B1 (en) 2015-05-14 2016-04-15 Solid-state image sensor and camera
US15/136,017 US10114151B2 (en) 2015-05-14 2016-04-22 Solid-state image sensor and camera
BR102016009246A BR102016009246A2 (pt) 2015-05-14 2016-04-26 sensor de imagem de estado sólido e câmera
KR1020160056116A KR20160134502A (ko) 2015-05-14 2016-05-09 고체 촬상 센서 및 카메라
SG10201603687RA SG10201603687RA (en) 2015-05-14 2016-05-10 Solid-state image sensor and camera
PH12016000181A PH12016000181A1 (en) 2015-05-14 2016-05-11 Solid-state image sensor and camera
RU2016118405A RU2650729C2 (ru) 2015-05-14 2016-05-12 Твердотельный датчик изображений и камера
CN201610317738.XA CN106161891B (zh) 2015-05-14 2016-05-13 固态图像传感器和照相机

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015099511A JP6506614B2 (ja) 2015-05-14 2015-05-14 固体撮像装置およびカメラ

Publications (3)

Publication Number Publication Date
JP2016219469A JP2016219469A (ja) 2016-12-22
JP2016219469A5 JP2016219469A5 (enExample) 2018-06-21
JP6506614B2 true JP6506614B2 (ja) 2019-04-24

Family

ID=55802223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015099511A Active JP6506614B2 (ja) 2015-05-14 2015-05-14 固体撮像装置およびカメラ

Country Status (9)

Country Link
US (1) US10114151B2 (enExample)
EP (1) EP3093887B1 (enExample)
JP (1) JP6506614B2 (enExample)
KR (1) KR20160134502A (enExample)
CN (1) CN106161891B (enExample)
BR (1) BR102016009246A2 (enExample)
PH (1) PH12016000181A1 (enExample)
RU (1) RU2650729C2 (enExample)
SG (1) SG10201603687RA (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10205894B2 (en) 2015-09-11 2019-02-12 Canon Kabushiki Kaisha Imaging device and imaging system
JP6776011B2 (ja) 2016-06-10 2020-10-28 キヤノン株式会社 撮像装置及び撮像システム
JP6688165B2 (ja) 2016-06-10 2020-04-28 キヤノン株式会社 撮像装置及び撮像システム
JP6727938B2 (ja) 2016-06-10 2020-07-22 キヤノン株式会社 撮像装置、撮像装置の制御方法、及び撮像システム
JP7013119B2 (ja) 2016-07-21 2022-01-31 キヤノン株式会社 固体撮像素子、固体撮像素子の製造方法、及び撮像システム
US10212576B2 (en) 2016-09-08 2019-02-19 Samsung Electronics Co., Ltd. Near field communication device
CN109842766B (zh) * 2018-12-28 2021-05-18 上海集成电路研发中心有限公司 一种极坐标图像传感器及其进行图像处理的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5662401A (en) * 1995-12-13 1997-09-02 Philips Electronics North America Corporation Integrating lens array and image forming method for improved optical efficiency
US7375892B2 (en) * 2003-10-09 2008-05-20 Micron Technology, Inc. Ellipsoidal gapless microlens array and method of fabrication
JP2007335723A (ja) 2006-06-16 2007-12-27 Fujifilm Corp 固体撮像素子用マイクロレンズ及びその製造方法
US20080011936A1 (en) 2006-07-14 2008-01-17 Visera Technologies Company Ltd, Roc Imaging sensor having microlenses of different radii of curvature
JP4941233B2 (ja) 2007-10-31 2012-05-30 大日本印刷株式会社 固体撮像素子およびそれを用いた撮像装置
US7687757B1 (en) * 2009-01-29 2010-03-30 Visera Technologies Company Limited Design of microlens on pixel array
US8102460B2 (en) 2009-11-20 2012-01-24 Fujifilm Corporation Solid-state imaging device
GB2498972A (en) * 2012-02-01 2013-08-07 St Microelectronics Ltd Pixel and microlens array
JP5791664B2 (ja) 2013-06-28 2015-10-07 キヤノン株式会社 光学素子アレイ、及び固体撮像装置
JP2015109314A (ja) 2013-12-03 2015-06-11 株式会社東芝 固体撮像装置
JP2016058538A (ja) 2014-09-09 2016-04-21 キヤノン株式会社 固体撮像装置およびカメラ

Also Published As

Publication number Publication date
RU2016118405A (ru) 2017-11-16
JP2016219469A (ja) 2016-12-22
EP3093887B1 (en) 2018-01-24
CN106161891A (zh) 2016-11-23
RU2650729C2 (ru) 2018-04-17
CN106161891B (zh) 2019-07-30
US20160334550A1 (en) 2016-11-17
EP3093887A1 (en) 2016-11-16
SG10201603687RA (en) 2016-12-29
KR20160134502A (ko) 2016-11-23
PH12016000181A1 (en) 2018-01-22
BR102016009246A2 (pt) 2016-11-16
US10114151B2 (en) 2018-10-30

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