KR20160058091A - 성막 마스크 및 터치 패널 기판 - Google Patents

성막 마스크 및 터치 패널 기판 Download PDF

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Publication number
KR20160058091A
KR20160058091A KR1020167004934A KR20167004934A KR20160058091A KR 20160058091 A KR20160058091 A KR 20160058091A KR 1020167004934 A KR1020167004934 A KR 1020167004934A KR 20167004934 A KR20167004934 A KR 20167004934A KR 20160058091 A KR20160058091 A KR 20160058091A
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KR
South Korea
Prior art keywords
mask
substrate
resin
film
frame
Prior art date
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KR1020167004934A
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English (en)
Korean (ko)
Inventor
미치노부 미즈무라
Original Assignee
브이 테크놀로지 씨오. 엘티디
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Application filed by 브이 테크놀로지 씨오. 엘티디 filed Critical 브이 테크놀로지 씨오. 엘티디
Publication of KR20160058091A publication Critical patent/KR20160058091A/ko

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Insulated Conductors (AREA)
KR1020167004934A 2013-09-20 2014-09-18 성막 마스크 및 터치 패널 기판 KR20160058091A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013195552A JP6168944B2 (ja) 2013-09-20 2013-09-20 成膜マスク
JPJP-P-2013-195552 2013-09-20
PCT/JP2014/074708 WO2015041296A1 (ja) 2013-09-20 2014-09-18 成膜マスク及びタッチパネル基板

Publications (1)

Publication Number Publication Date
KR20160058091A true KR20160058091A (ko) 2016-05-24

Family

ID=52688943

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167004934A KR20160058091A (ko) 2013-09-20 2014-09-18 성막 마스크 및 터치 패널 기판

Country Status (5)

Country Link
JP (1) JP6168944B2 (zh)
KR (1) KR20160058091A (zh)
CN (1) CN105555991B (zh)
TW (1) TW201525163A (zh)
WO (1) WO2015041296A1 (zh)

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* Cited by examiner, † Cited by third party
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US10934614B2 (en) 2016-03-23 2021-03-02 Hon Hai Precision Industry Co., Ltd. Vapor deposition mask, vapor deposition mask production method, and organic semiconductor element production method
CN105714247A (zh) * 2016-04-01 2016-06-29 昆山允升吉光电科技有限公司 一种oled蒸镀用掩模板组件
JP6949507B2 (ja) * 2016-08-05 2021-10-13 日鉄ケミカル＆マテリアル株式会社 蒸着マスク及びその製造方法並びに蒸着マスク用積層体及びその製造方法
CN107686962A (zh) * 2016-08-05 2018-02-13 新日铁住金化学株式会社 蒸镀掩模及其制造方法以及蒸镀掩模用层叠体及其制造方法
CN113463018A (zh) * 2016-09-30 2021-10-01 大日本印刷株式会社 框架一体式的蒸镀掩模及其制备体和制造方法、蒸镀图案形成方法
JP6904718B2 (ja) * 2017-02-10 2021-07-21 株式会社ジャパンディスプレイ 蒸着マスク、蒸着マスクの製造方法および蒸着マスクの製造装置
JP6749275B2 (ja) * 2017-03-31 2020-09-02 芝浦メカトロニクス株式会社 アウターマスク、プラズマ処理装置、およびフォトマスクの製造方法
US10670959B2 (en) * 2017-05-10 2020-06-02 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle and method of using the same
CN107385391A (zh) * 2017-07-14 2017-11-24 京东方科技集团股份有限公司 掩膜板、oled显示基板及其制作方法、显示装置
CN208608230U (zh) * 2017-08-01 2019-03-15 上海自旭光电科技有限公司 用于有机发光二极管显示器的制造设备
WO2019186902A1 (ja) * 2018-03-29 2019-10-03 シャープ株式会社 蒸着マスク、および、蒸着マスクの製造方法
CN108508694B (zh) * 2018-03-30 2021-10-29 京东方科技集团股份有限公司 掩膜装置和曝光设备
JP6658790B2 (ja) * 2018-04-19 2020-03-04 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及びパターンの形成方法
CN109445632A (zh) * 2018-10-24 2019-03-08 信利光电股份有限公司 一种金属网格触摸屏制造方法
JP2021165424A (ja) * 2020-04-08 2021-10-14 株式会社ブイ・テクノロジー 蒸着マスク用フレーム、フレーム付き蒸着マスク、及び蒸着方法
KR20220021994A (ko) * 2020-08-14 2022-02-23 삼성디스플레이 주식회사 마스크, 마스크의 제조방법, 및 표시 패널의 제조방법
CN112359317A (zh) * 2020-10-27 2021-02-12 京东方科技集团股份有限公司 掩膜板及显示面板的制备方法

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* Cited by examiner, † Cited by third party
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JP3539229B2 (ja) * 1997-10-15 2004-07-07 東レ株式会社 有機電界発光装置の製造方法
JP4200290B2 (ja) * 2003-05-21 2008-12-24 パナソニック株式会社 マスクユニット
JP4269986B2 (ja) * 2004-03-19 2009-05-27 住友金属鉱山株式会社 透明導電性薄膜製造用酸化物焼結体ターゲット、透明導電性薄膜、透明導電性基板、表示デバイスおよび有機エレクトロルミネッセンス素子
JP4375232B2 (ja) * 2005-01-06 2009-12-02 セイコーエプソン株式会社 マスク成膜方法
JP2006199998A (ja) * 2005-01-20 2006-08-03 Seiko Epson Corp 成膜装置、成膜方法
JP2010180438A (ja) * 2009-02-04 2010-08-19 Mitsubishi Electric Corp マスクユニットおよびマスクユニットを有する蒸着装置
JP5607312B2 (ja) * 2009-04-02 2014-10-15 株式会社ボンマーク 蒸着マスク及びその製造方法
JP5288072B2 (ja) * 2012-01-12 2013-09-11 大日本印刷株式会社 蒸着マスク、蒸着マスク装置の製造方法、及び有機半導体素子の製造方法
JP5895540B2 (ja) * 2012-01-12 2016-03-30 大日本印刷株式会社 蒸着マスク
JP6142194B2 (ja) * 2012-11-15 2017-06-07 株式会社ブイ・テクノロジー 蒸着マスクの製造方法及び蒸着マスク
JP5958824B2 (ja) * 2012-11-15 2016-08-02 株式会社ブイ・テクノロジー 蒸着マスクの製造方法
KR102218952B1 (ko) * 2013-03-26 2021-02-23 다이니폰 인사츠 가부시키가이샤 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법
KR20150143433A (ko) * 2013-04-12 2015-12-23 다이니폰 인사츠 가부시키가이샤 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법

Also Published As

Publication number Publication date
JP6168944B2 (ja) 2017-07-26
CN105555991B (zh) 2018-03-20
WO2015041296A1 (ja) 2015-03-26
JP2015059262A (ja) 2015-03-30
TW201525163A (zh) 2015-07-01
CN105555991A (zh) 2016-05-04

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