KR20150097478A - 산화아연계 투명 도전막 - Google Patents
산화아연계 투명 도전막 Download PDFInfo
- Publication number
- KR20150097478A KR20150097478A KR1020157014306A KR20157014306A KR20150097478A KR 20150097478 A KR20150097478 A KR 20150097478A KR 1020157014306 A KR1020157014306 A KR 1020157014306A KR 20157014306 A KR20157014306 A KR 20157014306A KR 20150097478 A KR20150097478 A KR 20150097478A
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- South Korea
- Prior art keywords
- atoms
- titanium
- gallium
- atom
- aluminum
- Prior art date
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 title claims abstract description 239
- 239000011787 zinc oxide Substances 0.000 title claims abstract description 117
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 261
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 164
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 149
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 112
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 79
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 72
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 72
- 125000004429 atom Chemical group 0.000 claims abstract description 63
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 55
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims abstract description 47
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 101
- 239000000758 substrate Substances 0.000 claims description 99
- 239000010936 titanium Substances 0.000 claims description 84
- 238000004544 sputter deposition Methods 0.000 claims description 60
- 239000000203 mixture Substances 0.000 claims description 52
- 239000004065 semiconductor Substances 0.000 claims description 50
- 239000002994 raw material Substances 0.000 claims description 49
- 239000011701 zinc Substances 0.000 claims description 45
- 238000005245 sintering Methods 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 239000002775 capsule Substances 0.000 claims description 29
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 26
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 229910052710 silicon Inorganic materials 0.000 claims description 20
- 239000010703 silicon Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 12
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 11
- 229910002601 GaN Inorganic materials 0.000 claims description 10
- 238000010894 electron beam technology Methods 0.000 claims description 10
- 238000007733 ion plating Methods 0.000 claims description 10
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 10
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 9
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 9
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 claims description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 9
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 9
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- DEIVNMVWRDMSMJ-UHFFFAOYSA-N hydrogen peroxide;oxotitanium Chemical compound OO.[Ti]=O DEIVNMVWRDMSMJ-UHFFFAOYSA-N 0.000 description 4
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- KELHQGOVULCJSG-UHFFFAOYSA-N n,n-dimethyl-1-(5-methylfuran-2-yl)ethane-1,2-diamine Chemical compound CN(C)C(CN)C1=CC=C(C)O1 KELHQGOVULCJSG-UHFFFAOYSA-N 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 239000004408 titanium dioxide Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
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- 238000009849 vacuum degassing Methods 0.000 description 3
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- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 3
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
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- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Photovoltaic Devices (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (5)
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JPJP-P-2012-274248 | 2012-12-17 | ||
JP2012274248 | 2012-12-17 | ||
JPJP-P-2013-174153 | 2013-08-26 | ||
JP2013174153 | 2013-08-26 | ||
PCT/JP2013/083350 WO2014097963A1 (fr) | 2012-12-17 | 2013-12-12 | Film conducteur transparent à base d'oxyde de zinc |
Publications (1)
Publication Number | Publication Date |
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KR20150097478A true KR20150097478A (ko) | 2015-08-26 |
Family
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Family Applications (1)
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KR1020157014306A KR20150097478A (ko) | 2012-12-17 | 2013-12-12 | 산화아연계 투명 도전막 |
Country Status (5)
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JP (1) | JPWO2014097963A1 (fr) |
KR (1) | KR20150097478A (fr) |
CN (1) | CN104871257B (fr) |
TW (1) | TW201435105A (fr) |
WO (1) | WO2014097963A1 (fr) |
Families Citing this family (13)
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JP5949718B2 (ja) * | 2013-09-30 | 2016-07-13 | Tdk株式会社 | スパッタリングターゲット |
JP6372467B2 (ja) * | 2014-10-15 | 2018-08-15 | 株式会社環境システムヤマノ | 融雪装置 |
JP6709171B2 (ja) * | 2014-12-09 | 2020-06-10 | リンテック株式会社 | 透明導電膜及び透明導電膜の製造方法 |
JP6419572B2 (ja) * | 2014-12-26 | 2018-11-07 | 浜松ホトニクス株式会社 | 光電面、光電変換管、イメージインテンシファイア、及び光電子増倍管 |
CN105294096B (zh) * | 2015-10-16 | 2018-03-09 | 中国科学院上海硅酸盐研究所 | 一种低电阻氧化锌陶瓷材料及其制备方法 |
CN105355771B (zh) * | 2015-10-16 | 2018-09-28 | 中国科学院上海硅酸盐研究所 | 一种高功率因子氧化锌热电材料及其制备方法 |
JP6134368B2 (ja) * | 2015-10-19 | 2017-05-24 | Jx金属株式会社 | 焼結体及び該焼結体からなるスパッタリングターゲット並びに該スパッタリングターゲットを用いて形成した薄膜 |
CN105669182A (zh) * | 2016-01-05 | 2016-06-15 | 北京工业大学 | 一种用放电等离子烧结研究镓掺杂氧化锌陶瓷最佳烧结工艺的方法 |
WO2017122618A1 (fr) * | 2016-01-15 | 2017-07-20 | 住友化学株式会社 | Procédé de préparation d'un oxyde métallique composite amorphe |
JP6888318B2 (ja) * | 2016-03-23 | 2021-06-16 | 三菱マテリアル株式会社 | 積層透明導電膜、積層配線膜及び積層配線膜の製造方法 |
WO2017164209A1 (fr) * | 2016-03-23 | 2017-09-28 | 三菱マテリアル株式会社 | Film conducteur transparent stratifié, film de câblage stratifié, et procédé de fabrication d'un film de câblage stratifié |
CN113666735B (zh) * | 2021-09-10 | 2022-07-05 | 山东大学 | 连续调控氧化锌陶瓷光吸收性质的方法、氧化锌陶瓷及制备方法 |
CN116751032A (zh) * | 2023-06-21 | 2023-09-15 | 深圳众诚达应用材料股份有限公司 | 一种zto靶材及其制备方法 |
Family Cites Families (10)
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JP4808682B2 (ja) * | 2007-08-03 | 2011-11-02 | Jx日鉱日石金属株式会社 | 焼結体、透明導電膜の製造方法及び透明導電膜 |
WO2009116990A1 (fr) * | 2008-03-17 | 2009-09-24 | Midwest Research Institute | Films minces au zno dopé de haute qualité |
TW201013709A (en) * | 2008-09-17 | 2010-04-01 | Mitsui Mining & Smelting Co | Zinc oxide group transparent conductive film and process for making same |
JP5292130B2 (ja) * | 2009-02-27 | 2013-09-18 | 太平洋セメント株式会社 | スパッタリングターゲット |
EP2497011A4 (fr) * | 2009-11-06 | 2013-10-02 | Semiconductor Energy Lab | Panneau tactile et procédé de commande de panneau tactile |
CN102762518A (zh) * | 2010-02-18 | 2012-10-31 | 住友化学株式会社 | 氧化物烧结体、氧化物混合物、它们的制造方法以及使用它们的靶 |
JP2011184715A (ja) * | 2010-03-05 | 2011-09-22 | Sumitomo Chemical Co Ltd | 酸化亜鉛系透明導電膜形成材料、その製造方法、それを用いたターゲット、および酸化亜鉛系透明導電膜の形成方法 |
JP5952031B2 (ja) * | 2011-03-07 | 2016-07-13 | 住友化学株式会社 | 酸化物焼結体の製造方法およびターゲットの製造方法 |
JP2012195405A (ja) * | 2011-03-16 | 2012-10-11 | Sumitomo Chemical Co Ltd | 酸化亜鉛を主成分とする透明導電膜を用いた太陽電池用透明導電性基板、その製造方法、およびこれに用いるターゲット |
JP2012195501A (ja) * | 2011-03-17 | 2012-10-11 | Sumitomo Chemical Co Ltd | 薄膜光電変換素子および太陽電池 |
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2013
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- 2013-12-12 JP JP2014553101A patent/JPWO2014097963A1/ja active Pending
- 2013-12-12 KR KR1020157014306A patent/KR20150097478A/ko not_active Application Discontinuation
- 2013-12-12 WO PCT/JP2013/083350 patent/WO2014097963A1/fr active Application Filing
- 2013-12-17 TW TW102146659A patent/TW201435105A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN104871257B (zh) | 2017-03-01 |
TW201435105A (zh) | 2014-09-16 |
WO2014097963A1 (fr) | 2014-06-26 |
CN104871257A (zh) | 2015-08-26 |
JPWO2014097963A1 (ja) | 2017-01-12 |
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