KR20150052857A - 에폭시실리콘 수지 및 그것을 사용한 경화성 수지 조성물 - Google Patents

에폭시실리콘 수지 및 그것을 사용한 경화성 수지 조성물 Download PDF

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Publication number
KR20150052857A
KR20150052857A KR1020157008227A KR20157008227A KR20150052857A KR 20150052857 A KR20150052857 A KR 20150052857A KR 1020157008227 A KR1020157008227 A KR 1020157008227A KR 20157008227 A KR20157008227 A KR 20157008227A KR 20150052857 A KR20150052857 A KR 20150052857A
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KR
South Korea
Prior art keywords
group
epoxy
general formula
resin
weight
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KR1020157008227A
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English (en)
Korean (ko)
Inventor
슈이치로 하세
토모유키 타카시마
유이치 타니구치
니란잔 쿠마르 스레스타
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신닛테츠 수미킨 가가쿠 가부시키가이샤
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Publication of KR20150052857A publication Critical patent/KR20150052857A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C08G59/3281—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
KR1020157008227A 2012-08-31 2012-08-31 에폭시실리콘 수지 및 그것을 사용한 경화성 수지 조성물 KR20150052857A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/072270 WO2014033937A1 (ja) 2012-08-31 2012-08-31 エポキシシリコーン樹脂及びそれを用いた硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
KR20150052857A true KR20150052857A (ko) 2015-05-14

Family

ID=50182783

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Application Number Title Priority Date Filing Date
KR1020157008227A KR20150052857A (ko) 2012-08-31 2012-08-31 에폭시실리콘 수지 및 그것을 사용한 경화성 수지 조성물

Country Status (4)

Country Link
JP (1) JPWO2014033937A1 (zh)
KR (1) KR20150052857A (zh)
CN (1) CN104583264B (zh)
WO (1) WO2014033937A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180066874A (ko) * 2016-12-09 2018-06-19 주식회사 엘지화학 밀봉재 조성물

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015209509A (ja) * 2014-04-28 2015-11-24 京セラケミカル株式会社 エポキシ樹脂組成物および樹脂封止型電子部品装置
JP2016132759A (ja) * 2015-01-21 2016-07-25 大日本印刷株式会社 樹脂組成物、リフレクター、リフレクター付きリードフレーム及び半導体発光装置
EP3450478B1 (en) * 2017-08-31 2020-11-11 Shin-Etsu Chemical Co., Ltd. Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process
CN110760067B (zh) * 2019-10-22 2021-09-24 广东万木新材料科技有限公司 一种有机硅低聚物及其合成方法与应用
CN111100463A (zh) * 2019-12-26 2020-05-05 广东盈骅新材料科技有限公司 环氧改性硅树脂组合物及其应用
JPWO2021192559A1 (zh) * 2020-03-23 2021-09-30
CN112812304B (zh) * 2021-01-07 2023-05-12 天津德高化成光电科技有限责任公司 一种预聚体、含有该预聚体的封装树脂及封装树脂的应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10110102A (ja) * 1996-10-04 1998-04-28 Shiaru:Kk 透明性の樹脂組成物
JP3569919B2 (ja) * 1994-11-15 2004-09-29 鐘淵化学工業株式会社 発泡性樹脂組成物、及びこれを用いた発泡体とその製造方法
WO2007074813A1 (ja) * 2005-12-26 2007-07-05 Kaneka Corporation 硬化性組成物
JP2009203258A (ja) * 2008-02-26 2009-09-10 Nippon Steel Chem Co Ltd エポキシシリコーン樹脂を含む硬化性樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762827A (en) * 1953-10-09 1956-09-11 Dow Corning Bis-heptamethylcyclotetrasiloxanylethane
JP2003277591A (ja) * 2002-03-26 2003-10-02 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ及び積層板
JP2008069210A (ja) * 2006-09-12 2008-03-27 Shin Etsu Chem Co Ltd 多環式炭化水素基含有シリコーン系硬化性組成物
JP2012107113A (ja) * 2010-11-17 2012-06-07 Kaneka Corp 硬化性組成物およびそれを用いた薄膜トランジスタ
JP5764432B2 (ja) * 2011-01-07 2015-08-19 株式会社ダイセル 硬化性エポキシ樹脂組成物
JPWO2012117929A1 (ja) * 2011-02-28 2014-07-07 新日鉄住金化学株式会社 エポキシシリコーン樹脂及びそれを用いた硬化性樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3569919B2 (ja) * 1994-11-15 2004-09-29 鐘淵化学工業株式会社 発泡性樹脂組成物、及びこれを用いた発泡体とその製造方法
JPH10110102A (ja) * 1996-10-04 1998-04-28 Shiaru:Kk 透明性の樹脂組成物
WO2007074813A1 (ja) * 2005-12-26 2007-07-05 Kaneka Corporation 硬化性組成物
JP2009203258A (ja) * 2008-02-26 2009-09-10 Nippon Steel Chem Co Ltd エポキシシリコーン樹脂を含む硬化性樹脂組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
BULLETIN OF THE ACADEMY OF SCIENCES OF THE USSR *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180066874A (ko) * 2016-12-09 2018-06-19 주식회사 엘지화학 밀봉재 조성물

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Publication number Publication date
JPWO2014033937A1 (ja) 2016-08-08
WO2014033937A1 (ja) 2014-03-06
CN104583264A (zh) 2015-04-29
CN104583264B (zh) 2017-03-29

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