KR20140119714A - 향상된 전하 캐리어들의 분포를 갖는 광활성 장치들 및 그 형성 방법들 - Google Patents
향상된 전하 캐리어들의 분포를 갖는 광활성 장치들 및 그 형성 방법들 Download PDFInfo
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- KR20140119714A KR20140119714A KR1020147021211A KR20147021211A KR20140119714A KR 20140119714 A KR20140119714 A KR 20140119714A KR 1020147021211 A KR1020147021211 A KR 1020147021211A KR 20147021211 A KR20147021211 A KR 20147021211A KR 20140119714 A KR20140119714 A KR 20140119714A
- Authority
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- Prior art keywords
- quantum well
- region
- well region
- barrier
- semiconductor material
- Prior art date
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- 238000009826 distribution Methods 0.000 title description 3
- 239000002800 charge carrier Substances 0.000 title 1
- 230000004888 barrier function Effects 0.000 claims abstract description 175
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- 239000000203 mixture Substances 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims abstract description 6
- 150000004767 nitrides Chemical class 0.000 claims description 26
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 239000005380 borophosphosilicate glass Substances 0.000 claims description 3
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- 239000005360 phosphosilicate glass Substances 0.000 claims description 3
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- 229910052738 indium Inorganic materials 0.000 description 13
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 12
- 229910002601 GaN Inorganic materials 0.000 description 11
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 11
- 230000008569 process Effects 0.000 description 9
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 238000009828 non-uniform distribution Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052716 thallium Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
- H01L21/02507—Alternating layers, e.g. superlattice
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/362,866 | 2012-01-31 | ||
US13/362,866 US8471243B1 (en) | 2012-01-31 | 2012-01-31 | Photoactive devices with improved distribution of charge carriers, and methods of forming same |
FR1251158A FR2986661B1 (fr) | 2012-02-08 | 2012-02-08 | Dispositifs photoactifs avec une repartition amelioree des porteurs de charge, et procedes de formation de ces dispositifs |
FR1251158 | 2012-02-08 | ||
PCT/IB2012/002790 WO2013114152A1 (en) | 2012-01-31 | 2012-12-17 | Photoactive devices with improved distribution of charge carriers, and methods of forming same |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20140119714A true KR20140119714A (ko) | 2014-10-10 |
Family
ID=47603854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020147021211A KR20140119714A (ko) | 2012-01-31 | 2012-12-17 | 향상된 전하 캐리어들의 분포를 갖는 광활성 장치들 및 그 형성 방법들 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6155478B2 (ja) |
KR (1) | KR20140119714A (ja) |
CN (1) | CN104094419A (ja) |
DE (1) | DE112012005796T5 (ja) |
WO (1) | WO2013114152A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3004005B1 (fr) | 2013-03-28 | 2016-11-25 | Commissariat Energie Atomique | Diode electroluminescente a multiples puits quantiques et jonction p-n asymetrique |
JP6433248B2 (ja) * | 2014-11-07 | 2018-12-05 | スタンレー電気株式会社 | 半導体発光素子 |
JP6457784B2 (ja) | 2014-11-07 | 2019-01-23 | スタンレー電気株式会社 | 半導体発光素子 |
JP6433247B2 (ja) | 2014-11-07 | 2018-12-05 | スタンレー電気株式会社 | 半導体発光素子 |
JP6433246B2 (ja) | 2014-11-07 | 2018-12-05 | スタンレー電気株式会社 | 半導体発光素子 |
DE102015100029A1 (de) | 2015-01-05 | 2016-07-07 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
JP6651167B2 (ja) | 2015-03-23 | 2020-02-19 | スタンレー電気株式会社 | 半導体発光素子及びその製造方法 |
JP6387978B2 (ja) * | 2016-02-09 | 2018-09-12 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
JP6729644B2 (ja) * | 2018-08-08 | 2020-07-22 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080035865A (ko) * | 2006-10-20 | 2008-04-24 | 삼성전자주식회사 | 반도체 발광 소자 |
KR20100055302A (ko) * | 2008-11-17 | 2010-05-26 | 삼성엘이디 주식회사 | 질화물 반도체 발광소자 |
WO2011061580A1 (en) * | 2009-11-18 | 2011-05-26 | S.O.I.Tec Silicon On Insulator Technologies | Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4255168B2 (ja) * | 1998-06-30 | 2009-04-15 | シャープ株式会社 | 窒化物半導体の製造方法及び発光素子 |
JP2001077417A (ja) * | 1999-08-31 | 2001-03-23 | Sharp Corp | 窒素化合物半導体発光素子の製造方法 |
JP3498697B2 (ja) * | 2000-07-07 | 2004-02-16 | 日亜化学工業株式会社 | 窒化物半導体素子 |
JP2003031902A (ja) * | 2001-07-16 | 2003-01-31 | Denso Corp | 半導体レーザ |
KR100649749B1 (ko) * | 2005-10-25 | 2006-11-27 | 삼성전기주식회사 | 질화물 반도체 발광 소자 |
JP5003527B2 (ja) * | 2008-02-22 | 2012-08-15 | 住友電気工業株式会社 | Iii族窒化物発光素子、及びiii族窒化物系半導体発光素子を作製する方法 |
FR2931293B1 (fr) * | 2008-05-15 | 2010-09-03 | Soitec Silicon On Insulator | Procede de fabrication d'une heterostructure support d'epitaxie et heterostructure correspondante |
EP2151852B1 (en) | 2008-08-06 | 2020-01-15 | Soitec | Relaxation and transfer of strained layers |
WO2010036622A1 (en) | 2008-09-24 | 2010-04-01 | S.O.I. Tec Silicon On Insulator Technologies | Methods of forming relaxed layers of semiconductor materials, semiconductor structures, devices and engineered substrates including same |
JP5315899B2 (ja) * | 2008-09-30 | 2013-10-16 | 信越半導体株式会社 | 発光素子 |
FR2936903B1 (fr) * | 2008-10-07 | 2011-01-14 | Soitec Silicon On Insulator | Relaxation d'une couche de materiau contraint avec application d'un raidisseur |
EP2345060B1 (en) | 2008-10-30 | 2013-12-04 | Soitec | Methods of forming layers of semiconductor material having reduced lattice strain and engineered substrates including same |
-
2012
- 2012-12-17 KR KR1020147021211A patent/KR20140119714A/ko not_active Application Discontinuation
- 2012-12-17 DE DE112012005796.1T patent/DE112012005796T5/de not_active Withdrawn
- 2012-12-17 WO PCT/IB2012/002790 patent/WO2013114152A1/en active Application Filing
- 2012-12-17 JP JP2014553817A patent/JP6155478B2/ja active Active
- 2012-12-17 CN CN201280068513.5A patent/CN104094419A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080035865A (ko) * | 2006-10-20 | 2008-04-24 | 삼성전자주식회사 | 반도체 발광 소자 |
KR20100055302A (ko) * | 2008-11-17 | 2010-05-26 | 삼성엘이디 주식회사 | 질화물 반도체 발광소자 |
WO2011061580A1 (en) * | 2009-11-18 | 2011-05-26 | S.O.I.Tec Silicon On Insulator Technologies | Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods |
Also Published As
Publication number | Publication date |
---|---|
JP2015506592A (ja) | 2015-03-02 |
CN104094419A (zh) | 2014-10-08 |
WO2013114152A1 (en) | 2013-08-08 |
DE112012005796T5 (de) | 2014-10-16 |
JP6155478B2 (ja) | 2017-07-05 |
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