KR20140035377A - 입자 쉴드를 가지는 웨이퍼 용기 - Google Patents

입자 쉴드를 가지는 웨이퍼 용기 Download PDF

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Publication number
KR20140035377A
KR20140035377A KR1020137030304A KR20137030304A KR20140035377A KR 20140035377 A KR20140035377 A KR 20140035377A KR 1020137030304 A KR1020137030304 A KR 1020137030304A KR 20137030304 A KR20137030304 A KR 20137030304A KR 20140035377 A KR20140035377 A KR 20140035377A
Authority
KR
South Korea
Prior art keywords
wafer
container
shield
particle
barrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137030304A
Other languages
English (en)
Korean (ko)
Inventor
마틴 엘. 포브즈
존 번즈
매튜 에이. 풀러
Original Assignee
인티그리스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인티그리스, 인코포레이티드 filed Critical 인티그리스, 인코포레이티드
Publication of KR20140035377A publication Critical patent/KR20140035377A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H10P72/1928—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier characterised by the presence of antistatic elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
KR1020137030304A 2011-05-03 2012-05-03 입자 쉴드를 가지는 웨이퍼 용기 Withdrawn KR20140035377A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161482151P 2011-05-03 2011-05-03
US61/482,151 2011-05-03
PCT/US2012/036373 WO2012151431A2 (en) 2011-05-03 2012-05-03 Wafer container with particle shield

Publications (1)

Publication Number Publication Date
KR20140035377A true KR20140035377A (ko) 2014-03-21

Family

ID=47108234

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137030304A Withdrawn KR20140035377A (ko) 2011-05-03 2012-05-03 입자 쉴드를 가지는 웨이퍼 용기

Country Status (8)

Country Link
US (1) US20150294887A1 (https=)
EP (1) EP2705528A4 (https=)
JP (1) JP2014513442A (https=)
KR (1) KR20140035377A (https=)
CN (1) CN103765569A (https=)
SG (1) SG194732A1 (https=)
TW (1) TW201302573A (https=)
WO (1) WO2012151431A2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016046985A1 (ja) * 2014-09-26 2016-03-31 ミライアル株式会社 基板収納容器
SG11201707411QA (en) * 2015-04-10 2017-10-30 Shinetsu Polymer Co Substrate storage container
TWI646032B (zh) * 2017-03-24 2019-01-01 奇景光電股份有限公司 傳送及保護晶圓的裝置
CN109326546A (zh) * 2017-07-31 2019-02-12 富士迈半导体精密工业（上海）有限公司 用于晶圆盒的气体填充装置及气体填充系统
US10504762B2 (en) * 2018-02-06 2019-12-10 Applied Materials, Inc. Bridging front opening unified pod (FOUP)
JP7336923B2 (ja) * 2019-09-05 2023-09-01 信越ポリマー株式会社 基板収納容器
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤
JP7423429B2 (ja) * 2020-06-05 2024-01-29 信越ポリマー株式会社 基板収納容器
EP4015164A1 (en) * 2020-12-18 2022-06-22 System 3R International AB Gripper for a manupulator
JP7669853B2 (ja) * 2021-07-27 2025-04-30 信越半導体株式会社 密閉収納容器
TWI796984B (zh) * 2022-03-31 2023-03-21 大立鈺科技有限公司 具抵持元件之可伸縮基板承載裝置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346518A (en) 1993-03-23 1994-09-13 International Business Machines Corporation Vapor drain system
US5570987A (en) * 1993-12-14 1996-11-05 W. L. Gore & Associates, Inc. Semiconductor wafer transport container
US5472086A (en) 1994-03-11 1995-12-05 Holliday; James E. Enclosed sealable purgible semiconductor wafer holder
US5785186A (en) 1994-10-11 1998-07-28 Progressive System Technologies, Inc. Substrate housing and docking system
US5944194A (en) 1995-10-13 1999-08-31 Empak, Inc. 300 mm microenvironment pod with door on side
US5833067A (en) * 1997-03-10 1998-11-10 Seagate Technologies, Inc. Disk caddy and lid with barrier means
US6736268B2 (en) 1997-07-11 2004-05-18 Entegris, Inc. Transport module
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
JPH11204448A (ja) * 1998-01-16 1999-07-30 Kokusai Electric Co Ltd 半導体製造装置
US6267245B1 (en) 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
JP3916380B2 (ja) * 1999-07-06 2007-05-16 株式会社荏原製作所 基板搬送容器待機ステーション
KR20040017481A (ko) * 2002-08-21 2004-02-27 삼성전자주식회사 전면 파티클 오염을 억제할 수 있는 웨이퍼 캐리어
JP2004260087A (ja) * 2003-02-27 2004-09-16 Shin Etsu Polymer Co Ltd 収納容器
US7328727B2 (en) 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
KR20090056963A (ko) * 2006-07-07 2009-06-03 엔테그리스, 아이엔씨. 웨이퍼 카세트
JP2008024429A (ja) * 2006-07-20 2008-02-07 Toshiba Corp 電子装置の製造方法
US20080041758A1 (en) 2006-08-16 2008-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer carrier
US7784178B2 (en) * 2007-06-29 2010-08-31 Intel Corporation Higher performance barrier materials for containers of environmentally sensitive semiconductor fabrication devices
KR101525753B1 (ko) 2008-01-13 2015-06-09 엔테그리스, 아이엔씨. 큰 지름의 웨이퍼를 취급하는 장치 및 방법
JP2011018771A (ja) * 2009-07-09 2011-01-27 Shin Etsu Polymer Co Ltd 基板収納容器

Also Published As

Publication number Publication date
WO2012151431A3 (en) 2013-03-14
CN103765569A (zh) 2014-04-30
EP2705528A4 (en) 2014-11-26
WO2012151431A2 (en) 2012-11-08
SG194732A1 (en) 2013-12-30
JP2014513442A (ja) 2014-05-29
US20150294887A1 (en) 2015-10-15
TW201302573A (zh) 2013-01-16
EP2705528A2 (en) 2014-03-12

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R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

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PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000