JP2014513442A - パーティクルシールドを有するウェハ容器 - Google Patents

パーティクルシールドを有するウェハ容器 Download PDF

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Publication number
JP2014513442A
JP2014513442A JP2014509452A JP2014509452A JP2014513442A JP 2014513442 A JP2014513442 A JP 2014513442A JP 2014509452 A JP2014509452 A JP 2014509452A JP 2014509452 A JP2014509452 A JP 2014509452A JP 2014513442 A JP2014513442 A JP 2014513442A
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JP
Japan
Prior art keywords
wafer
container
shield
wafer container
particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014509452A
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English (en)
Japanese (ja)
Other versions
JP2014513442A5 (https=
Inventor
エル． フォーブス、マーティン
バーンズ、ジョン
エイ． フラー、マシュー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of JP2014513442A publication Critical patent/JP2014513442A/ja
Publication of JP2014513442A5 publication Critical patent/JP2014513442A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H10P72/1928—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier characterised by the presence of antistatic elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
JP2014509452A 2011-05-03 2012-05-03 パーティクルシールドを有するウェハ容器 Pending JP2014513442A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161482151P 2011-05-03 2011-05-03
US61/482,151 2011-05-03
PCT/US2012/036373 WO2012151431A2 (en) 2011-05-03 2012-05-03 Wafer container with particle shield

Publications (2)

Publication Number Publication Date
JP2014513442A true JP2014513442A (ja) 2014-05-29
JP2014513442A5 JP2014513442A5 (https=) 2015-06-25

Family

ID=47108234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014509452A Pending JP2014513442A (ja) 2011-05-03 2012-05-03 パーティクルシールドを有するウェハ容器

Country Status (8)

Country Link
US (1) US20150294887A1 (https=)
EP (1) EP2705528A4 (https=)
JP (1) JP2014513442A (https=)
KR (1) KR20140035377A (https=)
CN (1) CN103765569A (https=)
SG (1) SG194732A1 (https=)
TW (1) TW201302573A (https=)
WO (1) WO2012151431A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016047163A1 (ja) * 2014-09-26 2017-07-06 ミライアル株式会社 基板収納容器
JP2021192412A (ja) * 2020-06-05 2021-12-16 信越ポリマー株式会社 基板収納容器
JP2022000890A (ja) * 2021-07-27 2022-01-04 信越半導体株式会社 密閉収納容器
JP2022097464A (ja) * 2020-12-18 2022-06-30 システム ３アール インターナショナル アーべー マニピュレータ用のグリッパ

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201707411QA (en) * 2015-04-10 2017-10-30 Shinetsu Polymer Co Substrate storage container
TWI646032B (zh) * 2017-03-24 2019-01-01 奇景光電股份有限公司 傳送及保護晶圓的裝置
CN109326546A (zh) * 2017-07-31 2019-02-12 富士迈半导体精密工业（上海）有限公司 用于晶圆盒的气体填充装置及气体填充系统
US10504762B2 (en) * 2018-02-06 2019-12-10 Applied Materials, Inc. Bridging front opening unified pod (FOUP)
JP7336923B2 (ja) * 2019-09-05 2023-09-01 信越ポリマー株式会社 基板収納容器
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤
TWI796984B (zh) * 2022-03-31 2023-03-21 大立鈺科技有限公司 具抵持元件之可伸縮基板承載裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1191864A (ja) * 1997-07-11 1999-04-06 Fluoroware Inc ウェハー搬送モジュール
JP2004260087A (ja) * 2003-02-27 2004-09-16 Shin Etsu Polymer Co Ltd 収納容器
US20080041758A1 (en) * 2006-08-16 2008-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer carrier
JP2011018771A (ja) * 2009-07-09 2011-01-27 Shin Etsu Polymer Co Ltd 基板収納容器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346518A (en) 1993-03-23 1994-09-13 International Business Machines Corporation Vapor drain system
US5570987A (en) * 1993-12-14 1996-11-05 W. L. Gore & Associates, Inc. Semiconductor wafer transport container
US5472086A (en) 1994-03-11 1995-12-05 Holliday; James E. Enclosed sealable purgible semiconductor wafer holder
US5785186A (en) 1994-10-11 1998-07-28 Progressive System Technologies, Inc. Substrate housing and docking system
US5944194A (en) 1995-10-13 1999-08-31 Empak, Inc. 300 mm microenvironment pod with door on side
US5833067A (en) * 1997-03-10 1998-11-10 Seagate Technologies, Inc. Disk caddy and lid with barrier means
US6736268B2 (en) 1997-07-11 2004-05-18 Entegris, Inc. Transport module
JPH11204448A (ja) * 1998-01-16 1999-07-30 Kokusai Electric Co Ltd 半導体製造装置
US6267245B1 (en) 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
JP3916380B2 (ja) * 1999-07-06 2007-05-16 株式会社荏原製作所 基板搬送容器待機ステーション
KR20040017481A (ko) * 2002-08-21 2004-02-27 삼성전자주식회사 전면 파티클 오염을 억제할 수 있는 웨이퍼 캐리어
US7328727B2 (en) 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
KR20090056963A (ko) * 2006-07-07 2009-06-03 엔테그리스, 아이엔씨. 웨이퍼 카세트
JP2008024429A (ja) * 2006-07-20 2008-02-07 Toshiba Corp 電子装置の製造方法
US7784178B2 (en) * 2007-06-29 2010-08-31 Intel Corporation Higher performance barrier materials for containers of environmentally sensitive semiconductor fabrication devices
KR101525753B1 (ko) 2008-01-13 2015-06-09 엔테그리스, 아이엔씨. 큰 지름의 웨이퍼를 취급하는 장치 및 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1191864A (ja) * 1997-07-11 1999-04-06 Fluoroware Inc ウェハー搬送モジュール
JP2004260087A (ja) * 2003-02-27 2004-09-16 Shin Etsu Polymer Co Ltd 収納容器
US20080041758A1 (en) * 2006-08-16 2008-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer carrier
JP2011018771A (ja) * 2009-07-09 2011-01-27 Shin Etsu Polymer Co Ltd 基板収納容器

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016047163A1 (ja) * 2014-09-26 2017-07-06 ミライアル株式会社 基板収納容器
US10535540B2 (en) 2014-09-26 2020-01-14 Miraial Co., Ltd. Substrate storing container
JP2021192412A (ja) * 2020-06-05 2021-12-16 信越ポリマー株式会社 基板収納容器
JP7423429B2 (ja) 2020-06-05 2024-01-29 信越ポリマー株式会社 基板収納容器
JP2022097464A (ja) * 2020-12-18 2022-06-30 システム ３アール インターナショナル アーべー マニピュレータ用のグリッパ
JP7770180B2 (ja) 2020-12-18 2025-11-14 システム ３アール インターナショナル アーべー マニピュレータ用のグリッパ
JP2022000890A (ja) * 2021-07-27 2022-01-04 信越半導体株式会社 密閉収納容器
JP7669853B2 (ja) 2021-07-27 2025-04-30 信越半導体株式会社 密閉収納容器

Also Published As

Publication number Publication date
WO2012151431A3 (en) 2013-03-14
CN103765569A (zh) 2014-04-30
EP2705528A4 (en) 2014-11-26
WO2012151431A2 (en) 2012-11-08
KR20140035377A (ko) 2014-03-21
SG194732A1 (en) 2013-12-30
US20150294887A1 (en) 2015-10-15
TW201302573A (zh) 2013-01-16
EP2705528A2 (en) 2014-03-12

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