KR20130100925A - 다가 카르복실산 조성물, 경화제 조성물, 및 그 다가 카르복실산 조성물 또는 그 경화제 조성물을 에폭시 수지의 경화제로서 함유하는 경화성 수지 조성물 - Google Patents
다가 카르복실산 조성물, 경화제 조성물, 및 그 다가 카르복실산 조성물 또는 그 경화제 조성물을 에폭시 수지의 경화제로서 함유하는 경화성 수지 조성물 Download PDFInfo
- Publication number
- KR20130100925A KR20130100925A KR1020127034379A KR20127034379A KR20130100925A KR 20130100925 A KR20130100925 A KR 20130100925A KR 1020127034379 A KR1020127034379 A KR 1020127034379A KR 20127034379 A KR20127034379 A KR 20127034379A KR 20130100925 A KR20130100925 A KR 20130100925A
- Authority
- KR
- South Korea
- Prior art keywords
- carboxylic acid
- composition
- curing agent
- hardening
- polyhydric carboxylic
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2010-149411 | 2010-06-30 | ||
JP2010149411 | 2010-06-30 | ||
PCT/JP2011/064848 WO2012002404A1 (ja) | 2010-06-30 | 2011-06-28 | 多価カルボン酸組成物、硬化剤組成物、ならびに該多価カルボン酸組成物または該硬化剤組成物をエポキシ樹脂の硬化剤として含有する硬化性樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20130100925A true KR20130100925A (ko) | 2013-09-12 |
Family
ID=45402111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020127034379A KR20130100925A (ko) | 2010-06-30 | 2011-06-28 | 다가 카르복실산 조성물, 경화제 조성물, 및 그 다가 카르복실산 조성물 또는 그 경화제 조성물을 에폭시 수지의 경화제로서 함유하는 경화성 수지 조성물 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5775869B2 (zh) |
KR (1) | KR20130100925A (zh) |
CN (1) | CN102971355B (zh) |
TW (1) | TWI485166B (zh) |
WO (1) | WO2012002404A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013035740A1 (ja) * | 2011-09-09 | 2013-03-14 | 日本化薬株式会社 | 光半導体素子封止用硬化性樹脂組成物およびその硬化物 |
JP6162557B2 (ja) * | 2012-09-21 | 2017-07-12 | 日本化薬株式会社 | 透明接着材料 |
KR20150063368A (ko) * | 2012-09-27 | 2015-06-09 | 닛뽄 가야쿠 가부시키가이샤 | 다가 카르복실산 수지 및 에폭시 수지 조성물 |
JP2015199904A (ja) * | 2014-04-03 | 2015-11-12 | 日本化薬株式会社 | 熱硬化性樹脂用硬化剤、それを用いた熱硬化性樹脂組成物、およびその熱硬化性樹脂組成物を封止材あるいは反射材として使用した光半導体装置 |
CN107074785A (zh) * | 2014-07-24 | 2017-08-18 | 日本化药株式会社 | 多元羧酸和含有其的多元羧酸组合物、环氧树脂组合物、热固化性树脂组合物、它们的固化物以及光半导体装置 |
JP6494092B2 (ja) * | 2015-02-06 | 2019-04-03 | 日本化薬株式会社 | 多価カルボン酸樹脂、それを用いた熱硬化性樹脂組成物、およびその熱硬化性樹脂組成物を反射材として使用した光半導体装置 |
JP6570176B2 (ja) * | 2015-08-21 | 2019-09-04 | 日本化薬株式会社 | 多価カルボン酸およびそれを含有する多価カルボン酸組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに光半導体装置 |
CN108727561A (zh) * | 2018-05-03 | 2018-11-02 | 中科院广州化学有限公司南雄材料生产基地 | 一种脂环族环氧树脂及其制备与应用 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59206927D1 (de) * | 1991-03-27 | 1996-09-26 | Ciba Geigy Ag | Vernetzungsmittel für Pulverlacke auf Basis von Polyestern |
US5196485A (en) * | 1991-04-29 | 1993-03-23 | Ppg Industries, Inc. | One package stable etch resistant coating |
US6313221B1 (en) * | 1999-05-28 | 2001-11-06 | Nippon Paint Co., Ltd. | Powder coating of epoxy-acrylic resin, polycarboxylic acid, crosslinked particles and liquid resin |
JP2001064574A (ja) * | 1999-08-31 | 2001-03-13 | Nippon Paint Co Ltd | 熱硬化性粉体塗料組成物 |
EP1491521A1 (en) * | 2003-06-13 | 2004-12-29 | Mitsubishi Gas Chemical Company, Inc. | Method for producing ditrimethylolpropane |
KR101636587B1 (ko) * | 2008-07-29 | 2016-07-05 | 히타치가세이가부시끼가이샤 | 에폭시 수지 경화제, 에폭시 수지 조성물, 그 경화물 및 광반도체장치 |
-
2011
- 2011-06-28 CN CN201180032529.6A patent/CN102971355B/zh not_active Expired - Fee Related
- 2011-06-28 KR KR1020127034379A patent/KR20130100925A/ko not_active Application Discontinuation
- 2011-06-28 WO PCT/JP2011/064848 patent/WO2012002404A1/ja active Application Filing
- 2011-06-28 JP JP2012522647A patent/JP5775869B2/ja not_active Expired - Fee Related
- 2011-06-30 TW TW100122970A patent/TWI485166B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN102971355B (zh) | 2015-07-08 |
JP5775869B2 (ja) | 2015-09-09 |
CN102971355A (zh) | 2013-03-13 |
TWI485166B (zh) | 2015-05-21 |
WO2012002404A1 (ja) | 2012-01-05 |
JPWO2012002404A1 (ja) | 2013-08-29 |
TW201219426A (en) | 2012-05-16 |
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