KR20120104213A - 열전 모듈에서 접촉 접속부로서 다공성 금속 재료의 용도 - Google Patents

열전 모듈에서 접촉 접속부로서 다공성 금속 재료의 용도 Download PDF

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Publication number
KR20120104213A
KR20120104213A KR1020127013579A KR20127013579A KR20120104213A KR 20120104213 A KR20120104213 A KR 20120104213A KR 1020127013579 A KR1020127013579 A KR 1020127013579A KR 20127013579 A KR20127013579 A KR 20127013579A KR 20120104213 A KR20120104213 A KR 20120104213A
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KR
South Korea
Prior art keywords
thermoelectric
thermoelectric module
metal
contact
porous metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020127013579A
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English (en)
Korean (ko)
Inventor
마달리나 안드리아 스테판
알렉산더 트라우트
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바스프 에스이
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Application filed by 바스프 에스이 filed Critical 바스프 에스이
Publication of KR20120104213A publication Critical patent/KR20120104213A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06F—LAUNDERING, DRYING, IRONING, PRESSING OR FOLDING TEXTILE ARTICLES
    • D06F58/00—Domestic laundry dryers
    • D06F58/20—General details of domestic laundry dryers 
    • D06F58/206—Heat pump arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49206—Contact or terminal manufacturing by powder metallurgy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y10T29/49213—Metal
    • Y10T29/49215—Metal by impregnating a porous mass

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  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020127013579A 2009-11-03 2010-10-29 열전 모듈에서 접촉 접속부로서 다공성 금속 재료의 용도 Withdrawn KR20120104213A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09174855.8 2009-11-03
EP09174855 2009-11-03

Publications (1)

Publication Number Publication Date
KR20120104213A true KR20120104213A (ko) 2012-09-20

Family

ID=43259670

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127013579A Withdrawn KR20120104213A (ko) 2009-11-03 2010-10-29 열전 모듈에서 접촉 접속부로서 다공성 금속 재료의 용도

Country Status (9)

Country Link
US (1) US8729380B2 (enExample)
EP (1) EP2497127A1 (enExample)
JP (1) JP2013510417A (enExample)
KR (1) KR20120104213A (enExample)
CN (1) CN102648538A (enExample)
CA (1) CA2779359A1 (enExample)
RU (1) RU2012122588A (enExample)
TW (1) TW201125178A (enExample)
WO (1) WO2011054756A1 (enExample)

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KR20190101637A (ko) 2018-02-23 2019-09-02 주식회사 대양 열전 모듈

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AU2012340268C1 (en) * 2011-11-17 2016-10-20 Gentherm Incorporated Thermoelectric devices with interface materials and methods of manufacturing the same
KR102065111B1 (ko) * 2012-09-05 2020-01-10 삼성전자주식회사 방열-열전 핀, 이를 포함하는 열전모듈 및 열전장치
JP5978963B2 (ja) * 2012-12-03 2016-08-24 富士通株式会社 ブイ
US20140261606A1 (en) * 2013-03-15 2014-09-18 Avx Corporation Thermoelectric generator
US10483449B2 (en) 2013-03-15 2019-11-19 Avx Corporation Thermoelectric generator
JP6171513B2 (ja) * 2013-04-10 2017-08-02 日立化成株式会社 熱電変換モジュールおよびその製造方法
DE102013214988A1 (de) 2013-07-31 2015-02-05 Behr Gmbh & Co. Kg Thermoelektrisches Modul
JP2017535939A (ja) * 2014-09-18 2017-11-30 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 熱電材料の熱圧着
JP6794732B2 (ja) * 2015-09-28 2020-12-02 三菱マテリアル株式会社 熱電変換モジュール及び熱電変換装置
KR101989908B1 (ko) * 2015-10-27 2019-06-17 주식회사 테그웨이 유연 열전소자 및 이의 제조방법
JP2017107925A (ja) * 2015-12-08 2017-06-15 日立化成株式会社 熱電変換モジュールおよびその製造方法
CN108028305A (zh) * 2016-03-23 2018-05-11 北京山沃新能源科技有限公司 热电转换模块、新型内燃机、新型电机及发电方法
CN106225470A (zh) * 2016-09-23 2016-12-14 成都九十度工业产品设计有限公司 一种真空冷冻干燥机热交换板
CN109476123A (zh) * 2016-12-28 2019-03-15 泰格韦有限公司 泡沫组合物、柔性热电装置、柔性导电层叠体及其制备方法
JP7242999B2 (ja) * 2018-03-16 2023-03-22 三菱マテリアル株式会社 熱電変換素子
JP2019220546A (ja) * 2018-06-19 2019-12-26 三菱マテリアル株式会社 熱電変換モジュール、及び、熱電変換モジュールの製造方法
US20200035898A1 (en) 2018-07-30 2020-01-30 Gentherm Incorporated Thermoelectric device having circuitry that facilitates manufacture
US20200148553A1 (en) * 2018-11-09 2020-05-14 Electrophor Inc. Liquid Preparation Device
DE102019207556A1 (de) * 2019-05-23 2020-11-26 Mahle International Gmbh Thermoelektrisches Modul
DE112020001913T5 (de) * 2020-01-23 2021-12-30 E-ThermoGentek Co., Ltd. Röhrenwärmetauscher mit thermoelektrischer Energieerzeugungsfunktion
US11903314B2 (en) * 2020-07-17 2024-02-13 Micropower Global Limited Thermoelectric element comprising a contact structure and method of making the contact structure
CN114386257B (zh) * 2021-12-28 2025-05-27 南京航空航天大学 强化被动散热型热电腿及其设计方法
CN114497338B (zh) * 2022-01-18 2025-07-22 南京工业大学 泡沫金属/碲化铋热电复合材料

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Publication number Priority date Publication date Assignee Title
KR20190101637A (ko) 2018-02-23 2019-09-02 주식회사 대양 열전 모듈

Also Published As

Publication number Publication date
CA2779359A1 (en) 2011-05-12
WO2011054756A1 (de) 2011-05-12
US20110099991A1 (en) 2011-05-05
US8729380B2 (en) 2014-05-20
EP2497127A1 (de) 2012-09-12
CN102648538A (zh) 2012-08-22
RU2012122588A (ru) 2013-12-10
TW201125178A (en) 2011-07-16
JP2013510417A (ja) 2013-03-21

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PA0105 International application

Patent event date: 20120525

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid