KR20120062802A - 스퍼터링 타겟용 구리재료 및 그 제조방법 - Google Patents

스퍼터링 타겟용 구리재료 및 그 제조방법 Download PDF

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Publication number
KR20120062802A
KR20120062802A KR1020127007190A KR20127007190A KR20120062802A KR 20120062802 A KR20120062802 A KR 20120062802A KR 1020127007190 A KR1020127007190 A KR 1020127007190A KR 20127007190 A KR20127007190 A KR 20127007190A KR 20120062802 A KR20120062802 A KR 20120062802A
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KR
South Korea
Prior art keywords
copper
purity
sputtering
hot
plane
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Application number
KR1020127007190A
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English (en)
Korean (ko)
Inventor
이사오 다카하시
기요시게 히로세
가즈오 구라하시
아키후미 나카지마
웨이밍 즈호우
Original Assignee
후루카와 덴키 고교 가부시키가이샤
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Publication of KR20120062802A publication Critical patent/KR20120062802A/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
KR1020127007190A 2009-08-28 2010-08-26 스퍼터링 타겟용 구리재료 및 그 제조방법 KR20120062802A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-198982 2009-08-28
JP2009198982 2009-08-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020147034044A Division KR101515340B1 (ko) 2009-08-28 2010-08-26 스퍼터링 타겟용 구리재료의 제조방법

Publications (1)

Publication Number Publication Date
KR20120062802A true KR20120062802A (ko) 2012-06-14

Family

ID=43628009

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147034044A KR101515340B1 (ko) 2009-08-28 2010-08-26 스퍼터링 타겟용 구리재료의 제조방법
KR1020127007190A KR20120062802A (ko) 2009-08-28 2010-08-26 스퍼터링 타겟용 구리재료 및 그 제조방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020147034044A KR101515340B1 (ko) 2009-08-28 2010-08-26 스퍼터링 타겟용 구리재료의 제조방법

Country Status (5)

Country Link
JP (1) JP4974197B2 (fr)
KR (2) KR101515340B1 (fr)
CN (1) CN102482767B (fr)
TW (1) TWI504769B (fr)
WO (1) WO2011024909A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102249087B1 (ko) * 2019-11-13 2021-05-07 (주)하나금속 판형 구리 스퍼터링 타겟 및 그 제조 방법

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5793069B2 (ja) * 2011-12-26 2015-10-14 株式会社Ｓｈカッパープロダクツ スパッタリング用銅ターゲット材の製造方法
WO2013133353A1 (fr) * 2012-03-09 2013-09-12 古河電気工業株式会社 Cible de pulvérisation
JP6182296B2 (ja) * 2012-03-09 2017-08-16 古河電気工業株式会社 スパッタリングターゲット、及び、その製造方法
JP5950632B2 (ja) * 2012-03-09 2016-07-13 古河電気工業株式会社 スパッタリングターゲットの製造方法
JP5778636B2 (ja) * 2012-07-30 2015-09-16 株式会社Ｓｈカッパープロダクツ スパッタリング用銅ターゲット材及びスパッタリング用銅ターゲット材の製造方法
JP2014043643A (ja) * 2012-08-03 2014-03-13 Kobelco Kaken:Kk Ｃｕ合金薄膜形成用スパッタリングターゲットおよびその製造方法
JP6202718B2 (ja) * 2013-03-26 2017-09-27 三菱マテリアル株式会社 放熱基板
JP5962707B2 (ja) 2013-07-31 2016-08-03 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子
CN104694888B (zh) * 2013-12-09 2017-05-10 有研亿金新材料股份有限公司 一种高纯铜靶材的制备方法
JP6339625B2 (ja) * 2016-05-25 2018-06-06 古河電気工業株式会社 スパッタリングターゲット
TWI754542B (zh) 2016-07-11 2022-02-01 日商半導體能源研究所股份有限公司 濺射靶材及金屬氧化物
CN108231598A (zh) * 2017-12-29 2018-06-29 深圳市华星光电技术有限公司 金属氧化物薄膜晶体管的制备方法、阵列基板的制备方法
KR102429213B1 (ko) * 2018-05-21 2022-08-04 가부시키가이샤 아루박 스퍼터링 타겟 및 그 제조 방법
TWI778503B (zh) * 2020-06-26 2022-09-21 泰商東方銅業股份有限公司 由熱擠製技術製備銅圓柱靶以用於使用濺射法之薄膜塗佈之方法
TWI824162B (zh) * 2020-06-29 2023-12-01 泰商東方銅業股份有限公司 從熱擠壓程序生產用於藉由濺射法的薄膜塗覆技術之銅靶之方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10195611A (ja) * 1996-12-27 1998-07-28 Dowa Mining Co Ltd 結晶方位の制御されたｆｃｃ金属及びその製造方法
JPH10195609A (ja) * 1996-12-27 1998-07-28 Dowa Mining Co Ltd 結晶方位の制御されたｆｃｃ金属及びその製造方法
JPH10195610A (ja) * 1996-12-27 1998-07-28 Dowa Mining Co Ltd 結晶方位の制御されたｆｃｃ金属及びその製造方法
JP3975414B2 (ja) * 1997-11-28 2007-09-12 日立金属株式会社 スパッタリング用銅ターゲットおよびその製造方法
US20040072009A1 (en) * 1999-12-16 2004-04-15 Segal Vladimir M. Copper sputtering targets and methods of forming copper sputtering targets
US6749699B2 (en) * 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
US7871727B2 (en) * 2005-07-25 2011-01-18 3M Innovative Properties Company Alloy composition for lithium ion batteries
CN101215685B (zh) * 2007-12-27 2011-06-22 重庆跃进机械厂有限公司 制备减摩层内锡含量阶升pvd轴瓦的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102249087B1 (ko) * 2019-11-13 2021-05-07 (주)하나금속 판형 구리 스퍼터링 타겟 및 그 제조 방법

Also Published As

Publication number Publication date
CN102482767B (zh) 2014-05-07
WO2011024909A1 (fr) 2011-03-03
TW201111536A (en) 2011-04-01
KR20150004922A (ko) 2015-01-13
CN102482767A (zh) 2012-05-30
JPWO2011024909A1 (ja) 2013-01-31
JP4974197B2 (ja) 2012-07-11
TWI504769B (zh) 2015-10-21
KR101515340B1 (ko) 2015-04-24

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