KR20110107849A - 가스 도입 개구들을 구비한 기판 지지부 - Google Patents

가스 도입 개구들을 구비한 기판 지지부 Download PDF

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Publication number
KR20110107849A
KR20110107849A KR1020117018861A KR20117018861A KR20110107849A KR 20110107849 A KR20110107849 A KR 20110107849A KR 1020117018861 A KR1020117018861 A KR 1020117018861A KR 20117018861 A KR20117018861 A KR 20117018861A KR 20110107849 A KR20110107849 A KR 20110107849A
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South Korea
Prior art keywords
substrate
substrate support
gas
support
way
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Ceased
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KR1020117018861A
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English (en)
Korean (ko)
Inventor
삼 에이치. 김
존 엠. 화이트
수 영 최
칼 에이. 소렌센
로빈 엘. 티너
범수 박
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어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20110107849A publication Critical patent/KR20110107849A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

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  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020117018861A 2009-01-16 2010-01-14 가스 도입 개구들을 구비한 기판 지지부 Ceased KR20110107849A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14536109P 2009-01-16 2009-01-16
US61/145,361 2009-01-16
US12/686,483 2010-01-13
US12/686,483 US20100184290A1 (en) 2009-01-16 2010-01-13 Substrate support with gas introduction openings

Publications (1)

Publication Number Publication Date
KR20110107849A true KR20110107849A (ko) 2011-10-04

Family

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KR1020117018861A Ceased KR20110107849A (ko) 2009-01-16 2010-01-14 가스 도입 개구들을 구비한 기판 지지부

Country Status (6)

Country Link
US (2) US20100184290A1 (enExample)
JP (2) JP2012515451A (enExample)
KR (1) KR20110107849A (enExample)
CN (1) CN102282665B (enExample)
TW (1) TWI473200B (enExample)
WO (1) WO2010083271A2 (enExample)

Cited By (4)

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KR20170001183U (ko) * 2015-09-16 2017-03-31 어플라이드 머티어리얼스, 인코포레이티드 개선된 플라즈마 프로세싱 챔버를 위한 시스템들, 장치, 및 방법들
KR20180104240A (ko) * 2017-03-10 2018-09-20 삼성디스플레이 주식회사 기판과 스테이지 간의 분리 기구가 개선된 기판 처리 장치 및 그것을 이용한 기판 처리 방법
KR20200013121A (ko) * 2013-01-25 2020-02-05 어플라이드 머티어리얼스, 인코포레이티드 분리 가능한 가스 분배 플레이트를 갖는 샤워헤드
WO2021137414A1 (ko) * 2019-12-30 2021-07-08 (주)에이엔에이치 기판 처리장치의 서셉터 오토 레벨링 장치

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CN103693438B (zh) * 2013-12-18 2016-06-01 京东方科技集团股份有限公司 用于基板的支撑装置及其运送基板的方法
CN104617017A (zh) * 2015-01-12 2015-05-13 合肥京东方光电科技有限公司 基板支撑装置及支撑方法、真空干燥设备
US9499908B2 (en) * 2015-02-13 2016-11-22 Eastman Kodak Company Atomic layer deposition apparatus
GB201709446D0 (en) 2017-06-14 2017-07-26 Semblant Ltd Plasma processing apparatus
JP6851270B2 (ja) * 2017-06-16 2021-03-31 東京エレクトロン株式会社 静電吸着方法
CN108257908A (zh) * 2017-12-29 2018-07-06 深圳市华星光电半导体显示技术有限公司 升降方法、升降装置及计算机可读存储介质
CN109031715B (zh) * 2018-08-03 2021-07-06 深圳市华星光电半导体显示技术有限公司 一种剥离cvd机台内玻璃基板的方法
KR102285672B1 (ko) * 2019-06-04 2021-08-06 무진전자 주식회사 기판 건조 챔버
KR20220020961A (ko) * 2019-07-17 2022-02-21 어플라이드 머티어리얼스, 인코포레이티드 노출 후 프로세싱을 위한 방법들 및 장치
CN114256046B (zh) * 2020-09-22 2024-07-05 中微半导体设备(上海)股份有限公司 等离子体处理装置及其工作方法
CN114823263B (zh) * 2021-01-21 2025-09-16 东京毅力科创株式会社 基板处理装置
US20230113486A1 (en) * 2021-10-12 2023-04-13 Applied Materials, Inc. Substrate support assemblies having internal shaft areas with isolated environments that mitigate oxidation
CN117198972A (zh) * 2022-05-30 2023-12-08 江苏鲁汶仪器股份有限公司 一种晶圆升降机构及晶圆载台装置
TWI879616B (zh) * 2022-11-24 2025-04-01 南亞科技股份有限公司 形成半導體結構的方法
TWI847387B (zh) * 2022-11-24 2024-07-01 南亞科技股份有限公司 形成半導體結構的方法

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JP2002246450A (ja) * 2001-02-20 2002-08-30 Nikon Corp 基板保持装置及び基板搬送方法
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JP2003068836A (ja) * 2001-08-27 2003-03-07 Matsushita Electric Ind Co Ltd プラズマ処理装置及びプラズマ処理方法
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JP2003282691A (ja) * 2002-03-26 2003-10-03 Nec Kyushu Ltd ウェハ保持用静電チャックおよびウェハの剥離方法
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JP4080401B2 (ja) * 2003-09-05 2008-04-23 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
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US20060005770A1 (en) * 2004-07-09 2006-01-12 Robin Tiner Independently moving substrate supports
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KR101312292B1 (ko) * 2006-12-11 2013-09-27 엘아이지에이디피 주식회사 플라즈마 처리장치의 기판 파손 방지장치 및 그 방법
JP4824590B2 (ja) * 2007-01-31 2011-11-30 東京エレクトロン株式会社 基板処理装置
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200013121A (ko) * 2013-01-25 2020-02-05 어플라이드 머티어리얼스, 인코포레이티드 분리 가능한 가스 분배 플레이트를 갖는 샤워헤드
KR20170001183U (ko) * 2015-09-16 2017-03-31 어플라이드 머티어리얼스, 인코포레이티드 개선된 플라즈마 프로세싱 챔버를 위한 시스템들, 장치, 및 방법들
KR20180104240A (ko) * 2017-03-10 2018-09-20 삼성디스플레이 주식회사 기판과 스테이지 간의 분리 기구가 개선된 기판 처리 장치 및 그것을 이용한 기판 처리 방법
WO2021137414A1 (ko) * 2019-12-30 2021-07-08 (주)에이엔에이치 기판 처리장치의 서셉터 오토 레벨링 장치

Also Published As

Publication number Publication date
US20120149194A1 (en) 2012-06-14
US20100184290A1 (en) 2010-07-22
WO2010083271A3 (en) 2010-10-21
US8853098B2 (en) 2014-10-07
TWI473200B (zh) 2015-02-11
WO2010083271A2 (en) 2010-07-22
CN102282665B (zh) 2014-10-29
TW201037785A (en) 2010-10-16
JP2015216390A (ja) 2015-12-03
JP2012515451A (ja) 2012-07-05
CN102282665A (zh) 2011-12-14
JP6215871B2 (ja) 2017-10-18

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