KR20110056465A - 포커스 링 - Google Patents

포커스 링 Download PDF

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Publication number
KR20110056465A
KR20110056465A KR1020110042968A KR20110042968A KR20110056465A KR 20110056465 A KR20110056465 A KR 20110056465A KR 1020110042968 A KR1020110042968 A KR 1020110042968A KR 20110042968 A KR20110042968 A KR 20110042968A KR 20110056465 A KR20110056465 A KR 20110056465A
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KR
South Korea
Prior art keywords
focus ring
dielectric constant
dielectric
plasma
low dielectric
Prior art date
Application number
KR1020110042968A
Other languages
English (en)
Korean (ko)
Inventor
마사토 미나미
요시히코 사사키
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20110056465A publication Critical patent/KR20110056465A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
KR1020110042968A 2008-06-19 2011-05-06 포커스 링 KR20110056465A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008160636 2008-06-19
JPJP-P-2008-160636 2008-06-19
JPJP-P-2009-000606 2009-01-06
JP2009000606A JP5227197B2 (ja) 2008-06-19 2009-01-06 フォーカスリング及びプラズマ処理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020090053285A Division KR101171422B1 (ko) 2008-06-19 2009-06-16 포커스 링 및 플라즈마 처리 장치

Publications (1)

Publication Number Publication Date
KR20110056465A true KR20110056465A (ko) 2011-05-30

Family

ID=41483470

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110042968A KR20110056465A (ko) 2008-06-19 2011-05-06 포커스 링

Country Status (4)

Country Link
JP (1) JP5227197B2 (zh)
KR (1) KR20110056465A (zh)
CN (1) CN101609779B (zh)
TW (1) TWI501311B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160079689A (ko) * 2014-12-26 2016-07-06 도쿄엘렉트론가부시키가이샤 탑재대 및 플라즈마 처리 장치

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5885939B2 (ja) * 2010-07-20 2016-03-16 東京エレクトロン株式会社 シールド部材及びシールド部材を備えた基板載置台
JP5955062B2 (ja) * 2011-04-25 2016-07-20 東京エレクトロン株式会社 プラズマ処理装置
JP5665726B2 (ja) * 2011-12-14 2015-02-04 株式会社東芝 エッチング装置およびフォーカスリング
JP6400273B2 (ja) * 2013-03-11 2018-10-03 新光電気工業株式会社 静電チャック装置
CN103811247B (zh) * 2014-02-17 2016-04-13 清华大学 用于等离子体刻蚀的聚焦环及具有其的等离子体刻蚀装置
JP5615454B1 (ja) * 2014-02-25 2014-10-29 コバレントマテリアル株式会社 フォーカスリング
JP5941971B2 (ja) * 2014-12-10 2016-06-29 東京エレクトロン株式会社 リング状シールド部材及びリング状シールド部材を備えた基板載置台
JP6578215B2 (ja) * 2015-04-03 2019-09-18 株式会社ジャパンディスプレイ プラズマ処理装置、シールドリング、及び、シールドリング用部材
CN105551925A (zh) * 2015-12-08 2016-05-04 武汉华星光电技术有限公司 干刻蚀装置
US10755900B2 (en) * 2017-05-10 2020-08-25 Applied Materials, Inc. Multi-layer plasma erosion protection for chamber components
JP6969182B2 (ja) * 2017-07-06 2021-11-24 東京エレクトロン株式会社 プラズマ処理装置
KR102022458B1 (ko) * 2017-11-02 2019-09-18 인베니아 주식회사 쉴드 구조체 및 이를 포함하는 플라즈마 처리 장치
KR102022459B1 (ko) * 2017-11-02 2019-09-18 인베니아 주식회사 쉴드 구조체 및 이를 포함하는 플라즈마 처리 장치
JP6932070B2 (ja) * 2017-11-29 2021-09-08 東京エレクトロン株式会社 フォーカスリング及び半導体製造装置
JP7145625B2 (ja) * 2018-03-07 2022-10-03 東京エレクトロン株式会社 基板載置構造体およびプラズマ処理装置
US11450545B2 (en) 2019-04-17 2022-09-20 Samsung Electronics Co., Ltd. Capacitively-coupled plasma substrate processing apparatus including a focus ring and a substrate processing method using the same
KR102325223B1 (ko) * 2019-07-22 2021-11-10 세메스 주식회사 기판 처리 장치
KR20210044568A (ko) 2019-10-15 2021-04-23 삼성전자주식회사 식각 장치
KR102077975B1 (ko) * 2019-10-15 2020-02-14 주식회사 기가레인 플라즈마 처리 수직도가 향상된 플라즈마 처리 장치
CN112992631B (zh) * 2019-12-16 2023-09-29 中微半导体设备(上海)股份有限公司 一种下电极组件，其安装方法及等离子体处理装置
CN111501025B (zh) * 2020-04-23 2022-05-27 北京北方华创微电子装备有限公司 沉积设备
JP2023005174A (ja) * 2021-06-28 2023-01-18 東京エレクトロン株式会社 消耗部材、プラズマ処理装置及び消耗部材の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139628A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd ドライエツチング装置
JPH08339895A (ja) * 1995-06-12 1996-12-24 Tokyo Electron Ltd プラズマ処理装置
JP4367959B2 (ja) * 1999-12-22 2009-11-18 東京エレクトロン株式会社 プラズマ処理装置
US6363882B1 (en) * 1999-12-30 2002-04-02 Lam Research Corporation Lower electrode design for higher uniformity
KR100657054B1 (ko) * 2003-01-07 2006-12-13 동경 엘렉트론 주식회사 플라즈마 처리 장치 및 포커스 링
US20040261946A1 (en) * 2003-04-24 2004-12-30 Tokyo Electron Limited Plasma processing apparatus, focus ring, and susceptor
JP2008078208A (ja) * 2006-09-19 2008-04-03 Tokyo Electron Ltd フォーカスリング及びプラズマ処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160079689A (ko) * 2014-12-26 2016-07-06 도쿄엘렉트론가부시키가이샤 탑재대 및 플라즈마 처리 장치

Also Published As

Publication number Publication date
JP5227197B2 (ja) 2013-07-03
JP2010028073A (ja) 2010-02-04
TW201011829A (en) 2010-03-16
CN101609779A (zh) 2009-12-23
TWI501311B (zh) 2015-09-21
CN101609779B (zh) 2012-07-04

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A107 Divisional application of patent
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