KR20100034521A - 반도체용 슬러리 공급장치 및 슬러리 공급방법 - Google Patents
반도체용 슬러리 공급장치 및 슬러리 공급방법 Download PDFInfo
- Publication number
- KR20100034521A KR20100034521A KR1020080093708A KR20080093708A KR20100034521A KR 20100034521 A KR20100034521 A KR 20100034521A KR 1020080093708 A KR1020080093708 A KR 1020080093708A KR 20080093708 A KR20080093708 A KR 20080093708A KR 20100034521 A KR20100034521 A KR 20100034521A
- Authority
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- South Korea
- Prior art keywords
- slurry
- filter
- semiconductor
- particles
- crusher
- Prior art date
Links
- 239000002002 slurry Substances 0.000 title claims abstract description 114
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 239000002245 particle Substances 0.000 claims abstract description 24
- 238000011001 backwashing Methods 0.000 claims abstract description 17
- 238000011084 recovery Methods 0.000 claims description 12
- 238000007517 polishing process Methods 0.000 claims description 6
- 238000012216 screening Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000005276 aerator Methods 0.000 abstract 1
- 238000006467 substitution reaction Methods 0.000 abstract 1
- 238000001914 filtration Methods 0.000 description 17
- 238000005498 polishing Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000011550 stock solution Substances 0.000 description 2
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
Claims (5)
- 반도체 소자의 제조시 연마 공정에서 슬러리를 공급하기 위한 반도체용 슬러리 공급장치로서,공급되는 상기 슬러리 중 소정치 이상의 입자를 제거하기 위한 여과기;상기 여과기에 연결되어 주입되는 압축공기를 통해 상기 여과기의 역세척을 실시하는 공기 주입기;상기 여과기에 연결되어 여과되지 않은 슬러리가 저장되는 슬러리 회수탱크; 및상기 슬러리 회수 탱크에 설치되어 여과되지 않은 슬러리를 파쇄하기 위한 파쇄기를 포함하여 이루어진 것을 특징으로 하는 반도체용 슬러리 공급장치.
- 제1항에 있어서,상기 파쇄기는 고주파 대역의 초음파를 통해 슬러리를 분쇄하는 것을 특징으로 하는 반도체용 슬러리 공급장치.
- 제1항에 있어서,상기 여과기는 복수로 이루어져, 상기 여과기의 역세척과 상기 여과기를 통한 슬러리 선별이 교대로 이루어지는 것을 특징으로 하는 반도체용 슬러리 공급장치.
- 하나 이상의 여과기를 구비한 반도체용 슬러리 공급장치의 슬러리 공급방법으로서,상기 여과기의 필터부재에 부착된 슬러리를 역세척 방식으로 분리시키고, 소정치 이상의 입자를 갖는 슬러리를 파쇄하여 상기 여과기에 재공급하는 것을 특징으로 하는 반도체용 슬러리 공급방법.
- 제4항에 있어서,상기 여과기는 복수로 이루어져, 상기 여과기의 역세척과 상기 여과기를 통한 슬러리 선별이 교대로 이루어지는 것을 특징으로 하는 반도체용 슬러리 공급방법.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080093708A KR100985861B1 (ko) | 2008-09-24 | 2008-09-24 | 반도체용 슬러리 공급장치 및 슬러리 공급방법 |
US13/120,149 US20110174745A1 (en) | 2008-09-24 | 2009-09-22 | Apparatus and method for supplying slurry for a semiconductor |
PCT/KR2009/005373 WO2010035998A2 (ko) | 2008-09-24 | 2009-09-22 | 반도체용 슬러리 공급장치 및 슬러리 공급방법 |
JP2011528925A JP5303649B2 (ja) | 2008-09-24 | 2009-09-22 | 半導体用スラリー供給装置及びスラリー供給方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080093708A KR100985861B1 (ko) | 2008-09-24 | 2008-09-24 | 반도체용 슬러리 공급장치 및 슬러리 공급방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100034521A true KR20100034521A (ko) | 2010-04-01 |
KR100985861B1 KR100985861B1 (ko) | 2010-10-08 |
Family
ID=42060252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080093708A KR100985861B1 (ko) | 2008-09-24 | 2008-09-24 | 반도체용 슬러리 공급장치 및 슬러리 공급방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20110174745A1 (ko) |
JP (1) | JP5303649B2 (ko) |
KR (1) | KR100985861B1 (ko) |
WO (1) | WO2010035998A2 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012030005A1 (ko) * | 2010-09-02 | 2012-03-08 | 씨앤지하이테크 주식회사 | 배관 막힘 방지 수단이 마련된 반도체용 슬러리 공급장치 |
KR20210145070A (ko) * | 2020-05-22 | 2021-12-01 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 반도체 디바이스 제조 프로세스를 위한 필터 장치 |
KR102351236B1 (ko) * | 2021-01-28 | 2022-01-14 | 플러스이엔지 주식회사 | 직병렬 모드 변경 가능한 필터 시스템 및 이를 구비한 슬러리 공급 장치 |
Families Citing this family (3)
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JP5038378B2 (ja) * | 2009-11-11 | 2012-10-03 | 株式会社コガネイ | 薬液供給装置および薬液供給方法 |
JP6140051B2 (ja) | 2013-10-23 | 2017-05-31 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
KR101907830B1 (ko) | 2018-05-15 | 2018-12-07 | 한동권 | 평면형 tv 프레임 측 헤어라인 가공을 위한 헤어라인 형성방법 |
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2008
- 2008-09-24 KR KR1020080093708A patent/KR100985861B1/ko active IP Right Grant
-
2009
- 2009-09-22 WO PCT/KR2009/005373 patent/WO2010035998A2/ko active Application Filing
- 2009-09-22 US US13/120,149 patent/US20110174745A1/en not_active Abandoned
- 2009-09-22 JP JP2011528925A patent/JP5303649B2/ja not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012030005A1 (ko) * | 2010-09-02 | 2012-03-08 | 씨앤지하이테크 주식회사 | 배관 막힘 방지 수단이 마련된 반도체용 슬러리 공급장치 |
KR101138403B1 (ko) * | 2010-09-02 | 2012-04-26 | 씨앤지하이테크 주식회사 | 배관 막힘 방지 수단이 마련된 반도체용 슬러리 공급장치 |
KR20210145070A (ko) * | 2020-05-22 | 2021-12-01 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 반도체 디바이스 제조 프로세스를 위한 필터 장치 |
KR102351236B1 (ko) * | 2021-01-28 | 2022-01-14 | 플러스이엔지 주식회사 | 직병렬 모드 변경 가능한 필터 시스템 및 이를 구비한 슬러리 공급 장치 |
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Publication number | Publication date |
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WO2010035998A3 (ko) | 2010-07-08 |
US20110174745A1 (en) | 2011-07-21 |
KR100985861B1 (ko) | 2010-10-08 |
WO2010035998A2 (ko) | 2010-04-01 |
JP5303649B2 (ja) | 2013-10-02 |
JP2012503557A (ja) | 2012-02-09 |
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