KR20080076915A - 실리콘 및 실리콘 합금들에서 상보형 접합형 전계 효과트랜지스터 및 mos 트랜지스터를 이용하는 집적 회로 - Google Patents
실리콘 및 실리콘 합금들에서 상보형 접합형 전계 효과트랜지스터 및 mos 트랜지스터를 이용하는 집적 회로 Download PDFInfo
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- KR20080076915A KR20080076915A KR1020087012745A KR20087012745A KR20080076915A KR 20080076915 A KR20080076915 A KR 20080076915A KR 1020087012745 A KR1020087012745 A KR 1020087012745A KR 20087012745 A KR20087012745 A KR 20087012745A KR 20080076915 A KR20080076915 A KR 20080076915A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/83—FETs having PN junction gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/022—Manufacture or treatment of FETs having insulated gates [IGFET] having lightly-doped source or drain extensions selectively formed at the sides of the gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/051—Manufacture or treatment of FETs having PN junction gates
- H10D30/0512—Manufacture or treatment of FETs having PN junction gates of FETs having PN homojunction gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/258—Source or drain electrodes for field-effect devices characterised by the relative positions of the source or drain electrodes with respect to the gate electrode
- H10D64/259—Source or drain electrodes being self-aligned with the gate electrode and having bottom surfaces higher than the interface between the channel and the gate dielectric
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/87—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of PN-junction gate FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
- H10P32/1408—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
- H10P32/1414—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer being silicon, silicide or SIPOS, e.g. polysilicon or porous silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
- H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/261,873 | 2005-10-28 | ||
| US11/261,873 US7569873B2 (en) | 2005-10-28 | 2005-10-28 | Integrated circuit using complementary junction field effect transistor and MOS transistor in silicon and silicon alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080076915A true KR20080076915A (ko) | 2008-08-20 |
Family
ID=37995097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087012745A Ceased KR20080076915A (ko) | 2005-10-28 | 2006-10-30 | 실리콘 및 실리콘 합금들에서 상보형 접합형 전계 효과트랜지스터 및 mos 트랜지스터를 이용하는 집적 회로 |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US7569873B2 (https=) |
| EP (1) | EP1949456A4 (https=) |
| JP (1) | JP2009514233A (https=) |
| KR (1) | KR20080076915A (https=) |
| CN (2) | CN102332472A (https=) |
| CA (1) | CA2626706A1 (https=) |
| TW (1) | TWI333695B (https=) |
| WO (1) | WO2007053485A2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9425104B2 (en) | 2013-09-06 | 2016-08-23 | Samsung Electronics Co., Ltd. | Complementary metal oxide semiconductor device and method of manufacturing the same |
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-
2005
- 2005-10-28 US US11/261,873 patent/US7569873B2/en not_active Expired - Fee Related
-
2006
- 2006-10-27 TW TW095139730A patent/TWI333695B/zh not_active IP Right Cessation
- 2006-10-30 CN CN2011102827104A patent/CN102332472A/zh active Pending
- 2006-10-30 CA CA002626706A patent/CA2626706A1/en not_active Abandoned
- 2006-10-30 WO PCT/US2006/042139 patent/WO2007053485A2/en not_active Ceased
- 2006-10-30 EP EP06844229A patent/EP1949456A4/en not_active Withdrawn
- 2006-10-30 CN CN2006800398328A patent/CN101371359B/zh not_active Expired - Fee Related
- 2006-10-30 KR KR1020087012745A patent/KR20080076915A/ko not_active Ceased
- 2006-10-30 JP JP2008538040A patent/JP2009514233A/ja active Pending
-
2008
- 2008-11-03 US US12/263,854 patent/US7687834B2/en not_active Expired - Fee Related
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- 2009-06-26 US US12/492,320 patent/US7915107B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9425104B2 (en) | 2013-09-06 | 2016-08-23 | Samsung Electronics Co., Ltd. | Complementary metal oxide semiconductor device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1949456A4 (en) | 2009-09-30 |
| TW200733401A (en) | 2007-09-01 |
| CN102332472A (zh) | 2012-01-25 |
| EP1949456A2 (en) | 2008-07-30 |
| CA2626706A1 (en) | 2007-05-10 |
| US20090057727A1 (en) | 2009-03-05 |
| US7687834B2 (en) | 2010-03-30 |
| WO2007053485A3 (en) | 2008-10-02 |
| WO2007053485A2 (en) | 2007-05-10 |
| US7915107B2 (en) | 2011-03-29 |
| CN101371359B (zh) | 2011-11-09 |
| CN101371359A (zh) | 2009-02-18 |
| US20090311837A1 (en) | 2009-12-17 |
| JP2009514233A (ja) | 2009-04-02 |
| US20070096144A1 (en) | 2007-05-03 |
| US7569873B2 (en) | 2009-08-04 |
| TWI333695B (en) | 2010-11-21 |
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