KR20080071148A - 반도체 프로세스 챔버 - Google Patents
반도체 프로세스 챔버 Download PDFInfo
- Publication number
- KR20080071148A KR20080071148A KR1020087012525A KR20087012525A KR20080071148A KR 20080071148 A KR20080071148 A KR 20080071148A KR 1020087012525 A KR1020087012525 A KR 1020087012525A KR 20087012525 A KR20087012525 A KR 20087012525A KR 20080071148 A KR20080071148 A KR 20080071148A
- Authority
- KR
- South Korea
- Prior art keywords
- processing apparatus
- semiconductor substrate
- substrate support
- substrate
- substrate processing
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 107
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 172
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 47
- 238000012545 processing Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000005229 chemical vapour deposition Methods 0.000 claims description 18
- 230000003028 elevating effect Effects 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 6
- 238000005137 deposition process Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 description 10
- 238000012546 transfer Methods 0.000 description 10
- 238000000576 coating method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- -1 plasma Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000009419 refurbishment Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/258,345 US20070089836A1 (en) | 2005-10-24 | 2005-10-24 | Semiconductor process chamber |
US11/258,345 | 2005-10-24 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117007365A Division KR20110046579A (ko) | 2005-10-24 | 2006-10-12 | 반도체 프로세스 챔버 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20080071148A true KR20080071148A (ko) | 2008-08-01 |
Family
ID=37968117
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117007365A KR20110046579A (ko) | 2005-10-24 | 2006-10-12 | 반도체 프로세스 챔버 |
KR1020087012525A KR20080071148A (ko) | 2005-10-24 | 2006-10-12 | 반도체 프로세스 챔버 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117007365A KR20110046579A (ko) | 2005-10-24 | 2006-10-12 | 반도체 프로세스 챔버 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070089836A1 (fr) |
EP (1) | EP1940560A4 (fr) |
JP (1) | JP2009513027A (fr) |
KR (2) | KR20110046579A (fr) |
CN (1) | CN1956145B (fr) |
TW (1) | TWI382450B (fr) |
WO (1) | WO2007050309A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101105697B1 (ko) * | 2010-03-02 | 2012-01-17 | 주식회사 엘지실트론 | 반도체 제조 장치 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5412759B2 (ja) * | 2008-07-31 | 2014-02-12 | 株式会社Sumco | エピタキシャルウェーハの保持具及びそのウェーハの製造方法 |
CN101660143B (zh) * | 2008-08-28 | 2011-08-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 平板加热器及等离子体加工设备 |
US8388853B2 (en) * | 2009-02-11 | 2013-03-05 | Applied Materials, Inc. | Non-contact substrate processing |
US20130315895A1 (en) | 2010-07-01 | 2013-11-28 | Takeda Pharmaceutical Company Limited | COMBINATION OF A cMET INHIBITOR AND AN ANTIBODY TO HGF AND/OR cMET |
US20120148760A1 (en) * | 2010-12-08 | 2012-06-14 | Glen Eric Egami | Induction Heating for Substrate Processing |
DE102011007632B3 (de) * | 2011-04-18 | 2012-02-16 | Siltronic Ag | Verfahren und Vorrichtung zum Abscheiden einer von Prozessgas stammenden Materialschicht auf einer Substratscheibe |
US20130025538A1 (en) * | 2011-07-27 | 2013-01-31 | Applied Materials, Inc. | Methods and apparatus for deposition processes |
TWI505400B (zh) | 2011-08-26 | 2015-10-21 | Lg Siltron Inc | 基座 |
TWI541928B (zh) * | 2011-10-14 | 2016-07-11 | 晶元光電股份有限公司 | 晶圓載具 |
US9273408B2 (en) * | 2012-09-12 | 2016-03-01 | Globalfoundries Inc. | Direct injection molded solder process for forming solder bumps on wafers |
EP2923376A4 (fr) * | 2012-11-21 | 2016-06-22 | Ev Group Inc | Dispositif de logement destiné à loger et à monter une tranche |
CN105431928B (zh) * | 2013-02-06 | 2018-02-16 | 应用材料公司 | 气体注入装置及并入气体注入装置的基板处理腔室 |
US9799548B2 (en) * | 2013-03-15 | 2017-10-24 | Applied Materials, Inc. | Susceptors for enhanced process uniformity and reduced substrate slippage |
US9551070B2 (en) | 2014-05-30 | 2017-01-24 | Applied Materials, Inc. | In-situ corrosion resistant substrate support coating |
US20160056059A1 (en) * | 2014-08-22 | 2016-02-25 | Applied Materials, Inc. | Component for semiconductor process chamber having surface treatment to reduce particle emission |
KR20170054447A (ko) * | 2014-09-05 | 2017-05-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판들의 열적 프로세싱을 위한 서셉터 및 예열 링 |
EP3229836B1 (fr) | 2014-12-09 | 2019-11-13 | Institut National de la Sante et de la Recherche Medicale (INSERM) | Anticoprs monoclonaux contre 'axl' |
CN107112265B (zh) * | 2015-01-09 | 2020-12-04 | 应用材料公司 | 基板传送机构 |
WO2016135041A1 (fr) | 2015-02-26 | 2016-09-01 | INSERM (Institut National de la Santé et de la Recherche Médicale) | Protéines de fusion et anticorps les contenant pour favoriser l'apoptose |
WO2016191448A1 (fr) * | 2015-05-27 | 2016-12-01 | Applied Materials, Inc. | Anneau de protection thermique pour chambre d'epi à taux de croissance élevé |
JP6435992B2 (ja) * | 2015-05-29 | 2018-12-12 | 株式会社Sumco | エピタキシャル成長装置、エピタキシャルウェーハの製造方法およびエピタキシャル成長装置用リフトピン |
US20170076972A1 (en) * | 2015-09-15 | 2017-03-16 | Veeco Instruments Inc. | Planetary wafer carriers |
CN107201507B (zh) * | 2016-03-17 | 2019-09-17 | Asm知识产权私人控股有限公司 | 衬底支撑板和包含其的薄膜沉积设备 |
KR102632725B1 (ko) | 2016-03-17 | 2024-02-05 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 플레이트 및 이를 포함하는 박막 증착 장치 및 박막 증착 방법 |
KR102040378B1 (ko) * | 2016-12-20 | 2019-11-05 | 주식회사 티씨케이 | 지그를 이용한 반도체 제조용 부품의 제조방법 및 제조장치 |
US10629416B2 (en) * | 2017-01-23 | 2020-04-21 | Infineon Technologies Ag | Wafer chuck and processing arrangement |
US11018047B2 (en) * | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
JP7329960B2 (ja) * | 2019-05-14 | 2023-08-21 | 東京エレクトロン株式会社 | 載置台およびプラズマ処理装置 |
CN111501042B (zh) * | 2020-06-02 | 2023-09-01 | 海南师范大学 | 一种边发射半导体激光芯片腔面镀膜夹具 |
EP4335951A1 (fr) | 2022-09-08 | 2024-03-13 | Siltronic AG | Suscepteur pourvu d'éléments d'appui interchangeables |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62100477A (ja) * | 1985-10-25 | 1987-05-09 | イビデン株式会社 | ドライ・エツチング装置用の炭化珪素質部品 |
US5589116A (en) * | 1991-07-18 | 1996-12-31 | Sumitomo Metal Industries, Ltd. | Process for preparing a silicon carbide sintered body for use in semiconductor equipment |
US5536918A (en) * | 1991-08-16 | 1996-07-16 | Tokyo Electron Sagami Kabushiki Kaisha | Heat treatment apparatus utilizing flat heating elements for treating semiconductor wafers |
JP3317781B2 (ja) * | 1994-06-08 | 2002-08-26 | 東芝セラミックス株式会社 | 半導体ウエハの熱処理用サセプタの製造方法 |
US5915310A (en) * | 1995-07-27 | 1999-06-29 | Consolidated Natural Gas Service Company | Apparatus and method for NOx reduction by selective injection of natural gas jets in flue gas |
JPH0964158A (ja) * | 1995-08-29 | 1997-03-07 | Toshiba Mach Co Ltd | 試料昇降装置 |
US6113702A (en) * | 1995-09-01 | 2000-09-05 | Asm America, Inc. | Wafer support system |
KR100487262B1 (ko) * | 1996-02-29 | 2005-09-02 | 가부시키가이샤 브리지스톤 | 탄화규소 소결체 및 그의 제조방법 |
US6440221B2 (en) * | 1996-05-13 | 2002-08-27 | Applied Materials, Inc. | Process chamber having improved temperature control |
JPH10101432A (ja) * | 1996-08-05 | 1998-04-21 | Bridgestone Corp | ドライエッチング装置用部品 |
US5910221A (en) * | 1997-06-18 | 1999-06-08 | Applied Materials, Inc. | Bonded silicon carbide parts in a plasma reactor |
JP4390872B2 (ja) * | 1997-06-20 | 2009-12-24 | 株式会社ブリヂストン | 半導体製造装置用部材および半導体製造装置用部材の製造方法 |
US6007635A (en) * | 1997-11-26 | 1999-12-28 | Micro C Technologies, Inc. | Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing |
US6090733A (en) * | 1997-08-27 | 2000-07-18 | Bridgestone Corporation | Sintered silicon carbide and method for producing the same |
US6325858B1 (en) * | 1997-11-03 | 2001-12-04 | Asm America, Inc. | Long life high temperature process chamber |
EP0981000B1 (fr) * | 1998-02-18 | 2004-07-28 | Nippon Pillar Packing Co., Ltd. | Joint rotatif |
US6277194B1 (en) * | 1999-10-21 | 2001-08-21 | Applied Materials, Inc. | Method for in-situ cleaning of surfaces in a substrate processing chamber |
US6534751B2 (en) * | 2000-02-28 | 2003-03-18 | Kyocera Corporation | Wafer heating apparatus and ceramic heater, and method for producing the same |
JP2002231713A (ja) * | 2001-01-30 | 2002-08-16 | Ibiden Co Ltd | 半導体製造装置用治具 |
JP3931578B2 (ja) * | 2001-03-30 | 2007-06-20 | 信越半導体株式会社 | 気相成長装置 |
JP2003197532A (ja) * | 2001-12-21 | 2003-07-11 | Sumitomo Mitsubishi Silicon Corp | エピタキシャル成長方法及びエピタキシャル成長用サセプター |
KR100937540B1 (ko) * | 2002-03-13 | 2010-01-19 | 스미토모덴키고교가부시키가이샤 | 반도체 제조 장치용 유지체 |
JP4003527B2 (ja) * | 2002-04-25 | 2007-11-07 | 信越半導体株式会社 | サセプタおよび半導体ウェーハの製造方法 |
JP4354243B2 (ja) * | 2003-04-21 | 2009-10-28 | 東京エレクトロン株式会社 | 被処理体の昇降機構及び処理装置 |
US7585371B2 (en) * | 2004-04-08 | 2009-09-08 | Micron Technology, Inc. | Substrate susceptors for receiving semiconductor substrates to be deposited upon |
-
2005
- 2005-10-24 US US11/258,345 patent/US20070089836A1/en not_active Abandoned
-
2006
- 2006-10-12 JP JP2008537749A patent/JP2009513027A/ja active Pending
- 2006-10-12 KR KR1020117007365A patent/KR20110046579A/ko not_active Application Discontinuation
- 2006-10-12 WO PCT/US2006/039914 patent/WO2007050309A1/fr active Application Filing
- 2006-10-12 EP EP06816802A patent/EP1940560A4/fr not_active Withdrawn
- 2006-10-12 KR KR1020087012525A patent/KR20080071148A/ko not_active Application Discontinuation
- 2006-10-19 TW TW095138624A patent/TWI382450B/zh active
- 2006-10-24 CN CN2006101507127A patent/CN1956145B/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101105697B1 (ko) * | 2010-03-02 | 2012-01-17 | 주식회사 엘지실트론 | 반도체 제조 장치 |
Also Published As
Publication number | Publication date |
---|---|
CN1956145B (zh) | 2013-09-11 |
WO2007050309A1 (fr) | 2007-05-03 |
TW200717593A (en) | 2007-05-01 |
JP2009513027A (ja) | 2009-03-26 |
EP1940560A4 (fr) | 2010-09-15 |
CN1956145A (zh) | 2007-05-02 |
TWI382450B (zh) | 2013-01-11 |
KR20110046579A (ko) | 2011-05-04 |
US20070089836A1 (en) | 2007-04-26 |
EP1940560A1 (fr) | 2008-07-09 |
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