KR20070026586A - 열전변환 모듈 - Google Patents

열전변환 모듈 Download PDF

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Publication number
KR20070026586A
KR20070026586A KR1020067026232A KR20067026232A KR20070026586A KR 20070026586 A KR20070026586 A KR 20070026586A KR 1020067026232 A KR1020067026232 A KR 1020067026232A KR 20067026232 A KR20067026232 A KR 20067026232A KR 20070026586 A KR20070026586 A KR 20070026586A
Authority
KR
South Korea
Prior art keywords
thermoelectric conversion
thermally conductive
type semiconductor
electrode
conversion module
Prior art date
Application number
KR1020067026232A
Other languages
English (en)
Korean (ko)
Inventor
고오 다까하시
Original Assignee
아르재 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아르재 가부시키가이샤 filed Critical 아르재 가부시키가이샤
Publication of KR20070026586A publication Critical patent/KR20070026586A/ko

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H02N11/002—Generators

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020067026232A 2004-06-17 2005-05-25 열전변환 모듈 KR20070026586A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00179199 2004-06-17
JP2004179199 2004-06-17

Publications (1)

Publication Number Publication Date
KR20070026586A true KR20070026586A (ko) 2007-03-08

Family

ID=35510015

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067026232A KR20070026586A (ko) 2004-06-17 2005-05-25 열전변환 모듈

Country Status (6)

Country Link
US (2) US20080271771A1 (de)
EP (1) EP1780809A4 (de)
JP (1) JP4949832B2 (de)
KR (1) KR20070026586A (de)
CN (1) CN1969398A (de)
WO (1) WO2005124882A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015608B1 (ko) * 2010-07-30 2011-02-16 한국기계연구원 태양열을 이용한 적층형 열전발전장치
WO2018038286A1 (ko) * 2016-08-24 2018-03-01 희성금속 주식회사 열전 모듈

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WO2007145183A1 (ja) * 2006-06-14 2007-12-21 Aruze Corp. 熱電変換モジュールおよび熱電変換素子用コネクタ
JP2008108900A (ja) * 2006-10-25 2008-05-08 Toshiba Corp 熱電変換モジュールおよび熱電変換装置
JP5288231B2 (ja) * 2007-06-25 2013-09-11 株式会社リコー トナー担持体、現像装置及び画像形成装置
WO2009041207A1 (ja) * 2007-09-26 2009-04-02 Aruze Corp. 金属複合酸化物粉末の製造方法
US20100213646A1 (en) * 2007-09-26 2010-08-26 Universal Entertainment Method for producing metal complex oxide sintered body
CN101527346A (zh) * 2008-03-04 2009-09-09 富士迈半导体精密工业（上海）有限公司 热电致冷器及采用该热电致冷器的照明装置
CN101640247B (zh) * 2008-08-01 2012-11-14 王钦戊 热电能源产生器及其快速储能系统
WO2010115792A1 (en) 2009-04-02 2010-10-14 Basf Se Thermoelectric module with insulated substrate
CN102025295A (zh) * 2009-12-21 2011-04-20 任永斌 一种高效集成半导体温差发电模块及制造方法
US9601677B2 (en) * 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
CN102201761A (zh) * 2010-03-24 2011-09-28 岳凡恩 供电模块、系统及其方法
JP2013042862A (ja) * 2011-08-23 2013-03-04 National Institute Of Advanced Industrial Science & Technology 発電機能を有する調理器具
CN103296190B (zh) * 2012-02-28 2016-01-13 中国科学院上海微系统与信息技术研究所 三维热电能量收集器及其制作方法
KR101998697B1 (ko) * 2012-06-28 2019-07-10 엘지이노텍 주식회사 열전냉각모듈 및 이의 제조 방법
US20150243870A1 (en) * 2013-04-23 2015-08-27 Hi-Z Technology, Inc. Compact high power density thermoelectric generator
CN103983030B (zh) * 2014-05-30 2016-04-27 西安交通大学 一种太阳能热电联产管
WO2016027128A1 (fr) * 2014-08-20 2016-02-25 Aperam Module de génération thermoélectrique et procédé de fabrication associé
CN113275057B (zh) 2015-07-23 2023-04-07 塞弗德公司 热控设备及其使用方法
JP2019525455A (ja) * 2016-06-23 2019-09-05 スリーエム イノベイティブ プロパティズ カンパニー フレキシブル熱電モジュール
JP2019525454A (ja) * 2016-06-23 2019-09-05 スリーエム イノベイティブ プロパティズ カンパニー 熱電テープ
CN110268369A (zh) * 2016-10-31 2019-09-20 泰格韦有限公司 柔性热电模块和包含柔性热电模块的热电装置
US11417815B2 (en) * 2017-03-03 2022-08-16 Hiroaki Nakaya Thermoelectric conversion module provided with photothermal conversion substrate
JP7242999B2 (ja) * 2018-03-16 2023-03-22 三菱マテリアル株式会社 熱電変換素子
RU2680675C1 (ru) * 2018-03-21 2019-02-25 Общество с ограниченной ответственностью "Компания РМТ" Способ изготовления термоэлектрических микроохладителей (варианты)
CN111982323B (zh) * 2019-05-24 2021-12-14 中国科学院上海微系统与信息技术研究所 热电堆型高温热流传感器及其制备方法
CN110854261A (zh) * 2019-11-04 2020-02-28 深圳市汇城精密科技有限公司 电子制冷片的生产方法
US11882766B2 (en) 2020-03-27 2024-01-23 Lintec Corporation Thermoelectric conversion module
FR3116154A1 (fr) * 2020-11-09 2022-05-13 Valeo Systemes Thermiques Echangeur thermique et procédé de fabrication associé
CN113594345A (zh) * 2021-06-23 2021-11-02 华为技术有限公司 热电子模块、热电器件和可穿戴设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3225549A (en) * 1962-04-18 1965-12-28 Thore M Elfving Thermoelectric cooling device
US4497973A (en) * 1983-02-28 1985-02-05 Ecd-Anr Energy Conversion Company Thermoelectric device exhibiting decreased stress
JP3043419B2 (ja) * 1994-05-13 2000-05-22 ハイドロクール ピーティーワイ． リミテッド 冷却装置
JPH10125963A (ja) * 1996-10-16 1998-05-15 Chichibu Onoda Cement Corp 熱電変換装置
JPH10190072A (ja) * 1996-12-27 1998-07-21 Yamaha Corp 熱電モジュール
JP2002374010A (ja) * 2001-06-15 2002-12-26 Yyl:Kk 電極構造と半導体装置と熱電装置ならびにその製造方法
JP2003332642A (ja) * 2002-05-10 2003-11-21 Komatsu Electronics Inc 熱電変換素子ユニット

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015608B1 (ko) * 2010-07-30 2011-02-16 한국기계연구원 태양열을 이용한 적층형 열전발전장치
WO2018038286A1 (ko) * 2016-08-24 2018-03-01 희성금속 주식회사 열전 모듈

Also Published As

Publication number Publication date
US20080271771A1 (en) 2008-11-06
CN1969398A (zh) 2007-05-23
US20120298164A1 (en) 2012-11-29
WO2005124882A1 (ja) 2005-12-29
JPWO2005124882A1 (ja) 2008-04-17
JP4949832B2 (ja) 2012-06-13
EP1780809A4 (de) 2009-12-30
EP1780809A1 (de) 2007-05-02

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