KR20070020150A - 플루오르화수소를 함유하는 플루오르화 용매 조성물 - Google Patents

플루오르화수소를 함유하는 플루오르화 용매 조성물 Download PDF

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Publication number
KR20070020150A
KR20070020150A KR1020077002107A KR20077002107A KR20070020150A KR 20070020150 A KR20070020150 A KR 20070020150A KR 1020077002107 A KR1020077002107 A KR 1020077002107A KR 20077002107 A KR20077002107 A KR 20077002107A KR 20070020150 A KR20070020150 A KR 20070020150A
Authority
KR
South Korea
Prior art keywords
composition
cleaning
hydrogen fluoride
fluorinated
etch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077002107A
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English (en)
Korean (ko)
Inventor
프레더릭 이. 베어
로렌스 에이. 자제라
폴 이. 라즈타
마이클 제이. 패런트
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 캄파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 캄파니
Publication of KR20070020150A publication Critical patent/KR20070020150A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02Inorganic compounds
    • C11D7/04Water-soluble compounds
    • C11D7/08Acids
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/24Organic compounds containing halogen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5018Halogenated solvents
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/0206Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Weting (AREA)
KR1020077002107A 2000-03-31 2000-07-06 플루오르화수소를 함유하는 플루오르화 용매 조성물 Withdrawn KR20070020150A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/541,453 US6310018B1 (en) 2000-03-31 2000-03-31 Fluorinated solvent compositions containing hydrogen fluoride
US09/541,453 2000-03-31

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020027012924A Division KR100785131B1 (ko) 2000-03-31 2000-07-06 플루오르화 수소를 함유하는 플루오르화 용매 조성물

Publications (1)

Publication Number Publication Date
KR20070020150A true KR20070020150A (ko) 2007-02-16

Family

ID=24159658

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020077002107A Withdrawn KR20070020150A (ko) 2000-03-31 2000-07-06 플루오르화수소를 함유하는 플루오르화 용매 조성물
KR1020027012924A Expired - Fee Related KR100785131B1 (ko) 2000-03-31 2000-07-06 플루오르화 수소를 함유하는 플루오르화 용매 조성물

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020027012924A Expired - Fee Related KR100785131B1 (ko) 2000-03-31 2000-07-06 플루오르화 수소를 함유하는 플루오르화 용매 조성물

Country Status (6)

Country Link
US (2) US6310018B1 (OSRAM)
EP (1) EP1269527A1 (OSRAM)
JP (1) JP4786111B2 (OSRAM)
KR (2) KR20070020150A (OSRAM)
AU (1) AU2000259171A1 (OSRAM)
WO (1) WO2001075955A1 (OSRAM)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6552090B1 (en) * 1997-09-15 2003-04-22 3M Innovative Properties Company Perfluoroalkyl haloalkyl ethers and compositions and applications thereof
US6100198A (en) * 1998-02-27 2000-08-08 Micron Technology, Inc. Post-planarization, pre-oxide removal ozone treatment
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
US6872984B1 (en) 1998-07-29 2005-03-29 Silicon Light Machines Corporation Method of sealing a hermetic lid to a semiconductor die at an angle
US6956878B1 (en) 2000-02-07 2005-10-18 Silicon Light Machines Corporation Method and apparatus for reducing laser speckle using polarization averaging
US6372700B1 (en) * 2000-03-31 2002-04-16 3M Innovative Properties Company Fluorinated solvent compositions containing ozone
US6310018B1 (en) * 2000-03-31 2001-10-30 3M Innovative Properties Company Fluorinated solvent compositions containing hydrogen fluoride
TWI259202B (en) * 2000-06-01 2006-08-01 Asahi Kasei Corp Cleaning method and cleaning apparatus
US6387723B1 (en) * 2001-01-19 2002-05-14 Silicon Light Machines Reduced surface charging in silicon-based devices
TWI242805B (en) * 2001-02-15 2005-11-01 United Microelectronics Corp Post metal etch cleaning method
US7177081B2 (en) 2001-03-08 2007-02-13 Silicon Light Machines Corporation High contrast grating light valve type device
US6707591B2 (en) 2001-04-10 2004-03-16 Silicon Light Machines Angled illumination for a single order light modulator based projection system
US6865346B1 (en) 2001-06-05 2005-03-08 Silicon Light Machines Corporation Fiber optic transceiver
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6930364B2 (en) 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6696364B2 (en) * 2001-10-19 2004-02-24 Stmicroelectronics S.R.L. Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support
US6956995B1 (en) 2001-11-09 2005-10-18 Silicon Light Machines Corporation Optical communication arrangement
JP4042412B2 (ja) * 2002-01-11 2008-02-06 ソニー株式会社 洗浄及び乾燥方法
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6767751B2 (en) 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
US6728023B1 (en) 2002-05-28 2004-04-27 Silicon Light Machines Optical device arrays with optimized image resolution
US7054515B1 (en) 2002-05-30 2006-05-30 Silicon Light Machines Corporation Diffractive light modulator-based dynamic equalizer with integrated spectral monitor
US6841079B2 (en) * 2002-05-31 2005-01-11 3M Innovative Properties Company Fluorochemical treatment for silicon articles
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
US6699829B2 (en) * 2002-06-07 2004-03-02 Kyzen Corporation Cleaning compositions containing dichloroethylene and six carbon alkoxy substituted perfluoro compounds
US6829258B1 (en) 2002-06-26 2004-12-07 Silicon Light Machines, Inc. Rapidly tunable external cavity laser
US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
US6908201B2 (en) 2002-06-28 2005-06-21 Silicon Light Machines Corporation Micro-support structures
US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US7057795B2 (en) 2002-08-20 2006-06-06 Silicon Light Machines Corporation Micro-structures with individually addressable ribbon pairs
US7018937B2 (en) * 2002-08-29 2006-03-28 Micron Technology, Inc. Compositions for removal of processing byproducts and method for using same
US20040058551A1 (en) * 2002-09-23 2004-03-25 Meagley Robert P. Fluorous cleaning solution for lithographic processing
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
US6890452B2 (en) * 2002-11-08 2005-05-10 3M Innovative Properties Company Fluorinated surfactants for aqueous acid etch solutions
US7169323B2 (en) * 2002-11-08 2007-01-30 3M Innovative Properties Company Fluorinated surfactants for buffered acid etch solutions
US6928207B1 (en) 2002-12-12 2005-08-09 Silicon Light Machines Corporation Apparatus for selectively blocking WDM channels
US6884338B2 (en) 2002-12-16 2005-04-26 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US7147767B2 (en) 2002-12-16 2006-12-12 3M Innovative Properties Company Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
US6858124B2 (en) 2002-12-16 2005-02-22 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US6987600B1 (en) 2002-12-17 2006-01-17 Silicon Light Machines Corporation Arbitrary phase profile for better equalization in dynamic gain equalizer
US7057819B1 (en) 2002-12-17 2006-06-06 Silicon Light Machines Corporation High contrast tilting ribbon blazed grating
US20040118621A1 (en) * 2002-12-18 2004-06-24 Curtis Marc D. Live hydraulics for utility vehicles
US6934070B1 (en) 2002-12-18 2005-08-23 Silicon Light Machines Corporation Chirped optical MEM device
US6927891B1 (en) 2002-12-23 2005-08-09 Silicon Light Machines Corporation Tilt-able grating plane for improved crosstalk in 1×N blaze switches
US7068372B1 (en) 2003-01-28 2006-06-27 Silicon Light Machines Corporation MEMS interferometer-based reconfigurable optical add-and-drop multiplexor
US7286764B1 (en) 2003-02-03 2007-10-23 Silicon Light Machines Corporation Reconfigurable modulator-based optical add-and-drop multiplexer
US6947613B1 (en) 2003-02-11 2005-09-20 Silicon Light Machines Corporation Wavelength selective switch and equalizer
US6922272B1 (en) 2003-02-14 2005-07-26 Silicon Light Machines Corporation Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices
US6922273B1 (en) 2003-02-28 2005-07-26 Silicon Light Machines Corporation PDL mitigation structure for diffractive MEMS and gratings
US7391973B1 (en) 2003-02-28 2008-06-24 Silicon Light Machines Corporation Two-stage gain equalizer
US6806997B1 (en) 2003-02-28 2004-10-19 Silicon Light Machines, Inc. Patterned diffractive light modulator ribbon for PDL reduction
US6829077B1 (en) 2003-02-28 2004-12-07 Silicon Light Machines, Inc. Diffractive light modulator with dynamically rotatable diffraction plane
US7027202B1 (en) 2003-02-28 2006-04-11 Silicon Light Machines Corp Silicon substrate as a light modulator sacrificial layer
US7042611B1 (en) 2003-03-03 2006-05-09 Silicon Light Machines Corporation Pre-deflected bias ribbons
ES2304613T3 (es) * 2003-06-27 2008-10-16 Asahi Glass Company Ltd. Metodo de limpieza/enjuagado.
JP2005101711A (ja) * 2003-09-22 2005-04-14 Renesas Technology Corp 固体撮像装置およびその製造方法
WO2005045895A2 (en) * 2003-10-28 2005-05-19 Sachem, Inc. Cleaning solutions and etchants and methods for using same
US6930367B2 (en) * 2003-10-31 2005-08-16 Robert Bosch Gmbh Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
US7071154B2 (en) * 2003-12-18 2006-07-04 3M Innovative Properties Company Azeotrope-like compositions and their use
US7514012B2 (en) * 2004-01-27 2009-04-07 Texas Instruments Incorporated Pre-oxidization of deformable elements of microstructures
JP2005217262A (ja) * 2004-01-30 2005-08-11 Matsushita Electric Ind Co Ltd 化合物半導体装置の製造方法
US8119537B2 (en) * 2004-09-02 2012-02-21 Micron Technology, Inc. Selective etching of oxides to metal nitrides and metal oxides
US20060054595A1 (en) * 2004-09-10 2006-03-16 Honeywell International Inc. Selective hafnium oxide etchant
US7394103B2 (en) * 2004-09-13 2008-07-01 Uchicago Argonne, Llc All diamond self-aligned thin film transistor
JP4559250B2 (ja) * 2005-02-16 2010-10-06 シチズンファインテックミヨタ株式会社 アクチュエータ、及びその製造方法
US7449355B2 (en) * 2005-04-27 2008-11-11 Robert Bosch Gmbh Anti-stiction technique for electromechanical systems and electromechanical device employing same
US7713885B2 (en) * 2005-05-11 2010-05-11 Micron Technology, Inc. Methods of etching oxide, reducing roughness, and forming capacitor constructions
US20070129273A1 (en) * 2005-12-07 2007-06-07 Clark Philip G In situ fluoride ion-generating compositions and uses thereof
US20070170528A1 (en) 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same
US7654010B2 (en) * 2006-02-23 2010-02-02 Tokyo Electron Limited Substrate processing system, substrate processing method, and storage medium
US8084367B2 (en) * 2006-05-24 2011-12-27 Samsung Electronics Co., Ltd Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods
DE102006030588A1 (de) * 2006-07-03 2008-01-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flüssigkeitsstrahlgeführtes Ätzverfahren zum Materialabtrag an Festkörpern sowie dessen Verwendung
JP2008066351A (ja) * 2006-09-05 2008-03-21 Dainippon Screen Mfg Co Ltd 基板処理装置
US20080125342A1 (en) * 2006-11-07 2008-05-29 Advanced Technology Materials, Inc. Formulations for cleaning memory device structures
JP4803821B2 (ja) 2007-03-23 2011-10-26 大日本スクリーン製造株式会社 基板処理装置
US20090029274A1 (en) * 2007-07-25 2009-01-29 3M Innovative Properties Company Method for removing contamination with fluorinated compositions
US20090253268A1 (en) * 2008-04-03 2009-10-08 Honeywell International, Inc. Post-contact opening etchants for post-contact etch cleans and methods for fabricating the same
JP5960439B2 (ja) * 2012-01-27 2016-08-02 スリーエム イノベイティブ プロパティズ カンパニー 除塵洗浄液およびそれを用いた洗浄方法
JP2016164977A (ja) * 2015-02-27 2016-09-08 キヤノン株式会社 ナノインプリント用液体材料、ナノインプリント用液体材料の製造方法、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、および電子部品の製造方法
US11361972B2 (en) * 2019-04-18 2022-06-14 Micron Technology, Inc. Methods for selectively removing more-doped-silicon-dioxide relative to less-doped-silicon-dioxide
WO2020216824A1 (en) 2019-04-24 2020-10-29 Evonik Operations Gmbh Liquid dispersion with enhanced thermal conductivity containing inorganic particles
JP7595585B2 (ja) * 2019-05-10 2024-12-06 スリーエム イノベイティブ プロパティズ カンパニー ハイドロフルオロチオエーテル及びその使用方法
WO2021144678A1 (en) * 2020-01-15 2021-07-22 3M Innovative Properties Company Hydrofluorethers and methods of using same
WO2025090723A1 (en) * 2023-10-25 2025-05-01 Versum Materials Us, Llc Hydrofluorocarbon compounds and their use in integrated circuit manufacturing processes

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1037857A (en) 1963-07-11 1966-08-03 Pennsalt Chemicals Corp Method and composition for cleaning resin coated substrates
DE1298514B (de) 1965-12-02 1969-07-03 Hoechst Ag Verfahren zur Herstellung von Perfluoralkyl-alkyl-aethern
FR2287432A1 (fr) 1974-10-10 1976-05-07 Poudres & Explosifs Ste Nale Nouveaux ethers fluores et leur procede de preparation
US4055458A (en) * 1975-08-07 1977-10-25 Bayer Aktiengesellschaft Etching glass with HF and fluorine-containing surfactant
JPS6039176A (ja) * 1983-08-10 1985-02-28 Daikin Ind Ltd エッチング剤組成物
JPS63283028A (ja) * 1986-09-29 1988-11-18 Hashimoto Kasei Kogyo Kk 微細加工表面処理剤
JP2999591B2 (ja) 1991-07-22 2000-01-17 徳三 助川 高純度の真性層を有するGaAs素子の製造方法
JPH0629235A (ja) * 1992-07-09 1994-02-04 Mitsubishi Electric Corp 半導体装置の製造方法
KR0170794B1 (ko) * 1993-02-04 1999-03-30 이노우에 노리유키 습윤성이 우수한 반도체용 웨트에칭 조성물
JP2589930B2 (ja) 1993-03-05 1997-03-12 工業技術院長 メチル 1,1,2,2,3,3−ヘキサフルオロプロピル エーテル及びその製造方法並びにこれを含有する洗浄剤
US5658962A (en) 1994-05-20 1997-08-19 Minnesota Mining And Manufacturing Company Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application
US5478436A (en) * 1994-12-27 1995-12-26 Motorola, Inc. Selective cleaning process for fabricating a semiconductor device
US5925611A (en) 1995-01-20 1999-07-20 Minnesota Mining And Manufacturing Company Cleaning process and composition
US5571447A (en) * 1995-03-20 1996-11-05 Ashland Inc. Stripping and cleaning composition
US5603750A (en) 1995-08-14 1997-02-18 Minnesota Mining And Manufacturing Company Fluorocarbon fluids as gas carriers to aid in precious and base metal heap leaching operations
US5750797A (en) 1996-04-15 1998-05-12 Minnesota Mining And Manufacturing Company Process for the production of hydrofluoroethers
US6001796A (en) 1996-07-03 1999-12-14 Alliedsignal Inc. Azeotrope-like compositions of 1,1,1,3,3-pentafluoropropane and hydrogen fluoride
CN1125963C (zh) 1997-09-23 2003-10-29 格雷·W·费雷尔 改进的化学干燥和净化系统
FR2768717B1 (fr) 1997-09-24 1999-11-12 Solvay Procede de separation de fluorure d'hydrogene de ses melanges avec un hydrofluoroalcane contenant de 3 a 6 atomes de carbone
US6046368A (en) 1998-03-17 2000-04-04 3M Innovative Properties Company Catalytic process for making hydrofluoroethers
JPH11340183A (ja) * 1998-05-27 1999-12-10 Morita Kagaku Kogyo Kk 半導体装置用洗浄液およびそれを用いた半導体装置の製 造方法
JP4107720B2 (ja) * 1998-07-07 2008-06-25 スリーエム カンパニー 半導体製造装置における汚染物の洗浄方法
US6310018B1 (en) * 2000-03-31 2001-10-30 3M Innovative Properties Company Fluorinated solvent compositions containing hydrogen fluoride

Also Published As

Publication number Publication date
US6492309B1 (en) 2002-12-10
KR20030007484A (ko) 2003-01-23
KR100785131B1 (ko) 2007-12-11
AU2000259171A1 (en) 2001-10-15
EP1269527A1 (en) 2003-01-02
WO2001075955A1 (en) 2001-10-11
JP2003529675A (ja) 2003-10-07
US6310018B1 (en) 2001-10-30
JP4786111B2 (ja) 2011-10-05

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