KR20060133018A - 기밀 가장자리를 갖는 유기 전자 패키지 및 이러한패키지의 제조방법 - Google Patents

기밀 가장자리를 갖는 유기 전자 패키지 및 이러한패키지의 제조방법 Download PDF

Info

Publication number
KR20060133018A
KR20060133018A KR1020067021441A KR20067021441A KR20060133018A KR 20060133018 A KR20060133018 A KR 20060133018A KR 1020067021441 A KR1020067021441 A KR 1020067021441A KR 20067021441 A KR20067021441 A KR 20067021441A KR 20060133018 A KR20060133018 A KR 20060133018A
Authority
KR
South Korea
Prior art keywords
package
barrier coating
transparent film
bonded
organic electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020067021441A
Other languages
English (en)
Korean (ko)
Inventor
마르크 샤에프켄즈
아닐 듀갈
크리스챤 엠 헬러
Original Assignee
제너럴 일렉트릭 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제너럴 일렉트릭 캄파니 filed Critical 제너럴 일렉트릭 캄파니
Publication of KR20060133018A publication Critical patent/KR20060133018A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Packages (AREA)
KR1020067021441A 2004-04-02 2005-03-01 기밀 가장자리를 갖는 유기 전자 패키지 및 이러한패키지의 제조방법 Ceased KR20060133018A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/817,531 US8405193B2 (en) 2004-04-02 2004-04-02 Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
US10/817,531 2004-04-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020117022629A Division KR101194612B1 (ko) 2004-04-02 2005-03-01 기밀하게 밀봉된 가장자리를 갖는 유기 전자 패키지

Publications (1)

Publication Number Publication Date
KR20060133018A true KR20060133018A (ko) 2006-12-22

Family

ID=34961188

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020067021441A Ceased KR20060133018A (ko) 2004-04-02 2005-03-01 기밀 가장자리를 갖는 유기 전자 패키지 및 이러한패키지의 제조방법
KR1020117022629A Expired - Fee Related KR101194612B1 (ko) 2004-04-02 2005-03-01 기밀하게 밀봉된 가장자리를 갖는 유기 전자 패키지

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020117022629A Expired - Fee Related KR101194612B1 (ko) 2004-04-02 2005-03-01 기밀하게 밀봉된 가장자리를 갖는 유기 전자 패키지

Country Status (6)

Country Link
US (2) US8405193B2 (https=)
JP (1) JP5198058B2 (https=)
KR (2) KR20060133018A (https=)
CN (1) CN1957485B (https=)
TW (1) TWI430454B (https=)
WO (1) WO2005104266A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101443369B1 (ko) * 2007-02-12 2014-09-26 엘지디스플레이 주식회사 표시 기판 모듈 및 이를 이용한 표시장치의 제조 방법
KR20170141751A (ko) * 2015-04-29 2017-12-26 사빅 글로벌 테크놀러지스 비.브이. Ｏｌｅｄ 조명 애플리케이션을 위한 엔캡슐레이션 방법

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7541671B2 (en) * 2005-03-31 2009-06-02 General Electric Company Organic electronic devices having external barrier layer
US20060278965A1 (en) * 2005-06-10 2006-12-14 Foust Donald F Hermetically sealed package and methods of making the same
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
TWI286797B (en) * 2006-01-18 2007-09-11 Touch Micro System Tech Method of wafer level packaging and cutting
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR101298025B1 (ko) * 2006-09-25 2013-08-26 엘지디스플레이 주식회사 렌티큘러방식 입체영상표시장치의 제조방법.
JP2008103254A (ja) * 2006-10-20 2008-05-01 Tokai Rubber Ind Ltd 有機ｅｌデバイス
US20080102223A1 (en) * 2006-11-01 2008-05-01 Sigurd Wagner Hybrid layers for use in coatings on electronic devices or other articles
US20080138624A1 (en) * 2006-12-06 2008-06-12 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
US20080138538A1 (en) * 2006-12-06 2008-06-12 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
US7781031B2 (en) * 2006-12-06 2010-08-24 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
US7667285B2 (en) * 2006-12-14 2010-02-23 Motorola, Inc. Printed electronic substrate havine photochromic barrier layer
US7929106B2 (en) * 2007-12-13 2011-04-19 3M Innovative Properties Company Liquid crystal display comprising a void region and method of manufacturing same
WO2009136305A1 (en) * 2008-05-06 2009-11-12 Koninklijke Philips Electronics N.V. Reelable oled curtain
WO2010011390A2 (en) * 2008-05-07 2010-01-28 The Trustees Of Princeton University Hybrid layers for use in coatings on electronic devices or other articles
US7976908B2 (en) * 2008-05-16 2011-07-12 General Electric Company High throughput processes and systems for barrier film deposition and/or encapsulation of optoelectronic devices
US20090284158A1 (en) * 2008-05-16 2009-11-19 General Electric Company Organic light emitting device based lighting for low cost, flexible large area signage
WO2009152275A1 (en) 2008-06-11 2009-12-17 Plextronics, Inc. Encapsulation for organic optoelectronic devices
JP2010044937A (ja) * 2008-08-12 2010-02-25 Tohcello Co Ltd テープ状の密封材および有機ｅｌデバイス
US8022623B2 (en) * 2008-08-15 2011-09-20 General Electric Company Ultra-thin multi-substrate color tunable OLED device
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
EP2202819A1 (en) 2008-12-29 2010-06-30 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Electro-optic device and method for manufacturing the same
US20100167002A1 (en) * 2008-12-30 2010-07-01 Vitex Systems, Inc. Method for encapsulating environmentally sensitive devices
US7948178B2 (en) * 2009-03-04 2011-05-24 Global Oled Technology Llc Hermetic seal
US8405116B2 (en) 2009-03-18 2013-03-26 Semiconductor Energy Laboratory Co., Ltd. Lighting device
TWI389271B (zh) 2009-04-10 2013-03-11 財團法人工業技術研究院 環境敏感電子元件之封裝體及其封裝方法
KR101621300B1 (ko) 2009-09-16 2016-05-17 엘지디스플레이 주식회사 유기전계발광소자의 제조방법
US8753711B2 (en) * 2009-12-18 2014-06-17 General Electric Company Edge sealing method using barrier coatings
JP5611811B2 (ja) * 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体及びこれを含む表示装置
JP5611812B2 (ja) * 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体、これを含む表示装置及び表示装置の製造方法
JP5290268B2 (ja) * 2009-12-31 2013-09-18 三星ディスプレイ株式會社 バリア・フィルム複合体、これを含む表示装置、バリア・フィルム複合体の製造方法、及びこれを含む表示装置の製造方法
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
EP2363905A1 (en) 2010-03-05 2011-09-07 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electrical device and method for manufacturing thereof
EP2383817A1 (en) * 2010-04-29 2011-11-02 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Light-emitting device and method for manufacturing the same
US8618731B2 (en) * 2010-05-18 2013-12-31 General Electric Company Large-area flexible OLED light source
TWI443784B (zh) 2010-07-29 2014-07-01 財團法人工業技術研究院 環境敏感電子元件之封裝體及其封裝方法
US9935289B2 (en) 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof
KR101266103B1 (ko) * 2010-09-29 2013-05-27 엘지전자 주식회사 태양 전지 모듈 및 그 제조 방법
KR20120066352A (ko) * 2010-12-14 2012-06-22 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 이의 제조 방법
US8692457B2 (en) 2010-12-20 2014-04-08 General Electric Company Large area light emitting electrical package with current spreading bus
KR20140048309A (ko) * 2011-08-04 2014-04-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 배리어 조립체
US20140230892A1 (en) * 2011-08-04 2014-08-21 3M Innovative Properties Company Edge protected barrier assemblies
KR101911581B1 (ko) * 2011-08-04 2018-10-24 쓰리엠 이노베이티브 프로퍼티즈 컴파니 에지 보호된 배리어 조립체
JP6228116B2 (ja) * 2011-08-04 2017-11-08 スリーエム イノベイティブ プロパティズ カンパニー 縁部保護バリアアセンブリ
CN103718649A (zh) * 2011-08-04 2014-04-09 3M创新有限公司 边缘受保护的阻隔组件
JP6362330B2 (ja) * 2011-11-14 2018-07-25 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子、及び、面状発光体
KR20130065219A (ko) * 2011-12-09 2013-06-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
EP2819555B1 (en) * 2012-03-01 2017-05-03 3M Innovative Properties Company Continuous edge protected barrier assemblies
JP2013219184A (ja) * 2012-04-09 2013-10-24 Sumitomo Chemical Co Ltd 照明パネル及びこれを備えた照明装置
EP2685515A1 (en) * 2012-07-12 2014-01-15 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and system for dividing a barrier foil
KR102161078B1 (ko) * 2012-08-28 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 그 제작 방법
CN103794733A (zh) 2012-10-31 2014-05-14 财团法人工业技术研究院 环境敏感电子元件封装体
KR101420332B1 (ko) * 2012-11-14 2014-07-16 삼성디스플레이 주식회사 유기 발광 디스플레이 장치
US8829507B2 (en) 2012-12-06 2014-09-09 General Electric Company Sealed organic opto-electronic devices and related methods of manufacturing
CN103855105B (zh) 2012-12-06 2017-04-26 财团法人工业技术研究院 环境敏感电子元件封装体及其制作方法
TWI497655B (zh) 2012-12-14 2015-08-21 財團法人工業技術研究院 環境敏感電子元件封裝體及其製作方法
WO2014097387A1 (ja) 2012-12-18 2014-06-26 パイオニア株式会社 発光装置
US9847512B2 (en) 2012-12-22 2017-12-19 Industrial Technology Research Institute Electronic device package structure and manufacturing method thereof
TWI552331B (zh) * 2013-01-11 2016-10-01 財團法人工業技術研究院 電子元件之封裝結構
KR102103421B1 (ko) 2013-02-07 2020-04-23 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
CN104051357B (zh) 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
KR20140119583A (ko) * 2013-04-01 2014-10-10 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20240067959A (ko) * 2013-04-15 2024-05-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치
CN104124347A (zh) * 2013-04-28 2014-10-29 海洋王照明科技股份有限公司 柔性有机电致发光器件及其制备方法
TW201943069A (zh) 2013-09-06 2019-11-01 日商半導體能源研究所股份有限公司 發光裝置以及發光裝置的製造方法
CN103500800A (zh) * 2013-09-27 2014-01-08 京东方科技集团股份有限公司 显示面板、显示装置及显示面板的制作方法
US10008689B2 (en) 2013-09-27 2018-06-26 Boe Technology Group Co., Ltd. Display panel, display device and method of manufacturing display panel
CN103490019B (zh) * 2013-09-29 2016-02-17 京东方科技集团股份有限公司 有机电致发光器件的封装结构及封装方法、显示装置
KR101642589B1 (ko) 2013-09-30 2016-07-29 주식회사 엘지화학 유기전자소자용 기판 및 이의 제조방법
CN103560209A (zh) * 2013-10-12 2014-02-05 深圳市华星光电技术有限公司 有机发光二极管装置以及其制造方法
KR102212764B1 (ko) * 2013-10-15 2021-02-08 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
CN104637886B (zh) 2013-11-12 2017-09-22 财团法人工业技术研究院 折叠式封装结构
DE102013226280A1 (de) 2013-12-17 2015-06-18 Belectric Opv Gmbh Organisches Photovoltaikelement, sowie Verfahren zur Herstellung eines solchen
CN104157705B (zh) 2014-08-05 2017-08-04 京东方科技集团股份有限公司 一种阻隔膜层、具其的光电器件及光电器件的制作方法
US10244603B2 (en) 2014-09-03 2019-03-26 Lg Display Co., Ltd. OLED stand
WO2016059514A1 (en) 2014-10-17 2016-04-21 Semiconductor Energy Laboratory Co., Ltd. Electronic device
KR102439040B1 (ko) * 2014-12-01 2022-09-01 엘지디스플레이 주식회사 유기 발광 디스플레이 장치 및 이를 포함하는 롤러블 유기 발광 디스플레이 시스템
CN104538556B (zh) * 2014-12-03 2017-01-25 深圳市华星光电技术有限公司 柔性oled衬底及柔性oled封装方法
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member
JP6383682B2 (ja) * 2015-02-26 2018-08-29 富士フイルム株式会社 有機エレクトロルミネッセンス装置
CN104993063A (zh) 2015-07-17 2015-10-21 京东方科技集团股份有限公司 一种封装件及其制作方法、oled装置
KR20170035055A (ko) * 2015-09-22 2017-03-30 코오롱인더스트리 주식회사 유연소자, 이의 제조방법 및 이의 제조장치
WO2018085715A2 (en) * 2016-11-06 2018-05-11 Orbotech LT Solar, LLC. Method and apparatus for encapsulation of an organic light emitting diode
FR3061404B1 (fr) * 2016-12-27 2022-09-23 Packaging Sip Procede de fabrication collective de modules electroniques hermetiques
CN108735913A (zh) * 2017-04-25 2018-11-02 群创光电股份有限公司 显示设备
US20180319131A1 (en) * 2017-05-03 2018-11-08 Switch Materials Inc. Packaged film assembly for lamination between substrates
CN111418265B (zh) * 2017-12-07 2023-06-16 索尼公司 显示装置
KR102480840B1 (ko) 2018-01-31 2022-12-26 삼성디스플레이 주식회사 플렉서블 표시 장치 및 플렉서블 표시 장치의 제조 방법
CN108428804A (zh) * 2018-04-19 2018-08-21 武汉华星光电技术有限公司 Oled显示面板及其封装方法
CN109346623B (zh) * 2018-11-14 2020-12-29 信利（惠州）智能显示有限公司 Amoled显示产品封边方法、封边结构及显示产品
CN111200879B (zh) * 2018-11-16 2022-02-01 财团法人工业技术研究院 加热器封装体
EP3955328B1 (en) * 2019-04-11 2024-01-03 Panasonic Intellectual Property Management Co., Ltd. Solar cell module
CN112509992B (zh) * 2020-11-30 2024-07-02 武汉天马微电子有限公司 一种显示面板、电子设备以及显示面板的制作方法
CN115509054B (zh) * 2021-06-07 2025-06-10 深圳市光羿科技有限公司 一种电致变色器件及其制备方法和应用
CN118696269A (zh) * 2022-02-25 2024-09-24 伊英克公司 具有边缘密封部件的电光显示器及其制造方法
WO2025259973A2 (en) 2024-06-14 2025-12-18 Materion Corporation Matrix of lid assemblies for electronic packages
WO2026077988A1 (en) * 2024-10-09 2026-04-16 Flexotronix Limited A device, a patch for a medical device, a medical device, and manufacturing methods thereof

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4352844A (en) * 1981-05-29 1982-10-05 W. R. Grace & Co. Thermoplastic film having improved handling and sealing characteristics and receptacle formed therefrom
JPH05242966A (ja) 1992-02-26 1993-09-21 Nec Kansai Ltd 電界発光灯及びその製造方法
US6704133B2 (en) * 1998-03-18 2004-03-09 E-Ink Corporation Electro-optic display overlays and systems for addressing such displays
US6081071A (en) * 1998-05-18 2000-06-27 Motorola, Inc. Electroluminescent apparatus and methods of manufacturing and encapsulating
US6080031A (en) * 1998-09-02 2000-06-27 Motorola, Inc. Methods of encapsulating electroluminescent apparatus
US6573652B1 (en) * 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US7112115B1 (en) * 1999-11-09 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing the same
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6537688B2 (en) * 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
US6576351B2 (en) * 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6624568B2 (en) * 2001-03-28 2003-09-23 Universal Display Corporation Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
US6856086B2 (en) * 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
US6692610B2 (en) * 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
US6737753B2 (en) * 2001-09-28 2004-05-18 Osram Opto Semiconductor Gmbh Barrier stack
US6655788B1 (en) * 2002-05-17 2003-12-02 Viztec Inc. Composite structure for enhanced flexibility of electro-optic displays with sliding layers
US7649674B2 (en) * 2002-06-10 2010-01-19 E Ink Corporation Electro-optic display with edge seal
CN1176565C (zh) * 2002-11-25 2004-11-17 清华大学 一种有机电致发光器件的封装层及其制备方法和应用
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7648925B2 (en) * 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
JP4342870B2 (ja) * 2003-08-11 2009-10-14 株式会社 日立ディスプレイズ 有機ｅｌ表示装置
KR100551121B1 (ko) * 2003-10-21 2006-02-13 엘지전자 주식회사 일렉트로 루미네센스 표시장치
US7541671B2 (en) * 2005-03-31 2009-06-02 General Electric Company Organic electronic devices having external barrier layer
US20060278965A1 (en) * 2005-06-10 2006-12-14 Foust Donald F Hermetically sealed package and methods of making the same
KR100719554B1 (ko) * 2005-07-06 2007-05-17 삼성에스디아이 주식회사 평판 디스플레이 장치 및 그 제조방법
TWI389271B (zh) * 2009-04-10 2013-03-11 財團法人工業技術研究院 環境敏感電子元件之封裝體及其封裝方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101443369B1 (ko) * 2007-02-12 2014-09-26 엘지디스플레이 주식회사 표시 기판 모듈 및 이를 이용한 표시장치의 제조 방법
KR20170141751A (ko) * 2015-04-29 2017-12-26 사빅 글로벌 테크놀러지스 비.브이. Ｏｌｅｄ 조명 애플리케이션을 위한 엔캡슐레이션 방법

Also Published As

Publication number Publication date
JP2007531238A (ja) 2007-11-01
WO2005104266A1 (en) 2005-11-03
TWI430454B (zh) 2014-03-11
TW200603416A (en) 2006-01-16
KR101194612B1 (ko) 2012-10-25
JP5198058B2 (ja) 2013-05-15
KR20110124327A (ko) 2011-11-16
US8633574B2 (en) 2014-01-21
US8405193B2 (en) 2013-03-26
US20130248828A1 (en) 2013-09-26
US20050224935A1 (en) 2005-10-13
CN1957485A (zh) 2007-05-02
CN1957485B (zh) 2010-09-01

Similar Documents

Publication Publication Date Title
KR101194612B1 (ko) 기밀하게 밀봉된 가장자리를 갖는 유기 전자 패키지
JP5143728B2 (ja) 気密封止パッケージ
KR101261654B1 (ko) 외부 차단벽 층을 갖는 유기 전자 디바이스
US8350470B2 (en) Encapsulation structures of organic electroluminescence devices
US6614057B2 (en) Sealed organic optoelectronic structures
US6835950B2 (en) Organic electronic devices with pressure sensitive adhesive layer
US7187119B2 (en) Methods and structures for reducing lateral diffusion through cooperative barrier layers
EP2374173B1 (en) Method for encapsulating environmentally sensitive devices
JP5313328B2 (ja) 気密シールパーケージ用のゲッタ前駆体
KR20050047539A (ko) 점차 변화되는 조성을 갖는 확산 차단 코팅 및 이를 포함하는 소자
JP2005235743A (ja) 拡散障壁を有する複合材物品及び該物品を組み込んだ素子

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20061016

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20100226

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20110527

Patent event code: PE09021S01D

A107 Divisional application of patent
AMND Amendment
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20110927

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20120220

Patent event code: PE09021S02D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20130130

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20120220

Comment text: Final Notice of Reason for Refusal

Patent event code: PE06011S02I

Patent event date: 20110527

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 20130502

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20130130

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Appeal identifier: 2013101003370

Request date: 20130502

AMND Amendment
PB0901 Examination by re-examination before a trial

Comment text: Amendment to Specification, etc.

Patent event date: 20130603

Patent event code: PB09011R02I

Comment text: Request for Trial against Decision on Refusal

Patent event date: 20130502

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20110927

Patent event code: PB09011R02I

Comment text: Amendment to Specification, etc.

Patent event date: 20100226

Patent event code: PB09011R02I

B601 Maintenance of original decision after re-examination before a trial
PB0601 Maintenance of original decision after re-examination before a trial

Comment text: Report of Result of Re-examination before a Trial

Patent event code: PB06011S01D

Patent event date: 20130702

J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20130502

Effective date: 20140530

PJ1301 Trial decision

Patent event code: PJ13011S01D

Patent event date: 20140530

Comment text: Trial Decision on Objection to Decision on Refusal

Appeal kind category: Appeal against decision to decline refusal

Request date: 20130502

Decision date: 20140530

Appeal identifier: 2013101003370