KR20060067878A - 전자 장치의 열 전도부로 유용한 고 기계적 신장율을가지는 열 전도성 폴리이미드 필름 복합체 - Google Patents
전자 장치의 열 전도부로 유용한 고 기계적 신장율을가지는 열 전도성 폴리이미드 필름 복합체 Download PDFInfo
- Publication number
- KR20060067878A KR20060067878A KR1020050123050A KR20050123050A KR20060067878A KR 20060067878 A KR20060067878 A KR 20060067878A KR 1020050123050 A KR1020050123050 A KR 1020050123050A KR 20050123050 A KR20050123050 A KR 20050123050A KR 20060067878 A KR20060067878 A KR 20060067878A
- Authority
- KR
- South Korea
- Prior art keywords
- polyimide
- film
- diamine
- bis
- film composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 172
- 239000002131 composite material Substances 0.000 title claims abstract description 92
- 239000002470 thermal conductor Substances 0.000 title 1
- 239000004642 Polyimide Substances 0.000 claims abstract description 113
- 150000004985 diamines Chemical class 0.000 claims abstract description 105
- -1 polysiloxane Polymers 0.000 claims abstract description 96
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 74
- 229910052751 metal Inorganic materials 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 65
- 239000002245 particle Substances 0.000 claims abstract description 41
- 239000011231 conductive filler Substances 0.000 claims abstract description 22
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 62
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 58
- 239000000945 filler Substances 0.000 claims description 50
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 25
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 25
- 229910052582 BN Inorganic materials 0.000 claims description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 20
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 18
- 229910021485 fumed silica Inorganic materials 0.000 claims description 15
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 13
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims description 10
- 150000004984 aromatic diamines Chemical class 0.000 claims description 8
- 230000009477 glass transition Effects 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 6
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims description 5
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical group C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 claims description 3
- 235000019739 Dicalciumphosphate Nutrition 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 3
- 239000001506 calcium phosphate Substances 0.000 claims description 3
- NEFBYIFKOOEVPA-UHFFFAOYSA-K dicalcium phosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])([O-])=O NEFBYIFKOOEVPA-UHFFFAOYSA-K 0.000 claims description 3
- 229940038472 dicalcium phosphate Drugs 0.000 claims description 3
- 229910000390 dicalcium phosphate Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 2
- BZXJAHGHOJFYRT-UHFFFAOYSA-N 3-[2-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C(=CC=CC=2)OC=2C=C(N)C=CC=2)=C1 BZXJAHGHOJFYRT-UHFFFAOYSA-N 0.000 claims description 2
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims description 2
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 claims description 2
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 claims description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 2
- RYYUUQPLFHRZOY-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1OC1=CC=C(N)C=C1 RYYUUQPLFHRZOY-UHFFFAOYSA-N 0.000 claims description 2
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 claims description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 claims description 2
- MQAHXEQUBNDFGI-UHFFFAOYSA-N 5-[4-[2-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenyl]propan-2-yl]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)C(C)(C=2C=CC(OC=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)C)=C1 MQAHXEQUBNDFGI-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 239000002243 precursor Substances 0.000 abstract description 10
- 238000003475 lamination Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 135
- 229920005575 poly(amic acid) Polymers 0.000 description 126
- 239000002253 acid Substances 0.000 description 49
- 239000006185 dispersion Substances 0.000 description 49
- 229920000642 polymer Polymers 0.000 description 45
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 42
- 239000002904 solvent Substances 0.000 description 40
- 239000007787 solid Substances 0.000 description 33
- 239000011230 binding agent Substances 0.000 description 28
- 239000010410 layer Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 25
- 238000010438 heat treatment Methods 0.000 description 22
- 239000000843 powder Substances 0.000 description 22
- 239000000178 monomer Substances 0.000 description 21
- 238000005266 casting Methods 0.000 description 19
- 238000011068 loading method Methods 0.000 description 18
- 150000004706 metal oxides Chemical class 0.000 description 16
- 238000003756 stirring Methods 0.000 description 16
- 229910044991 metal oxide Inorganic materials 0.000 description 15
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 14
- 238000012545 processing Methods 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
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- 150000002739 metals Chemical class 0.000 description 8
- 239000002002 slurry Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 125000006159 dianhydride group Chemical group 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
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- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- LUEGQDUCMILDOJ-UHFFFAOYSA-N thiophene-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C=1SC(C(O)=O)=C(C(O)=O)C=1C(O)=O LUEGQDUCMILDOJ-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
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- B32B2264/102—Oxide or hydroxide
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- B32—LAYERED PRODUCTS
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- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
- B32B2605/08—Cars
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/012,475 | 2004-12-15 | ||
| US11/012,475 US20060124693A1 (en) | 2004-12-15 | 2004-12-15 | Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20060067878A true KR20060067878A (ko) | 2006-06-20 |
Family
ID=35585001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050123050A Withdrawn KR20060067878A (ko) | 2004-12-15 | 2005-12-14 | 전자 장치의 열 전도부로 유용한 고 기계적 신장율을가지는 열 전도성 폴리이미드 필름 복합체 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060124693A1 (enExample) |
| EP (1) | EP1672008A1 (enExample) |
| JP (1) | JP2006169533A (enExample) |
| KR (1) | KR20060067878A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101292993B1 (ko) * | 2007-11-20 | 2013-08-02 | 코오롱인더스트리 주식회사 | 폴리이미드 수지와 이를 이용한 액정 배향막 및 필름 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI417418B (zh) * | 2005-04-28 | 2013-12-01 | Kaneka Corp | 鍍敷用材料及其利用 |
| US20070232734A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto |
| US20070231588A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Capacitive polyimide laminate |
| TW200909201A (en) * | 2007-08-31 | 2009-03-01 | Mortech Corp | Metal clad laminate and the manufacturing method thereof |
| TWI454375B (zh) * | 2008-03-06 | 2014-10-01 | Nippon Steel & Sumikin Chem Co | Laminates for flexible substrates and thermally conductive polyimide films |
| EP2325000B1 (en) * | 2008-09-08 | 2013-05-29 | Nippon Steel & Sumikin Chemical Co., Ltd. | Highly heat conductive polyimide film, highly heat conductive metal-clad laminate and method for producing same |
| JP5344880B2 (ja) * | 2008-10-01 | 2013-11-20 | 三井化学株式会社 | 接着樹脂組成物、およびそれを含む積層体 |
| US20100143706A1 (en) * | 2008-12-09 | 2010-06-10 | Mortech Corporation | Polyimide laminate and a method of fabricating the same |
| KR101064816B1 (ko) * | 2009-04-03 | 2011-09-14 | 주식회사 두산 | 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판 |
| JP5740834B2 (ja) | 2009-05-11 | 2015-07-01 | 三菱化学株式会社 | 液晶性ポリイミド、及びこれを含有する液晶性樹脂組成物、並びに半導体素子用樹脂膜 |
| JP5562334B2 (ja) * | 2009-07-03 | 2014-07-30 | 三井化学株式会社 | 樹脂組成物、それを含む積層体、半導体装置およびフィルム |
| CN102152539B (zh) * | 2010-11-11 | 2013-08-14 | 广东生益科技股份有限公司 | 铝基覆铜板的连续化生产方法及其连续化生产线 |
| CN102673047A (zh) * | 2012-05-28 | 2012-09-19 | 珠海亚泰电子科技有限公司 | 导热无卤无胶覆铜箔的制作方法 |
| CN102806722A (zh) * | 2012-08-06 | 2012-12-05 | 广东生益科技股份有限公司 | 二层法单面挠性覆铜板 |
| CN102774077B (zh) * | 2012-08-06 | 2016-02-17 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板及其制作方法 |
| TWI490274B (zh) * | 2014-10-29 | 2015-07-01 | Mortech Corp | 聚醯亞胺基聚合物、應用聚醯亞胺基聚合物之聚醯亞胺膜與應用聚醯亞胺基聚合物之聚醯亞胺積層板 |
| US11046051B2 (en) * | 2015-12-01 | 2021-06-29 | Materion Corporation | Metal-on-ceramic substrates |
| TWI618980B (zh) * | 2017-06-30 | 2018-03-21 | 律勝科技股份有限公司 | 導熱型感光性樹脂 |
| TWI618979B (zh) * | 2017-06-30 | 2018-03-21 | 律勝科技股份有限公司 | 導熱型聚醯亞胺基板 |
| DE102018202058A1 (de) * | 2018-02-09 | 2019-08-14 | Siemens Aktiengesellschaft | Formulierung zur Herstellung eines Isolationssystems, elektrische Maschine und Verfahren zur Herstellung eines Isolationssystems |
| CN110452418B (zh) * | 2019-09-25 | 2021-03-02 | 桂林电子科技大学 | 一种核壳结构导热填料制备的高导热聚酰亚胺薄膜及其制备方法 |
| CN113264770B (zh) * | 2021-05-27 | 2022-11-11 | 沈阳化工大学 | 一种抗弯折MXene/碳复合材料散热膜制备方法 |
| CN113621155B (zh) * | 2021-09-02 | 2023-04-18 | 大同共聚(西安)科技有限公司 | 一种纳米-微米氮化硼/聚酰亚胺复合材料的制备方法 |
| CN114381040A (zh) * | 2022-01-26 | 2022-04-22 | 四川轻化工大学 | 一种高介电常数聚酰亚胺复合薄膜及其制备方法 |
| CN116423598B (zh) * | 2023-05-31 | 2024-06-11 | 东北林业大学 | 一种木芯聚酰亚胺壳层复合材料的制备方法 |
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| US3496139A (en) * | 1966-12-20 | 1970-02-17 | Gen Electric | Epoxy resins with reaction product of a polysiloxane and an amine |
| US3803085A (en) * | 1972-12-29 | 1974-04-09 | Gen Electric | Method for making polyetherimides |
| US4040874A (en) * | 1975-08-04 | 1977-08-09 | General Electric Company | Semiconductor element having a polymeric protective coating and glass coating overlay |
| US4447670A (en) * | 1982-04-09 | 1984-05-08 | Westinghouse Electric Corp. | High-current cryogenic leads |
| US4574879A (en) * | 1984-02-29 | 1986-03-11 | The Bergquist Company | Mounting pad for solid-state devices |
| US4810563A (en) * | 1986-03-14 | 1989-03-07 | The Bergquist Company | Thermally conductive, electrically insulative laminate |
| US4808686A (en) * | 1987-06-18 | 1989-02-28 | General Electric Company | Silicone-polyimides, and method for making |
| US5208031A (en) * | 1989-06-06 | 1993-05-04 | Kelly Patrick D | Sexual lubricants containing zinc as an anti-viral agent |
| JPH0832591B2 (ja) * | 1989-10-11 | 1996-03-29 | 日本ピラー工業株式会社 | 複合材 |
| US5260413A (en) * | 1990-02-05 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Coated, heat-sealable aromatic polyimide film having superior compressive strength |
| EP0474054B1 (en) * | 1990-08-27 | 1995-12-06 | E.I. Du Pont De Nemours And Company | Flexible multi-layer polyimide film laminates and preparation thereof |
| US5331040A (en) * | 1992-10-26 | 1994-07-19 | E. I. Du Pont De Nemours And Company | Adhesive composition with functional filler |
| US5302652A (en) * | 1992-12-15 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Process for preparing a pigmented polyimide shaped article |
| WO1997001437A1 (en) * | 1995-06-28 | 1997-01-16 | Fraivillig Materials Company | Circuit board laminates and method of making |
| US5893498A (en) * | 1997-12-17 | 1999-04-13 | Aronson; Gina E. | Socket retaining utility belt |
| KR100256957B1 (ko) * | 1997-12-26 | 2000-05-15 | 윤종용 | 코드분할 다중접속 시스템에서 동일셀내 주파수간 하드핸드오프 방법 |
| US6207364B1 (en) * | 1998-04-21 | 2001-03-27 | Konica Corporation | Thermally developable material |
| US20020092163A1 (en) * | 1999-01-05 | 2002-07-18 | James Fraivillig | Mounting a flexible printed circuit to a heat sink |
| US6710456B1 (en) * | 2000-08-31 | 2004-03-23 | Micron Technology, Inc. | Composite interposer for BGA packages |
| JP3895125B2 (ja) * | 2001-04-12 | 2007-03-22 | 日東電工株式会社 | 補強板付フレキシブルプリント回路板 |
| US6410971B1 (en) * | 2001-07-12 | 2002-06-25 | Ferrotec (Usa) Corporation | Thermoelectric module with thin film substrates |
-
2004
- 2004-12-15 US US11/012,475 patent/US20060124693A1/en not_active Abandoned
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2005
- 2005-10-31 EP EP05023744A patent/EP1672008A1/en not_active Withdrawn
- 2005-12-14 KR KR1020050123050A patent/KR20060067878A/ko not_active Withdrawn
- 2005-12-15 JP JP2005362032A patent/JP2006169533A/ja not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101292993B1 (ko) * | 2007-11-20 | 2013-08-02 | 코오롱인더스트리 주식회사 | 폴리이미드 수지와 이를 이용한 액정 배향막 및 필름 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1672008A1 (en) | 2006-06-21 |
| JP2006169533A (ja) | 2006-06-29 |
| US20060124693A1 (en) | 2006-06-15 |
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