JP2006169533A - 電子デバイスの熱伝導部分として有用な、大きな機械的伸びを有する熱伝導性ポリイミドフィルム複合材料 - Google Patents
電子デバイスの熱伝導部分として有用な、大きな機械的伸びを有する熱伝導性ポリイミドフィルム複合材料 Download PDFInfo
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- JP2006169533A JP2006169533A JP2005362032A JP2005362032A JP2006169533A JP 2006169533 A JP2006169533 A JP 2006169533A JP 2005362032 A JP2005362032 A JP 2005362032A JP 2005362032 A JP2005362032 A JP 2005362032A JP 2006169533 A JP2006169533 A JP 2006169533A
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- Prior art keywords
- film
- polyimide
- film composite
- composite material
- diamine
- Prior art date
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 159
- 239000002131 composite material Substances 0.000 title claims abstract description 97
- 239000004642 Polyimide Substances 0.000 claims abstract description 113
- 229910052751 metal Inorganic materials 0.000 claims abstract description 67
- 239000002184 metal Substances 0.000 claims abstract description 67
- 239000002245 particle Substances 0.000 claims abstract description 40
- 239000011231 conductive filler Substances 0.000 claims abstract description 21
- 150000004985 diamines Chemical class 0.000 claims description 96
- -1 aliphatic diamines Chemical class 0.000 claims description 89
- 229920001296 polysiloxane Polymers 0.000 claims description 65
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 57
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 55
- 239000000945 filler Substances 0.000 claims description 53
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 22
- 229910052582 BN Inorganic materials 0.000 claims description 20
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 18
- 229910021485 fumed silica Inorganic materials 0.000 claims description 13
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 11
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims description 10
- 230000009477 glass transition Effects 0.000 claims description 8
- 150000004984 aromatic diamines Chemical class 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 6
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims description 5
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical group C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 claims description 3
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 claims description 3
- 235000019739 Dicalciumphosphate Nutrition 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 3
- 239000001506 calcium phosphate Substances 0.000 claims description 3
- NEFBYIFKOOEVPA-UHFFFAOYSA-K dicalcium phosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])([O-])=O NEFBYIFKOOEVPA-UHFFFAOYSA-K 0.000 claims description 3
- 229940038472 dicalcium phosphate Drugs 0.000 claims description 3
- 229910000390 dicalcium phosphate Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 2
- BZXJAHGHOJFYRT-UHFFFAOYSA-N 3-[2-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C(=CC=CC=2)OC=2C=C(N)C=CC=2)=C1 BZXJAHGHOJFYRT-UHFFFAOYSA-N 0.000 claims description 2
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims description 2
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 claims description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 2
- RYYUUQPLFHRZOY-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1OC1=CC=C(N)C=C1 RYYUUQPLFHRZOY-UHFFFAOYSA-N 0.000 claims description 2
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 claims description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 claims description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims 1
- 229910052810 boron oxide Inorganic materials 0.000 claims 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 claims 1
- 239000002243 precursor Substances 0.000 abstract description 10
- 239000010408 film Substances 0.000 description 131
- 229920005575 poly(amic acid) Polymers 0.000 description 119
- 239000002253 acid Substances 0.000 description 51
- 239000006185 dispersion Substances 0.000 description 48
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 42
- 239000002904 solvent Substances 0.000 description 40
- 229920000642 polymer Polymers 0.000 description 35
- 239000007787 solid Substances 0.000 description 34
- 239000011230 binding agent Substances 0.000 description 30
- 239000010410 layer Substances 0.000 description 30
- 238000001723 curing Methods 0.000 description 29
- 239000000463 material Substances 0.000 description 25
- 239000000178 monomer Substances 0.000 description 20
- 239000000843 powder Substances 0.000 description 19
- 150000004706 metal oxides Chemical class 0.000 description 16
- 229910044991 metal oxide Inorganic materials 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 13
- 238000011068 loading method Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 12
- 229920006254 polymer film Polymers 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 7
- 239000002002 slurry Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 125000006159 dianhydride group Chemical group 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 3
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- 239000003880 polar aprotic solvent Substances 0.000 description 3
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- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- FKASFBLJDCHBNZ-UHFFFAOYSA-N 1,3,4-oxadiazole Chemical compound C1=NN=CO1 FKASFBLJDCHBNZ-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
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- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 2
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- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
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- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
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- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
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- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
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- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
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- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 1
- ZQQOGBKIFPCFMJ-UHFFFAOYSA-N 2-(trifluoromethyl)benzene-1,4-diamine Chemical compound NC1=CC=C(N)C(C(F)(F)F)=C1 ZQQOGBKIFPCFMJ-UHFFFAOYSA-N 0.000 description 1
- BIXGISJFDUHZEB-UHFFFAOYSA-N 2-[9,9-bis(4-methylphenyl)fluoren-2-yl]-9,9-bis(4-methylphenyl)fluorene Chemical compound C1=CC(C)=CC=C1C1(C=2C=CC(C)=CC=2)C2=CC(C=3C=C4C(C5=CC=CC=C5C4=CC=3)(C=3C=CC(C)=CC=3)C=3C=CC(C)=CC=3)=CC=C2C2=CC=CC=C21 BIXGISJFDUHZEB-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/012,475 US20060124693A1 (en) | 2004-12-15 | 2004-12-15 | Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006169533A true JP2006169533A (ja) | 2006-06-29 |
| JP2006169533A5 JP2006169533A5 (enExample) | 2009-01-29 |
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Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060124693A1 (enExample) |
| EP (1) | EP1672008A1 (enExample) |
| JP (1) | JP2006169533A (enExample) |
| KR (1) | KR20060067878A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2009056792A (ja) * | 2007-08-31 | 2009-03-19 | Mortech Corp | 積層板およびその製造方法 |
| JP2010084072A (ja) * | 2008-10-01 | 2010-04-15 | Mitsui Chemicals Inc | 接着樹脂組成物、およびそれを含む積層体 |
| JP2010137571A (ja) * | 2008-12-09 | 2010-06-24 | Mortech Corp | ポリイミド積層板の製造方法 |
| WO2010131657A1 (ja) * | 2009-05-11 | 2010-11-18 | 三菱化学株式会社 | 液晶性ポリイミド、及びこれを含有する液晶性樹脂組成物、並びに半導体素子用樹脂膜 |
| WO2011001698A1 (ja) * | 2009-07-03 | 2011-01-06 | 三井化学株式会社 | 樹脂組成物、それを含む積層体、半導体装置およびフィルム |
| JP5235211B2 (ja) * | 2008-03-06 | 2013-07-10 | 新日鉄住金化学株式会社 | フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム |
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| TWI417418B (zh) * | 2005-04-28 | 2013-12-01 | Kaneka Corp | 鍍敷用材料及其利用 |
| US20070232734A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto |
| US20070231588A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Capacitive polyimide laminate |
| KR101292993B1 (ko) * | 2007-11-20 | 2013-08-02 | 코오롱인더스트리 주식회사 | 폴리이미드 수지와 이를 이용한 액정 배향막 및 필름 |
| EP2325000B1 (en) * | 2008-09-08 | 2013-05-29 | Nippon Steel & Sumikin Chemical Co., Ltd. | Highly heat conductive polyimide film, highly heat conductive metal-clad laminate and method for producing same |
| KR101064816B1 (ko) * | 2009-04-03 | 2011-09-14 | 주식회사 두산 | 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판 |
| CN102152539B (zh) * | 2010-11-11 | 2013-08-14 | 广东生益科技股份有限公司 | 铝基覆铜板的连续化生产方法及其连续化生产线 |
| CN102673047A (zh) * | 2012-05-28 | 2012-09-19 | 珠海亚泰电子科技有限公司 | 导热无卤无胶覆铜箔的制作方法 |
| CN102806722A (zh) * | 2012-08-06 | 2012-12-05 | 广东生益科技股份有限公司 | 二层法单面挠性覆铜板 |
| CN102774077B (zh) * | 2012-08-06 | 2016-02-17 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板及其制作方法 |
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| US11046051B2 (en) * | 2015-12-01 | 2021-06-29 | Materion Corporation | Metal-on-ceramic substrates |
| TWI618980B (zh) * | 2017-06-30 | 2018-03-21 | 律勝科技股份有限公司 | 導熱型感光性樹脂 |
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| US3496139A (en) * | 1966-12-20 | 1970-02-17 | Gen Electric | Epoxy resins with reaction product of a polysiloxane and an amine |
| US3803085A (en) * | 1972-12-29 | 1974-04-09 | Gen Electric | Method for making polyetherimides |
| US4040874A (en) * | 1975-08-04 | 1977-08-09 | General Electric Company | Semiconductor element having a polymeric protective coating and glass coating overlay |
| US4447670A (en) * | 1982-04-09 | 1984-05-08 | Westinghouse Electric Corp. | High-current cryogenic leads |
| US4574879A (en) * | 1984-02-29 | 1986-03-11 | The Bergquist Company | Mounting pad for solid-state devices |
| US4810563A (en) * | 1986-03-14 | 1989-03-07 | The Bergquist Company | Thermally conductive, electrically insulative laminate |
| US4808686A (en) * | 1987-06-18 | 1989-02-28 | General Electric Company | Silicone-polyimides, and method for making |
| US5208031A (en) * | 1989-06-06 | 1993-05-04 | Kelly Patrick D | Sexual lubricants containing zinc as an anti-viral agent |
| JPH0832591B2 (ja) * | 1989-10-11 | 1996-03-29 | 日本ピラー工業株式会社 | 複合材 |
| US5260413A (en) * | 1990-02-05 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Coated, heat-sealable aromatic polyimide film having superior compressive strength |
| EP0474054B1 (en) * | 1990-08-27 | 1995-12-06 | E.I. Du Pont De Nemours And Company | Flexible multi-layer polyimide film laminates and preparation thereof |
| US5331040A (en) * | 1992-10-26 | 1994-07-19 | E. I. Du Pont De Nemours And Company | Adhesive composition with functional filler |
| US5302652A (en) * | 1992-12-15 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Process for preparing a pigmented polyimide shaped article |
| WO1997001437A1 (en) * | 1995-06-28 | 1997-01-16 | Fraivillig Materials Company | Circuit board laminates and method of making |
| US5893498A (en) * | 1997-12-17 | 1999-04-13 | Aronson; Gina E. | Socket retaining utility belt |
| KR100256957B1 (ko) * | 1997-12-26 | 2000-05-15 | 윤종용 | 코드분할 다중접속 시스템에서 동일셀내 주파수간 하드핸드오프 방법 |
| US6207364B1 (en) * | 1998-04-21 | 2001-03-27 | Konica Corporation | Thermally developable material |
| US20020092163A1 (en) * | 1999-01-05 | 2002-07-18 | James Fraivillig | Mounting a flexible printed circuit to a heat sink |
| US6710456B1 (en) * | 2000-08-31 | 2004-03-23 | Micron Technology, Inc. | Composite interposer for BGA packages |
| JP3895125B2 (ja) * | 2001-04-12 | 2007-03-22 | 日東電工株式会社 | 補強板付フレキシブルプリント回路板 |
| US6410971B1 (en) * | 2001-07-12 | 2002-06-25 | Ferrotec (Usa) Corporation | Thermoelectric module with thin film substrates |
-
2004
- 2004-12-15 US US11/012,475 patent/US20060124693A1/en not_active Abandoned
-
2005
- 2005-10-31 EP EP05023744A patent/EP1672008A1/en not_active Withdrawn
- 2005-12-14 KR KR1020050123050A patent/KR20060067878A/ko not_active Withdrawn
- 2005-12-15 JP JP2005362032A patent/JP2006169533A/ja not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009056792A (ja) * | 2007-08-31 | 2009-03-19 | Mortech Corp | 積層板およびその製造方法 |
| JP5235211B2 (ja) * | 2008-03-06 | 2013-07-10 | 新日鉄住金化学株式会社 | フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム |
| TWI454375B (zh) * | 2008-03-06 | 2014-10-01 | Nippon Steel & Sumikin Chem Co | Laminates for flexible substrates and thermally conductive polyimide films |
| JP2010084072A (ja) * | 2008-10-01 | 2010-04-15 | Mitsui Chemicals Inc | 接着樹脂組成物、およびそれを含む積層体 |
| JP2010137571A (ja) * | 2008-12-09 | 2010-06-24 | Mortech Corp | ポリイミド積層板の製造方法 |
| WO2010131657A1 (ja) * | 2009-05-11 | 2010-11-18 | 三菱化学株式会社 | 液晶性ポリイミド、及びこれを含有する液晶性樹脂組成物、並びに半導体素子用樹脂膜 |
| JP2011122130A (ja) * | 2009-05-11 | 2011-06-23 | Mitsubishi Chemicals Corp | 液晶性ポリイミド、及びこれを含有する液晶性樹脂組成物、並びに半導体素子用樹脂膜 |
| US8415451B2 (en) | 2009-05-11 | 2013-04-09 | Mitsubishi Chemical Corporation | Liquid crystal polyimide, liquid crystal resin composition containing same, and resin film for semiconductor elements |
| WO2011001698A1 (ja) * | 2009-07-03 | 2011-01-06 | 三井化学株式会社 | 樹脂組成物、それを含む積層体、半導体装置およびフィルム |
| JP5562334B2 (ja) * | 2009-07-03 | 2014-07-30 | 三井化学株式会社 | 樹脂組成物、それを含む積層体、半導体装置およびフィルム |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060067878A (ko) | 2006-06-20 |
| EP1672008A1 (en) | 2006-06-21 |
| US20060124693A1 (en) | 2006-06-15 |
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